Patents by Inventor Eran Erdal

Eran Erdal has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Algorithm for 3D reconstruction of diagonally cut semiconductor logic structure
    Patent number: 12784364
    Abstract: A method for generating a 3D reconstruction of structural elements of a wafer including: obtaining a 2D image of a top view of the plurality of structural elements, sectioned diagonally in a compound angle allowing 3D volumetric sampling, such that each of the plurality of structural elements is cut at a different height thereof, and generating a representative 3D reconstruction of the structural elements, based on the images.
    Type: Grant
    Filed: June 25, 2024
    Date of Patent: November 3, 2026
    Assignee: Applied Materials Israel Ltd.
    Inventors: Guy Shwartz, Ohr Lahad, Eran Erdal, Ido Almog, Lior Yaron, Ching-Hung Lai, Ron Bar-Or
  • ALGORITHM FOR 3D RECONSTRUCTION OF DIAGONALLY CUT SEMICONDUCTOR LOGIC STRUCTURE
    Publication number: 20250391114
    Abstract: A method for generating a 3D reconstruction of structural elements of a wafer including: obtaining a 2D image of a top view of the plurality of structural elements, sectioned diagonally in a compound angle allowing 3D volumetric sampling, such that each of the plurality of structural elements is cut at a different height thereof, and generating a representative 3D reconstruction of the structural elements, based on the images.
    Type: Application
    Filed: June 25, 2024
    Publication date: December 25, 2025
    Applicant: Applied Materials Israel Ltd.
    Inventors: Guy Shwartz, Ohr Lahad, Eran Erdal, Ido Almog, Lior Yaron, Ching-Hung Lai, Ron Bar-Or