Abstract: A heat sink that radiates heat via the metal shell of the electronic device is provided. The upper portion of the heat sink is formed by a solid aluminium block boss, and the lower portion of the heat sink is formed by an aluminium substrate, wherein at least one fin is configured on either side of the solid aluminium block boss.

Abstract: A heat radiation shielding device comprising a heat sink is disclosed, comprising a substrate with a conductive base and cooling fins configured on the substrate; a conductive frame, fixed on periphery of the base of the substrate of the heat sink, forming a hood structure closed on three sides and open on one side with the substrate of the heat sink; and a ground element, configured around the electronic components on the circuit board, where the conductive frame is conductive frame on the open side of the hood structure, and engaged to the ground element, forming an electric connection with the circuit board.