Patents by Inventor Eri MASUDA

Eri MASUDA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250197546
    Abstract: A polymer includes a main chain polymer structure and a side chain polymer structure, in which the side chain polymer structure contains a constitutional unit derived from an alkyl (meth)acrylate (a) having an alkyl group having 11 to 30 carbon atoms, and a mass average molecular weight of the polymer is 90000 or less.
    Type: Application
    Filed: March 5, 2025
    Publication date: June 19, 2025
    Applicant: MITSUBISHI CHEMICAL CORPORATION
    Inventors: Hiroshi TOKUE, Kazunari MATSUMURA, Eri MASUDA
  • Publication number: 20250197547
    Abstract: A polymer includes a main chain polymer structure and a side chain polymer structure, in which the side chain polymer structure contains a constitutional unit derived from an alkyl (meth)acrylate (a) having an alkyl group having 11 to 30 carbon atoms, and at least one of the main chain polymer structure or the side chain polymer structure contains a constitutional unit derived from a (meth)acrylate (b) represented by General Formula (1).
    Type: Application
    Filed: March 6, 2025
    Publication date: June 19, 2025
    Applicant: MITSUBISHI CHEMICAL CORPORATION
    Inventors: Hiroshi TOKUE, Kazunari MATSUMURA, Eri MASUDA
  • Publication number: 20240417600
    Abstract: What is provided is an adhesive sheet in which a high level of both unevenness followability during bonding and shape holding power when not bonded is achieved and flexibility especially in a low-temperature environment is excellent. The adhesive sheet includes an adhesive layer formed from an adhesive composition containing a (meth)acrylic copolymer, in which (1) when the thickness is set to 0.7 to 1.0 mm, a strain (creep strain) by applying a pressure of 2 kPa at a temperature of 60° C. for 600 seconds is 1000% or more and 100000% or less, (2) in a holding power measurement in accordance with JIS-Z-0237 (ISO29863), a falling time when the adhesive sheet is adhered to a SUS plate with an area of 20 mm×20 mm and a load of 500 gf is applied in an atmosphere of 40° C. is 60 seconds or more, and (3) when the thickness is set to 0.7 to 1.0 mm, a storage shear modulus at ?20° C. (G? (?20° C.
    Type: Application
    Filed: September 13, 2022
    Publication date: December 19, 2024
    Applicant: MITSUBISHI CHEMICAL CORPORATION
    Inventors: Kohei HIROSE, Akifumi MATSUSHITA, Kouta TANIGUCHI, Eri MASUDA, Nobuaki KANAZAWA
  • Patent number: 11884813
    Abstract: There is provided an epoxy resin composition comprising a (meth)acrylic copolymer (A), an epoxy resin (B), and a curing agent (C), wherein the (meth)acrylic copolymer (A) has a constituent unit derived from a macromonomer (a) and a constituent unit derived from a vinyl monomer (b), and wherein a glass transition temperature (TgB) of a polymer obtained by polymerizing only the vinyl monomer (b) is 25° C. or less.
    Type: Grant
    Filed: March 2, 2020
    Date of Patent: January 30, 2024
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Eri Masuda, Junichi Nakamura, Kazuyoshi Odaka, Sora Tomita, Go Otani
  • Patent number: 11421065
    Abstract: Provided are an adhesive resin composition capable of forming an adhesive layer excellent in holding force, wet heat clouding resistance, and low corrosiveness; and an adhesive sheet. The adhesive resin composition includes a (meth)acrylic copolymer (A) having a constituent unit derived from a macromonomer (a) and a constituent unit derived from a vinyl monomer (b), in which the (meth)acrylic copolymer (A) has at least one of an amide bond and a radical polymerizable group.
    Type: Grant
    Filed: May 28, 2019
    Date of Patent: August 23, 2022
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Eri Masuda, Junichi Nakamura, Kazuyoshi Odaka, Hiroko Shinada
  • Publication number: 20200199352
    Abstract: There is provided an epoxy resin composition comprising a (meth)acrylic copolymer (A), an epoxy resin (B), and a curing agent (C), wherein the (meth)acrylic copolymer (A) has a constituent unit derived from a macromonomer (a) and a constituent unit derived from a vinyl monomer (b), and wherein a glass transition temperature (TgB) of a polymer obtained by polymerizing only the vinyl monomer (b) is 25° C. or less.
    Type: Application
    Filed: March 2, 2020
    Publication date: June 25, 2020
    Applicant: Mitsubishi Chemical Corporation
    Inventors: Eri MASUDA, Junichi NAKAMURA, Kazuyoshi ODAKA, Sora TOMITA, Go OTANI
  • Patent number: 10479855
    Abstract: A (meth)acrylic acid copolymer (A) having a weight average molecular weight of 1000 to 1,000,000, and in which when the half-width of the primary scatter peak when measured by small angle X-ray scattering is defined as X, 0.12<X, is used as an adhesive. The (meth)acrylic copolymer (A) is obtained by polymerizing a monomer mixture containing a macromonomer (a) having a number average molecular weight of 500-100,000, and a vinyl monomer (b). The adhesive has sufficient holding force and adhesive force, and the occurrence of adhesive deposit can be prevented when peeled off.
    Type: Grant
    Filed: June 1, 2016
    Date of Patent: November 19, 2019
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Eri Masuda, Junichi Nakamura, Hiroko Shinada, Takayuki Kobayashi
  • Publication number: 20190276717
    Abstract: Provided are an adhesive resin composition capable of forming an adhesive layer excellent in holding force, wet heat clouding resistance, and low corrosiveness; and an adhesive sheet. The adhesive resin composition includes a (meth)acrylic copolymer (A) having a constituent unit derived from a macromonomer (a) and a constituent unit derived from a vinyl monomer (b), in which the (meth)acrylic copolymer (A) has at least one of an amide bond and a radical polymerizable group.
    Type: Application
    Filed: May 28, 2019
    Publication date: September 12, 2019
    Applicant: Mitsubishi Chemical Corporation
    Inventors: Eri MASUDA, Junichi NAKAMURA, Kazuyoshi ODAKA, Hiroko SHINADA
  • Publication number: 20180142055
    Abstract: A (meth)acrylic acid copolymer (A) having a weight average molecular weight of 1000 to 1,000,000, and in which when the half-width of the primary scatter peak when measured by small angle X-ray scattering is defined as X, 0.12<X, is used as an adhesive. The (meth)acrylic copolymer (A) is obtained by polymerizing a monomer mixture containing a macromonomer (a) having a number average molecular weight of 500-100,000, and a vinyl monomer (b). The adhesive has sufficient holding force and adhesive force, and the occurrence of adhesive deposit can be prevented when peeled off.
    Type: Application
    Filed: June 1, 2016
    Publication date: May 24, 2018
    Applicant: Mitsubishi Chemical Corporation
    Inventors: Eri MASUDA, Junichi NAKAMURA, Hiroko SHINADA, Takayuki KOBAYASHI