Patents by Inventor Eric A. Browne

Eric A. Browne has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11594470
    Abstract: The present invention generally relates to a modular microjet cooler. The modular microjet cooler may be attached to a packaged heat generating device that is mounted on a printed circuit board. The modular microjet cooler has an inlet allowing supply fluid to be directed through microjet nozzles toward an impingement surface on the packaged device. The modular microjet cooler also has one or more outlets that allow exhaust fluid to be removed. The modular microjet cooler is attached to the device after it has been packaged. Further, the modular microjet cooler may be attached to the packaged device either before or after it is mounted to the printed circuit board.
    Type: Grant
    Filed: April 26, 2021
    Date of Patent: February 28, 2023
    Assignee: Massachesetts Institute of Technology
    Inventors: James Paul Smith, Bernard A. Malouin, Jr., Eric A. Browne
  • Patent number: 11322426
    Abstract: The present invention generally relates to a microjet array for use as a thermal management system for a heat generating device, such as an RF device. The microjet array is formed in a jet plate, which is attached directly to the substrate containing the heat generating device. Additional enhancing features are used to further improve the heat transfer coefficient above that inherently achieved by the array. Some of these enhancements may also have other functions, such as adding mechanical structure, electrical connectivity or pathways for waveguides. This technology enables higher duty cycles, higher power levels, increased component lifetime, and/or improved SWaP for RF devices operating in airborne, naval (surface and undersea), ground, and space environments. This technology serves as a replacement for existing RF device thermal management solutions, such as high-SWaP finned heat sinks and cold plates.
    Type: Grant
    Filed: December 21, 2020
    Date of Patent: May 3, 2022
    Assignee: Massachusetts Institute of Technology
    Inventors: Bernard A. Malouin, Jr., James Paul Smith, Eric A. Browne
  • Publication number: 20210265240
    Abstract: The present invention generally relates to a modular microjet cooler. The modular microjet cooler may be attached to a packaged heat generating device that is mounted on a printed circuit board. The modular microjet cooler has an inlet allowing supply fluid to be directed through microjet nozzles toward an impingement surface on the packaged device. The modular microjet cooler also has one or more outlets that allow exhaust fluid to be removed. The modular microjet cooler is attached to the device after it has been packaged. Further, the modular microjet cooler may be attached to the packaged device either before or after it is mounted to the printed circuit board.
    Type: Application
    Filed: April 26, 2021
    Publication date: August 26, 2021
    Inventors: James Paul Smith, Bernard A. Malouin, JR., Eric A. Browne
  • Patent number: 11018077
    Abstract: The present invention generally relates to a modular microjet cooler. The modular microjet cooler may be attached to a packaged heat generating device that is mounted on a printed circuit board. The modular microjet cooler has an inlet allowing supply fluid to be directed through microjet nozzles toward an impingement surface on the packaged device. The modular microjet cooler also has one or more outlets that allow exhaust fluid to be removed. The modular microjet cooler is attached to the device after it has been packaged. Further, the modular microjet cooler may be attached to the packaged device either before or after it is mounted to the printed circuit board.
    Type: Grant
    Filed: April 9, 2020
    Date of Patent: May 25, 2021
    Assignee: Massachusetts Institute of Technology
    Inventors: James Paul Smith, Bernard A. Malouin, Jr., Eric A. Browne
  • Publication number: 20210134703
    Abstract: The present invention generally relates to a microjet array for use as a thermal management system for a heat generating device, such as an RF device. The microjet array is formed in a jet plate, which is attached directly to the substrate containing the heat generating device. Additional enhancing features are used to further improve the heat transfer coefficient above that inherently achieved by the array. Some of these enhancements may also have other functions, such as adding mechanical structure, electrical connectivity or pathways for waveguides. This technology enables higher duty cycles, higher power levels, increased component lifetime, and/or improved SWaP for RF devices operating in airborne, naval (surface and undersea), ground, and space environments. This technology serves as a replacement for existing RF device thermal management solutions, such as high-SWaP finned heat sinks and cold plates.
    Type: Application
    Filed: December 21, 2020
    Publication date: May 6, 2021
    Inventors: Bernard A. Malouin, JR., James Paul Smith, Eric A. Browne
  • Patent number: 10903141
    Abstract: The present invention generally relates to a microjet array for use as a thermal management system for a heat generating device, such as an RF device. The microjet array is formed in a jet plate, which is attached directly to the substrate containing the heat generating device. Additional enhancing features are used to further improve the heat transfer coefficient above that inherently achieved by the array. Some of these enhancements may also have other functions, such as adding mechanical structure, electrical connectivity or pathways for waveguides. This technology enables higher duty cycles, higher power levels, increased component lifetime, and/or improved SWaP for RF devices operating in airborne, naval (surface and undersea), ground, and space environments. This technology serves as a replacement for existing RF device thermal management solutions, such as high-SWaP finned heat sinks and cold plates.
    Type: Grant
    Filed: December 12, 2019
    Date of Patent: January 26, 2021
    Assignee: Massachusetts Institute of Technology
    Inventors: Bernard A. Malouin, Jr., James Paul Smith, Eric A. Browne
  • Publication number: 20200312746
    Abstract: The present invention generally relates to a modular microjet cooler. The modular microjet cooler may be attached to a packaged heat generating device that is mounted on a printed circuit board. The modular microjet cooler has an inlet allowing supply fluid to be directed through microjet nozzles toward an impingement surface on the packaged device. The modular microjet cooler also has one or more outlets that allow exhaust fluid to be removed. The modular microjet cooler is attached to the device after it has been packaged. Further, the modular microjet cooler may be attached to the packaged device either before or after it is mounted to the printed circuit board.
    Type: Application
    Filed: April 9, 2020
    Publication date: October 1, 2020
    Inventors: James Paul Smith, Bernard A. Malouin, JR., Eric A. Browne
  • Publication number: 20200168526
    Abstract: The present invention generally relates to a microjet array for use as a thermal management system for a heat generating device, such as an RF device. The microjet array is formed in a jet plate, which is attached directly to the substrate containing the heat generating device. Additional enhancing features are used to further improve the heat transfer coefficient above that inherently achieved by the array. Some of these enhancements may also have other functions, such as adding mechanical structure, electrical connectivity or pathways for waveguides. This technology enables higher duty cycles, higher power levels, increased component lifetime, and/or improved SWaP for RF devices operating in airborne, naval (surface and undersea), ground, and space environments. This technology serves as a replacement for existing RF device thermal management solutions, such as high-SWaP finned heat sinks and cold plates.
    Type: Application
    Filed: December 12, 2019
    Publication date: May 28, 2020
    Inventors: Bernard A. Malouin, JR., James Paul Smith, Eric A. Browne
  • Patent number: 10665529
    Abstract: The present invention generally relates to a modular microjet cooler. The modular microjet cooler may be attached to a packaged heat generating device that is mounted on a printed circuit board. The modular microjet cooler has an inlet allowing supply fluid to be directed through microjet nozzles toward an impingement surface on the packaged device. The modular microjet cooler also has one or more outlets that allow exhaust fluid to be removed. The modular microjet cooler is attached to the device after it has been packaged. Further, the modular microjet cooler may be attached to the packaged device either before or after it is mounted to the printed circuit board.
    Type: Grant
    Filed: July 19, 2018
    Date of Patent: May 26, 2020
    Assignee: Massachusetts Institute of Technology
    Inventors: James Paul Smith, Bernard A. Malouin, Jr., Eric A. Browne
  • Patent number: 10651112
    Abstract: The present invention generally relates to a microjet array for use as a thermal management system for a heat generating device, such as an RF device. The microjet array is formed in a jet plate, which is attached directly to the substrate containing the heat generating device. Additional enhancing features are used to further improve the heat transfer coefficient above that inherently achieved by the array. Some of these enhancements may also have other functions, such as adding mechanical structure, electrical connectivity or pathways for waveguides. This technology enables higher duty cycles, higher power levels, increased component lifetime, and/or improved SWaP for RF devices operating in airborne, naval (surface and undersea), ground, and space environments. This technology serves as a replacement for existing RF device thermal management solutions, such as high-SWaP finned heat sinks and cold plates.
    Type: Grant
    Filed: October 30, 2017
    Date of Patent: May 12, 2020
    Assignee: Massachusetts Institute of Technology
    Inventors: Bernard A. Malouin, Jr., James Paul Smith, Eric A. Browne
  • Publication number: 20200027819
    Abstract: The present invention generally relates to a modular microjet cooler. The modular microjet cooler may be attached to a packaged heat generating device that is mounted on a printed circuit board. The modular microjet cooler has an inlet allowing supply fluid to be directed through microjet nozzles toward an impingement surface on the packaged device. The modular microjet cooler also has one or more outlets that allow exhaust fluid to be removed. The modular microjet cooler is attached to the device after it has been packaged. Further, the modular microjet cooler may be attached to the packaged device either before or after it is mounted to the printed circuit board.
    Type: Application
    Filed: July 19, 2018
    Publication date: January 23, 2020
    Inventors: James Paul Smith, Bernard A. Malouin, JR., Eric A. Browne
  • Patent number: 10512152
    Abstract: The present invention generally relates to an array backframe with integral manifolding for high performance fluid cooling of devices. The integral manifolding of the array backframe is designed to perform three functions. First, the array backframe parallelizes the fluid paths to provide uniform, cool supply fluid to every device in the array. Second, the array backframe minimizes the parasitic heat losses between supply and exhaust by use of an isolation cavity. Third, the array backframe collapses hundreds of fluid lines into a single internal manifold to enhance modularity while also serving as a structural support member.
    Type: Grant
    Filed: July 17, 2018
    Date of Patent: December 17, 2019
    Assignee: Massachusetts Institute of Technology
    Inventors: James Paul Smith, Bernard A. Malouin, Jr., Eric A. Browne, Kenneth L. Smith
  • Publication number: 20190029105
    Abstract: The present invention generally relates to an array backframe with integral manifolding for high performance fluid cooling of devices. The integral manifolding of the array backframe is designed to perform three functions. First, the array backframe parallelizes the fluid paths to provide uniform, cool supply fluid to every device in the array. Second, the array backframe minimizes the parasitic heat losses between supply and exhaust by use of an isolation cavity. Third, the array backframe collapses hundreds of fluid lines into a single internal manifold to enhance modularity while also serving as a structural support member.
    Type: Application
    Filed: July 17, 2018
    Publication date: January 24, 2019
    Inventors: James Paul Smith, Bernard A. Malouin, JR., Eric A. Browne, Kenneth L. Smith
  • Publication number: 20190013258
    Abstract: The present invention generally relates to a microjet array for use as a thermal management system for a heat generating device, such as an RF device. The microjet array is formed in a jet plate, which is attached directly to the substrate containing the heat generating device. Additional enhancing features are used to further improve the heat transfer coefficient above that inherently achieved by the array. Some of these enhancements may also have other functions, such as adding mechanical structure, electrical connectivity or pathways for waveguides. This technology enables higher duty cycles, higher power levels, increased component lifetime, and/or improved SWaP for RF devices operating in airborne, naval (surface and undersea), ground, and space environments. This technology serves as a replacement for existing RF device thermal management solutions, such as high-SWaP finned heat sinks and cold plates.
    Type: Application
    Filed: October 30, 2017
    Publication date: January 10, 2019
    Inventors: Bernard A. Malouin, JR., James Paul Smith, Eric A. Browne
  • Patent number: 10026052
    Abstract: Systems and methods for providing an electronic task assessment platform are disclosed. The system may include a first computing device, a second computing device and a server communicatively coupled by a network. A first computing device may include a web browser configured with an assessment builder that enables the creation of customizable assessments. A second computing device may include an assessment application for completion of the customized assessment related to task performance evaluations. The completed assessment may be provided to the server that performs objective evaluation of the completed assessment and generates a specialized report including statistical metrics relating to the task performance evaluations. The report is provided to the first computing device and/or the second computing device.
    Type: Grant
    Filed: October 2, 2017
    Date of Patent: July 17, 2018
    Assignee: Metrics Medius, Inc.
    Inventors: Eric A. Brown, Pamela Andreatta
  • Publication number: 20180096279
    Abstract: Systems and methods for providing an electronic task assessment platform are disclosed. The system may include a first computing device, a second computing device and a server communicatively coupled by a network. A first computing device may include a web browser configured with an assessment builder that enables the creation of customizable assessments. A second computing device may include an assessment application for completion of the customized assessment related to task performance evaluations. The completed assessment may be provided to the server that performs objective evaluation of the completed assessment and generates a specialized report including statistical metrics relating to the task performance evaluations. The report is provided to the first computing device and/or the second computing device.
    Type: Application
    Filed: October 2, 2017
    Publication date: April 5, 2018
    Inventors: Eric A. Brown, Pamela Andreatta
  • Patent number: 5915837
    Abstract: A combination of an attachment, a power device and a quick-disconnect coupling device for attaching a variety of attachments to a stick includes a pair of brackets attached to the attachment, a frame assembly being attached to the power device and an activation device. The actuation device having a plurality of linkage members being positioned in a locked position when the power device is attached to the attachment and being in an open position when not being attached to the attachment. The linkage members including a latch having a pair of ends being spaced apart and in the locked position being in contacting relationship with the each of the pair of brackets.
    Type: Grant
    Filed: May 27, 1997
    Date of Patent: June 29, 1999
    Assignee: Caterpillar Inc.
    Inventors: Eric A. Brown, Howard T. Koshi, James G. Nickels
  • Patent number: 5634736
    Abstract: A quick-disconnect coupling device (12) for use with a power device (8) and for attaching a variety of attachments (18) to a stick (10) includes a pair of brackets (22) attached to the attachment (18), a frame assembly (40) being attached to the power device (8) and an activation device (80). The actuation device (80) having a plurality of linkage members (82) being positioned in a locked position (84) when the power device (8) is attached to the attachment (18) and being in an open position (83) when not being attached to the attachment (18). The linkage members (82) including a latch (130) having a pair of ends (132) being spaced apart and in the locked position (84) being in contacting relationship with the each of the pair of brackets (22).
    Type: Grant
    Filed: November 29, 1995
    Date of Patent: June 3, 1997
    Assignee: Caterpillar Inc.
    Inventors: Eric A. Brown, James G. Nickels, Howard T. Koshi