Patents by Inventor Eric A. Borisch

Eric A. Borisch has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Synthetic three-dimensional magnetic resonance imaging
    Patent number: 11353530
    Abstract: Systems and methods for generating a three-dimensional image of an object from multiple two-dimensional images acquired using a magnetic resonance imaging (“MRI”) system are provided. The three-dimensional image has high spatial resolution in all three spatial dimensions. The multiple two-dimensional images can be acquired in one or more orientations (e.g., axial, coronal, sagittal, oblique). The in-plane resolution of these images can be several times finer than the through-plane resolution (i.e., the slice thickness). The images are Fourier transformed along their respective slice orientation direction and processed using the slice profile to generate a Fourier representation of the three-dimensional image with the target spatial resolution. Inverse Fourier transforming this Fourier representation generates the desired three-dimensional image.
    Type: Grant
    Filed: January 25, 2019
    Date of Patent: June 7, 2022
    Assignee: Mayo Foundation for Medical Education and Research
    Inventors: Stephen J. Riederer, Eric A. Borisch, Roger C. Grimm, Soudabeh Kargar
  • Synthetic Three-Dimensional Magnetic Resonance Imaging
    Publication number: 20210041517
    Abstract: Systems and methods for generating a three-dimensional image of an object from multiple two-dimensional images acquired using a magnetic resonance imaging (“MRI”) system are provided. The three-dimensional image has high spatial resolution in all three spatial dimensions. The multiple two-dimensional images can be acquired in one or more orientations (e.g., axial, coronal, sagittal, oblique). The in-plane resolution of these images can be several times finer than the through-plane resolution (i.e., the slice thickness). The images are Fourier transformed along their respective slice orientation direction and processed using the slice profile to generate a Fourier representation of the three- dimensional image with the target spatial resolution. Inverse Fourier transforming this Fourier representation generates the desired three-dimensional image.
    Type: Application
    Filed: January 25, 2019
    Publication date: February 11, 2021
    Inventors: Eric A. Borisch, Stephen J. Riederer, Roger C. Grimm, Soudabeh Kargar