Abstract: Pattern transfer printing (PTP) systems and methods are provided to improve the quality, accuracy and throughput of pattern transfer printing. PTP systems comprise a tape handling unit for handling a tape with pattern transfer sheets sections and for controllably delivering the pattern transfer sheets one-by-one for paste filling and consecutively for pattern transfer, with the tape moving from an unwinder roll to a re-winding roll. PTP systems further comprise a paste filling unit which enables continuous paste filling using a supporting counter roll opposite to the paste filling head, a wafer handling unit controllably delivering wafers for the pattern transfer in a parallelized manner that increases throughput, a paste transfer unit with enhanced accuracy and efficiency due to exact monitoring and wafer alignment, as well as a print quality control unit.

Abstract: Pattern transfer printing (PTP) systems and methods are provided to improve the quality, accuracy and throughput of pattern transfer printing. PTP systems comprise a tape handling unit for handling a tape with pattern transfer sheets sections and for controllably delivering the pattern transfer sheets one-by-one for paste filling and consecutively for pattern transfer, with the tape moving from an unwinder roll to a re-winding roll. PTP systems further comprise a paste filling unit which enables continuous paste filling using a supporting counter roll opposite to the paste filling head, a wafer handling unit controllably delivering wafers for the pattern transfer in a parallelized manner that increases throughput, a paste transfer unit with enhanced accuracy and efficiency due to exact monitoring and wafer alignment, as well as a print quality control unit.

Abstract: Dynamic pattern transfer printing systems and method are provided, which decouple the design of the trench patterns on a source substrate for pattern transfer printing, from the resulting metallic paste lines patterns transferred to a receiving substrate, such as PV cells. The receiving substrate may be moved forward (along the scanning direction of the laser illumination used to transfer the paste from the trenches onto the receiving substrate) to reduce the pattern pitch with respect to the source substrate, and/or the receiving substrate may be moved backward (against the scanning direction) to increase the pattern pitch with respect to the source substrate. For example, dynamic pattern transfer printing may be used to accommodate different widths of the substrates for more effective pattern transfer, and/or to enable one-to-many pattern transfer technologies with high wafer throughput. Also, pattern transfer sheet with separate multiple groups of trenches are provided.