Abstract: Processes for laminating a conductive-lubricant coated Printed Circuit Board (PCB) are disclosed. An example laminated PCB may include a lamination stack that may further include a core, an adhesive layer, and at least one graphene-metal structure or at least one hexagonal Boron Nitride metal (h-BN-metal) structure. The materials of the PCB may change in accordance with the invention described herein, including the materials of the core, the materials of the conductive-lubricant coatings, or the metal layers of the conductive-lubricant-metal structures. Doping processes for each change in materials used are also described herein. The conductive-lubricant of the conductive-lubricant-metal structure will promote high frequency performance and heat management within the PCB. Furthermore, a removal process of those materials post-lamination is described herein to promote protection of materials and subsequent removal of protective layers without breakage or tearing.

Abstract: Communication apparatus includes multiple ports configured to serve as ingress ports and egress ports for connection to a packet data network. A memory is coupled to the ports and configured to contain both respective input buffers allocated to the ingress ports and a shared buffer holding data packets for transmission in multiple queues via the egress ports. Control logic is configured to monitor an overall occupancy level of the memory, and when a data packet is received through an ingress port having an input buffer that is fully occupied while the overall occupancy level of the memory is below a specified maximum, to allocate additional space in the memory to the input buffer and to accept the received data packet into the additional space.

Abstract: Communication apparatus includes multiple ports configured to serve as ingress ports and egress ports for connection to a packet data network. A single memory array is coupled to the ports and configured to contain both a respective headroom allocation for each ingress port and a shared buffer holding data packets for transmission in multiple queues via the egress ports. Control logic is configured to adjustably allocate to each ingress port a respective volume of memory within the single memory array to serve as the respective headroom allocation, and to queue the data packets in the multiple queues in the single memory array for transmission through the egress ports.

Abstract: Communication apparatus includes multiple ports configured to serve as ingress ports and egress ports for connection to a packet data network. A memory is coupled to the ports and configured to contain both respective input buffers allocated to the ingress ports and a shared buffer holding data packets for transmission in multiple queues via the egress ports. Control logic is configured to monitor an overall occupancy level of the memory, and when a data packet is received through an ingress port having an input buffer that is fully occupied while the overall occupancy level of the memory is below a specified maximum, to allocate additional space in the memory to the input buffer and to accept the received data packet into the additional space.

Abstract: Communication apparatus includes multiple ports configured to serve as ingress ports and egress ports for connection to a packet data network. A single memory array is coupled to the ports and configured to contain both a respective headroom allocation for each ingress port and a shared buffer holding data packets for transmission in multiple queues via the egress ports. Control logic is configured to adjustably allocate to each ingress port a respective volume of memory within the single memory array to serve as the respective headroom allocation, and to queue the data packets in the multiple queues in the single memory array for transmission through the egress ports.