Patents by Inventor Eri Nakazawa

Eri Nakazawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11154902
    Abstract: To provide: a transparent conductive substrate containing silver nanowires and having excellent optical characteristics, electrical characteristics and light resistance; and a method for producing the same. A transparent conductive substrate characterized by comprising: a substrate; a transparent conductive film formed on at least one principal surface of the substrate, and containing a binder resin and conductive fibers; and a protective film formed on the transparent conductive film, wherein the thermal decomposition starting temperature of the binder resin is 210° C. or higher, and the protective film is a thermal-cured film obtained using a thermosetting resin.
    Type: Grant
    Filed: November 29, 2017
    Date of Patent: October 26, 2021
    Assignee: SHOWA DENKO K.K.
    Inventors: Masahiko Toba, Eri Nakazawa, Shigeru Yamaki
  • Patent number: 10995235
    Abstract: A composition for a protective film for electroconductive patterns, including: (A) a polyurethane containing a carboxyl group; (B) an epoxy compound; (C) a curing accelerator; and (D) a solvent, wherein the percentage of the solvent (D) contained is from 95.0% to 99.9% by mass, and the solvent (D) contains (D1) a solvent containing a hydroxyl group and having a boiling point in excess of 100° C., and (D2) a solvent having a boiling point that does not exceed 100° C., wherein the content of the solvent (D2) having a boiling point that does not exceed 100° C. is 30% to less than 70% by mass of total solvent in total. The composition can be cured by heating at a temperature not exceeding 100° C. for a heating time not exceeding 10 minutes.
    Type: Grant
    Filed: November 29, 2017
    Date of Patent: May 4, 2021
    Assignee: SHOWA DENKO K.K.
    Inventors: Masahiko Toba, Eri Nakazawa, Shigeru Yamaki
  • Publication number: 20190388933
    Abstract: To provide: a transparent conductive substrate containing silver nanowires and having excellent optical characteristics, electrical characteristics and light resistance; and a method for producing the same. A transparent conductive substrate characterized by comprising: a substrate; a transparent conductive film formed on at least one principal surface of the substrate, and containing a binder resin and conductive fibers; and a protective film formed on the transparent conductive film, wherein the thermal decomposition starting temperature of the binder resin is 210° C. or higher, and the protective film is a thermal-cured film obtained using a thermosetting resin.
    Type: Application
    Filed: November 29, 2017
    Publication date: December 26, 2019
    Applicant: SHOW A DENKO K.K.
    Inventors: Masahiko TOBA, Eri NAKAZAWA, Shigeru YAMAKI
  • Publication number: 20190344597
    Abstract: A relief printing original plate for rotary letterpress printing wherein at least an adhesive layer, a photosensitive resin layer and a cover film are successively layered on a support, wherein the photosensitive resin layer contains at least a synthetic rubber-based polymer, a photopolymerizable unsaturated compound and a photopolymerization initiator, and Shore A hardness of a surface of the photosensitive resin layer after photo-curing is 80 to 95. Preferably, the synthetic rubber-based polymer is a hydrophobic polymer obtained from a water-dispersible latex having a weight-average gelation degree of 50 to 80%. Preferably, the photosensitive resin layer contains 20 to 70% by mass of the synthetic rubber-based polymer. The relief printing original plate is suitably used for a rotary printing machine of a center drum type.
    Type: Application
    Filed: July 29, 2019
    Publication date: November 14, 2019
    Applicant: TOYOBO CO., LTD.
    Inventors: Eri Nakazawa, Masahiko Nakamori
  • Publication number: 20190330493
    Abstract: A composition for a protective film for electroconductive patterns, including: (A) a polyurethane containing a carboxyl group; (B) an epoxy compound; (C) a curing accelerator; and (D) a solvent, wherein the percentage of the solvent (D) contained is from 95.0% to 99.9% by mass, and the solvent (D) contains (D1) a solvent containing a hydroxyl group and having a boiling point in excess of 100° C., and (D2) a solvent having a boiling point that does not exceed 100° C., wherein the content of the solvent (D2) having a boiling point that does not exceed 100° C. is 30% to less than 70% by mass of total solvent in total. The composition can be cured by heating at a temperature not exceeding 100° C. for a heating time not exceeding 10 minutes.
    Type: Application
    Filed: November 29, 2017
    Publication date: October 31, 2019
    Applicant: SHOWA DENKO K.K.
    Inventors: Masahiko TOBA, Eri NAKAZAWA, Shigeru YAMAKI
  • Publication number: 20190061406
    Abstract: A relief printing original plate for rotary letterpress printing wherein at least an adhesive layer, a photosensitive resin layer and a cover film are successively layered on a support, wherein the photosensitive resin layer contains at least a synthetic rubber-based polymer, a photopolymerizable unsaturated compound and a photopolymerization initiator, and Shore A hardness of a surface of the photosensitive resin layer after photo-curing is 80 to 95. Preferably, the synthetic rubber-based polymer is a hydrophobic polymer obtained from a water-dispersible latex having a weight-average gelation degree of 50 to 80%. Preferably, the photosensitive resin layer contains 20 to 70% by mass of the synthetic rubber-based polymer. The relief printing original plate is suitably used for a rotary printing machine of a center drum type.
    Type: Application
    Filed: March 7, 2017
    Publication date: February 28, 2019
    Applicant: TOYOBO CO., LTD.
    Inventors: Eri Nakazawa, Masahiko Nakamori