Abstract: An apparatus for use in wiring a multi-configurable electrical device during installation thereof at point of operation includes a substrate defining a plurality of tabs separated by at least one gap. The tabs and the gap or gaps are arranged such that when the substrate is positioned proximate the electrical device, the tabs cover a first group of one or more wiring terminals of the electrical device and the gap or gaps provides access to a second group of one or more wiring terminals of the electrical device in accordance with a first wiring configuration of a plurality of possible wiring configurations. According to one exemplary embodiment, the substrate is generally rectangular and non-conductive. Visible indicia may be optionally disposed on the substrate (e.g., by adhering a label containing the indicia to the substrate) to provide information relating to wiring the electrical device according to the first wiring configuration.

Abstract: An apparatus for use in wiring a multi-configurable electrical device during installation thereof at point of operation includes a substrate defining a plurality of tabs separated by at least one gap. The tabs and the gap or gaps are arranged such that when the substrate is positioned proximate the electrical device, the tabs cover a first group of one or more wiring terminals of the electrical device and the gap or gaps provides access to a second group of one or more wiring terminals of the electrical device in accordance with a first wiring configuration of a plurality of possible wiring configurations. According to one exemplary embodiment, the substrate is generally rectangular and non-conductive. Visible indicia may be optionally disposed on the substrate (e.g., by adhering a label containing the indicia to the substrate) to provide information relating to wiring the electrical device according to the first wiring configuration.

Abstract: A very thin, small outline, thermally enhanced semiconductor package includes a leadframe that is coined to form locking features on an exposed die pad and on a plurality of extremely narrow, closely spaced leads. The coined features improve the mechanical locking between the leadframe and the plastic body of the package to increase their resistance to delamination and subsequent penetration by moisture, and enable reliable wire bonds to be made to the otherwise extremely narrow leads.

Abstract: A very thin, small outline, thermally enhanced semiconductor package includes a leadframe that is coined to form locking features on an exposed die pad and on a plurality of extremely narrow, closely spaced leads. The coined features improve the mechanical locking between the leadframe and the plastic body of the package to increase their resistance to delamination and subsequent penetration by moisture, and enable reliable wire bonds to be made to the otherwise extremely narrow leads.