Patents by Inventor Erh-Ju LIN

Erh-Ju LIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240038698
    Abstract: A package structure is provided. The package structure includes a substrate, a conductive pad, and a conductive wire. The conductive pad is disposed over the substrate. The conductive wire includes an end portion connected to the conductive pad, wherein a grain arrangement of the end portion is distinct from a grain arrangement of the conductive pad.
    Type: Application
    Filed: June 6, 2023
    Publication date: February 1, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Erh-Ju LIN