Abstract: A waveguide support and reflector member is provided for optically connecting a first optical component having at least one optical waveguide including an optical axis with a second optical component. The waveguide support and reflector member includes a body having a waveguide retention section and a reflector section. The waveguide retention section is configured to support the first optical component and defines an optical plane along which each optical waveguide is disposed upon positioning the optical component at the waveguide retention section. The reflector section has an optical reflector surface aligned with the optical plane and is configured to optically connect the at least one optical waveguide with the second optical component. An optical assembly incorporating a waveguide support and reflector member and a sheet metal blank for forming a waveguide support and reflector member are also provided. An in-line waveguide support and alignment member is further provided.

Abstract: A waveguide support and reflector member is provided for optically connecting a first optical component having at least one optical waveguide including an optical axis with a second optical component. The waveguide support and reflector member includes a body having a waveguide retention section and a reflector section. The waveguide retention section is configured to support the first optical component and defines an optical plane along which each optical waveguide is disposed upon positioning the optical component at the waveguide retention section. The reflector section has an optical reflector surface aligned with the optical plane and is configured to optically connect the at least one optical waveguide with the second optical component. An optical assembly incorporating a waveguide support and reflector member and a sheet metal blank for forming a waveguide support and reflector member are also provided. An in-line waveguide support and alignment member is further provided.

Abstract: Integrated signal pair elements are disclosed that can be inserted into and removed from a backplane connector housing as a single piece. Each element includes an insulative frame that supports a pair of conductive terminals in a spaced-apart arrangement. The frame is attached to a ground shield that provides a ground plane that extends around three sides of the signal pair. Cable wires can be terminated to tail portions of the signal pair and an insulative material is molded over the cable wire termination area to form an integrated signal pair element. The individual signal pair elements may also be commoned together in a linear array of signal pair elements by a commoning member that contacts the ground shields of the array of signal pair elements.

Abstract: A daughter card is constructed with a housing and a plurality of wafers retained in the housing. Each wafer includes a lead frame having a plurality of signal and ground terminals where the signal terminals are a differential pair. The lead frame includes an insulative frame portion with a conductive shield positioned on a side of the lead frame. The shield is secured to the lead frame by a projection extending from the shield to the ground terminals.

Abstract: Integrated signal pair elements are disclosed that can be inserted into and removed from a backplane connector housing as a single piece. Each element includes an insulative frame that supports a pair of conductive terminals in a spaced-apart arrangement. The frame is attached to a ground shield that provides a ground plane that extends around three sides of the signal pair. Cable wires can be terminated to tail portions of the signal pair and an insulative material is molded over the cable wire termination area to form an integrated signal pair element. The individual signal pair elements may also be commoned together in a linear array of signal pair elements by a commoning member that contacts the ground shields of the array of signal pair elements.

Abstract: A daughter card is constructed with a housing and a plurality of wafers retained in the housing. Each wafer includes a lead frame having a plurality of signal and ground terminals where the signal terminals are a differential pair. The lead frame includes an insulative frame portion with a conductive shield positioned on a side of the lead frame. The shield is secured to the lead frame by a projection extending from the shield to the ground terminals.

Abstract: Integrated signal pair elements are disclosed that can be inserted into and removed from a backplane connector housing as a single piece. Each element includes an insulative frame that supports a pair of conductive terminals in a spaced-apart arrangement. The frame is attached to a ground shield that provides a ground plane that extends around three sides of the signal pair. Cable wires are terminated to tail portions of the signal pair and an insulative material is molded over the cable wire termination area to form an integrated signal pair element. The individual signal pair elements may also be commoned together in a linear array of signal pair elements by a commoning member that contacts the ground shields of the array of signal pair elements.

Abstract: Integrated signal pair elements are disclosed that can be inserted into and removed from a backplane connector housing as a single piece. Each element includes an insulative frame that supports a pair of conductive terminals in a spaced-apart arrangement. The frame is attached to a ground shield that provides a ground plane that extends around three sides of the signal pair. Cable wires are terminated to tail portions of the signal pair and an insulative material is molded over the cable wire termination area to form an integrated signal pair element. The individual signal pair elements may also be commoned together in a linear array of signal pair elements by a commoning member that contacts the ground shields of the array of signal pair elements.