Abstract: A system for controlling an axial movement of an article is presented. The system comprises a support stage assembly and a spring suspension arrangement mounted on the support stage assembly. The spring suspension arrangement comprises first and second assemblies arranged in a coaxial relationship one inside the other. The first assembly is attached to the support stage assembly. The second assembly serves for supporting an article-carrying member and is driven for movement along the axis with respect to the first assembly. The outer one of the first and second assemblies is configured to define two spaced-apart parallel planes perpendicular to said axis. The first and second assemblies are attached to each other by first and second membrane-like members arranged in a spaced-apart parallel relationship along said axis.

Abstract: A system for controlling an axial movement of an article is presented. The system comprises a support stage assembly and a spring suspension arrangement mounted on the support stage assembly. The spring suspension arrangement comprises first and second assemblies arranged in a coaxial relationship one inside the other. The first assembly is attached to the support stage assembly. The second assembly serves for supporting an article-carrying member and is driven for movement along the axis with respect to the first assembly. The outer one of the first and second assemblies is configured to define two spaced-apart parallel planes perpendicular to said axis. The first and second assemblies are attached to each other by first and second membrane-like members arranged in a spaced-apart parallel relationship along said axis.

Abstract: An apparatus is provided for supporting semiconductor wafer in a wafer processing system. The apparatus comprises at least two wafer support assemblies, defining respectively at least two wafer support levels and being mounted between opposing support beams; one or more supporting bases connected to or integral with each of the wafer support assemblies; and a motion unit coupled to the support beams.

Abstract: An apparatus is provided for supporting semiconductor wafer in a wafer processing system. The apparatus comprises at least two wafer support assemblies, defining respectively at least two wafer support levels and being mounted between opposing support beams; one or more supporting bases connected to or integral with each of the wafer support assemblies; and a motion unit coupled to the support beams.

Abstract: A system for controlling an axial movement of an article is presented. The system comprises a support stage assembly and a spring suspension arrangement mounted on the support stage assembly. The spring suspension arrangement comprises first and second assemblies arranged in a coaxial relationship one inside the other. The first assembly is attached to the support stage assembly. The second assembly serves for supporting an article-carrying member and is driven for movement along the axis with respect to the first assembly. The outer one of the first and second assemblies is configured to define two spaced-apart parallel planes perpendicular to said axis. The first and second assemblies are attached to each other by first and second membrane-like members arranged in a spaced-apart parallel relationship along said axis.

Abstract: An apparatus is provided for supporting semiconductor wafer in a wafer processing system. The apparatus comprises at least two wafer support assemblies, defining respectively at least two wafer support levels and being mounted between opposing support beams; one or more supporting bases connected to or integral with each of the wafer support assemblies; and a motion unit coupled to the support beams.

Abstract: A processing unit for processing at least one semiconductor wafer includes a processing station for processing the wafer, a measuring station for measuring the at least one wafer, a robot for moving the wafer between the processing and measuring stations, a wafer handling system and a buffer station. The wafer handling system operates in conjunction with the measuring station and moves the wafer to and from a measuring location on the measuring unit. The buffer station is associated with the wafer handling system and receives measured and unmeasured wafers thereby to enable the robot to arrive at and leave the measuring station with at least one wafer thereon.

Abstract: A buffer station for an article handling system, the handling system having a general path along which it moves when handling the article, the buffer station including at least two supporting assemblies including supporting elements forming a supporting plane each capable of supporting an article within the supporting plane and located so as to support the article within the general path, at least two receptacles for liquid in which the at least two supporting assemblies are disposed, and at least two drivers associated with the at least two supporting assemblies and the receptacles for shifting them in and out of the general path.

Abstract: A monitoring tool for monitoring an article in a wet environment, the monitoring tool including a monitoring station having an optical unit, a liquid holding unit for receiving the article, and a window, through which at least a portion of the article is viewable by the optical unit, a buffer station associated with the monitoring station having a plurality of supporting assemblies for receiving the article before and after being monitored, wherein at least one of the supporting assemblies includes a liquid receptacle for holding the article therein, and a gripping unit operating in conjunction with the monitoring station for moving the article from the buffer station to the liquid holding unit of the monitoring station.

Abstract: An optical system is disclosed for the inspection of wafers during polishing which also includes a measurement system for measuring the thickness of the wafer's top layer. The optical system views the wafer through a window and includes a gripping system, which places the wafer in a predetermined viewing location while maintaining the patterned surface completely under water. The optical system also includes a pull-down unit for pulling the measurement system slightly below the horizontal prior to the measurement and returns the measuring system to the horizontal afterwards.

Abstract: A monitoring tool for monitoring an article in a wet environment, the monitoring tool including a monitoring station having an optical unit, a liquid holding unit for receiving the article, and a window, through which at least a portion of the article is viewable by the optical unit, a buffer station associated with the monitoring station having a plurality of supporting assemblies for receiving the article before and after being monitored, wherein at least one of the supporting assemblies includes a liquid receptacle for holding the article therein, and a gripping unit operating in conjunction with the monitoring station for moving the article from the buffer station to the liquid holding unit of the monitoring station.

Abstract: A processing unit for processing at least one semiconductor wafer includes a processing station for processing the wafer, a measuring station for measuring the at least one wafer, a robot for moving the wafer between the processing and measuring stations, a wafer handling system and a buffer station. The wafer handling system operates in conjunction with the measuring station and moves the wafer to and from a measuring location on the measuring unit. The buffer station is associated with the wafer handling system and receives measured and unmeasured wafers thereby to enable the robot to arrive at and leave the measuring station with at least one wafer thereon.

Abstract: A buffer station for an article handling system, the handling system having a general path along which it moves when handling the article, the buffer station including at least two supporting assemblies including supporting elements forming a supporting plane each capable of supporting an article within the supporting plane and located so as to support the article within the general path, at least two receptacles for liquid in which the at least two supporting assemblies are disposed, and at least two drivers associated with the at least two supporting assemblies and the receptacles for shifting them in and out of the general path.

Abstract: A processing unit for processing at least one semiconductor wafer includes a processing station for processing the wafer, a measuring station for measuring the at least one water, a robot for moving the wafer between the processing and measuring stations, a wafer handling system and a buffer station. The wafer handling system operates in conjunction with the measuring station and moves the wafer to and from a measuring location on the measuring unit. The buffer station is associated with the wafer handling system and receives measured and unmeasured wafers thereby to enable the robot to arrive at and leave the measuring station with at least one wafer thereon.

Abstract: An optical system is disclosed for the inspection of wafers during polishing which also includes a measurement system for measuring the thickness of the wafer's top layer. The optical system views the wafer through a window and includes a gripping system, which places the wafer in a predetermined viewing location while maintaining the patterned surface completely under water. The optical system also includes a pull-down unit for pulling the measurement system slightly below the horizontal prior to the measurement and returns the measuring system to the horizontal afterwards.