Patents by Inventor Eric A. Englhardt

Eric A. Englhardt has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11087998
    Abstract: A transfer chamber configured to be used during semiconductor device manufacturing is described. Transfer chamber includes at least one first side of a first width configured to couple to one or more substrate transfer units (e.g., one or more load locks or one or more pass-through units), and at least a second set of sides of a second width that is different than the first width, the second set of sides configured to couple to one or more processing chambers. A total number of sides of the transfer chamber is at least seven. Transfers within the transfer chamber are serviceable by a single robot. Process tools and methods for processing substrates are described, as are numerous other aspects.
    Type: Grant
    Filed: March 20, 2019
    Date of Patent: August 10, 2021
    Assignee: Applied Materials, Inc.
    Inventors: Michael Robert Rice, Michael Meyers, John J. Mazzocco, Dean C. Hruzek, Michael Kuchar, Sushant S. Koshti, Penchala N. Kankanala, Eric A. Englhardt
  • Publication number: 20210143034
    Abstract: A substrate processing system includes a factory interface, a transfer chamber, and a robot. The transfer chamber includes four first facets adapted for attachment to one or more first processing chambers and three second facets, wherein each of the three second facets has a width that is narrower than that of each of the four first facets. The system includes a second processing chamber having a first interface attached to a first of the three second facets and a load lock attached to a second of the three second facets and to the factory interface. The system also includes a robot attached to a bottom of the transfer chamber, the robot adapted to transfer substrates to and from the one or more first processing chambers, the second processing chamber, and the load lock.
    Type: Application
    Filed: January 22, 2021
    Publication date: May 13, 2021
    Inventors: Michael Robert Rice, Michael Meyers, John J. Mazzocco, Dean C. Hruzek, Michael Kuchar, Sushant S. Koshti, Penchala N. Kankanala, Eric A. Englhardt
  • Patent number: 10971381
    Abstract: A transfer chamber configured to be used during semiconductor device manufacturing is described. Transfer chamber includes at least one first side of a first width configured to couple to one or more substrate transfer units (e.g., one or more load locks or one or more pass-through units), and at least a second set of sides of a second width that is different than the first width, the second set of sides configured to couple to one or more processing chambers. A total number of sides of the transfer chamber is at least seven. Transfers within the transfer chamber are serviceable by a single robot. Process tools and methods for processing substrates are described, as are numerous other aspects.
    Type: Grant
    Filed: November 3, 2014
    Date of Patent: April 6, 2021
    Assignee: Applied Materials, Inc.
    Inventors: Michael Robert Rice, Michael Meyers, John J. Mazzocco, Dean C. Hruzek, Michael Kuchar, Sushant S. Koshti, Penchala N. Kankanala, Eric A. Englhardt
  • Publication number: 20190214284
    Abstract: A transfer chamber configured to be used during semiconductor device manufacturing is described. Transfer chamber includes at least one first side of a first width configured to couple to one or more substrate transfer units (e.g., one or more load locks or one or more pass-through units), and at least a second set of sides of a second width that is different than the first width, the second set of sides configured to couple to one or more processing chambers. A total number of sides of the transfer chamber is at least seven. Transfers within the transfer chamber are serviceable by a single robot. Process tools and methods for processing substrates are described, as are numerous other aspects.
    Type: Application
    Filed: March 20, 2019
    Publication date: July 11, 2019
    Inventors: Michael Robert Rice, Michael Meyers, John J. Mazzocco, Dean C. Hruzek, Michael Kuchar, Sushant S. Koshti, Penchala N. Kankanala, Eric A. Englhardt
  • Patent number: 10087543
    Abstract: A seal ring for an electrochemical processor does not slip or deflect laterally when pressed against a wafer surface. The seal ring may be on a rotor of the processor, with the seal ring having an outer wall joined to a tip arc through an end. The outer wall may be a straight wall. A relatively rigid support ring may be attached to the seal ring, to provide a more precise sealing dimension. Knife edge seal rings that slip or deflect laterally on the wafer surface may also be used. In these designs, the slipping is substantially uniform and consistent, resulting in improved performance.
    Type: Grant
    Filed: February 2, 2017
    Date of Patent: October 2, 2018
    Assignee: Applied Materials, Inc.
    Inventors: Nolan L. Zimmerman, George Mattinger, Gregory J. Wilson, Eric A. Englhardt, Balamurugan Ramasamy
  • Patent number: 10010912
    Abstract: Methods and apparatus for particle reduction in throttle gate valves used in substrate process chambers are provided herein. In some embodiments, a gate valve for use in a process chamber includes a body having an opening disposed therethrough from a first surface to an opposing second surface of the body; a pocket extending into the body from a sidewall of the opening; a gate movably disposed within the pocket between a closed position that seals the opening and an open position that reveals the opening and disposes the gate completely within the pocket; and a plurality of gas ports disposed in the gate valve configured to direct a gas flow into a portion of the gate valve fluidly coupled to the opening.
    Type: Grant
    Filed: May 13, 2014
    Date of Patent: July 3, 2018
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Jared Ahmad Lee, Dmitry Lubomirsky, Martin Jeff Salinas, Andrew Nguyen, Tom K. Cho, Eric A. Englhardt, Fernando Silveira
  • Publication number: 20170145582
    Abstract: A seal ring for an electrochemical processor does not slip or deflect laterally when pressed against a wafer surface. The seal ring may be on a rotor of the processor, with the seal ring having an outer wall joined to a tip arc through an end. The outer wall may be a straight wall. A relatively rigid support ring may be attached to the seal ring, to provide a more precise sealing dimension. Knife edge seal rings that slip or deflect laterally on the wafer surface may also be used. In these designs, the slipping is substantially uniform and consistent, resulting in improved performance.
    Type: Application
    Filed: February 2, 2017
    Publication date: May 25, 2017
    Inventors: Nolan L. Zimmerman, George Mattinger, Gregory J. Wilson, Eric A. Englhardt, Balamurugan Ramasamy
  • Patent number: 9524889
    Abstract: A via pass-through apparatus is disclosed. The via pass-through apparatus includes a pass-through chamber adapted to couple between a first mainframe section and a second mainframe section of a substrate processing system, the pass-through chamber including an entry and an exit each having a slit valve, and a via process chamber located at a different level than the pass-through chamber wherein the via process chamber is adapted to carry out a process on a substrate at the via location. Systems and methods of operating the system are provided, as are numerous other aspects.
    Type: Grant
    Filed: March 10, 2014
    Date of Patent: December 20, 2016
    Assignee: Applied Materials, Inc.
    Inventors: Steve S. Hongkham, Paul B. Reuter, Eric A. Englhardt, Ganesh Balasubramanian, Xinglong Chen, JuanCarlos Rocha-Alvarez
  • Patent number: 9441792
    Abstract: Transfer chamber gas purge apparatus are disclosed. The transfer chamber gas purge apparatus has a transfer chamber adapted to contain at least a portion of a transfer robot, the transfer chamber including side walls, a chamber lid, and a chamber floor, wherein the chamber lid has a plurality of distributed chamber inlets. The plurality of distributed chamber inlets may include diffusing elements. Laminar purge gas flow may be provided above the substrate. Systems and methods including a plurality of distributed chamber inlets are disclosed, as are numerous other aspects.
    Type: Grant
    Filed: September 26, 2014
    Date of Patent: September 13, 2016
    Assignee: Applied Materials, Inc.
    Inventors: Edward Ng, Eric A. Englhardt, Travis Morey, Ayan Majumdar, Steve S. Hongkham
  • Publication number: 20160225646
    Abstract: A transfer chamber configured to be used during semiconductor device manufacturing is described. Transfer chamber includes at least one first side of a first width configured to couple to one or more substrate transfer units (e.g., one or more load locks or one or more pass-through units), and at least a second set of sides of a second width that is different than the first width, the second set of sides configured to couple to one or more processing chambers. A total number of sides of the transfer chamber is at least seven. Transfers within the transfer chamber are serviceable by a single robot. Process tools and methods for processing substrates are described, as are numerous other aspects.
    Type: Application
    Filed: November 3, 2014
    Publication date: August 4, 2016
    Inventors: Michael Robert RICE, Michael MEYERS, John J. MAZZOCCO, Dean C. HRUZEK, Michael KUCHAR, Sushant S. KOSHTI, Penchala N. KANKANALA, Eric A. ENGLHARDT
  • Patent number: 9177842
    Abstract: Substrate transport systems, apparatus, and methods are described. In one aspect, the systems are disclosed having vertically stacked transfer chamber bodies. In one embodiment, a common robot apparatus services process chambers or load lock chambers coupled to upper and lower transfer chamber bodies. In another embodiment, separate robot apparatus service the process chambers and/or load lock chambers coupled to upper and lower transfer chamber bodies, and an elevator apparatus transfers the substrates between the various elevations. Degassing apparatus are described, as are numerous other aspects.
    Type: Grant
    Filed: August 9, 2012
    Date of Patent: November 3, 2015
    Assignee: Applied Materials, Inc.
    Inventors: Eric A. Englhardt, Richard Giljum, Jeffrey C. Hudgens, Igor G. Kogan, Michael Robert Rice, Sushant S. Koshti
  • Patent number: 9147592
    Abstract: In some embodiments, a linked processing tool system is provided that includes (1) a first processing tool having at least a first transfer chamber configured to couple to a plurality of processing chambers; (2) a second processing tool having at least a second transfer chamber configured to couple to a plurality of processing chambers; (3) a third transfer chamber coupled between the first and second processing tools and configured to transfer substrates between the first and second processing tools; and (4) a single sequencer that controls substrate transfer operations between the first processing tool, the second processing tool and the third transfer chamber of the linked processing tool system. Numerous other aspects are provided.
    Type: Grant
    Filed: August 7, 2013
    Date of Patent: September 29, 2015
    Assignee: Applied Materials, Inc.
    Inventors: Eric A. Englhardt, Steve Szudarski, Andrew Scott Cornelius, Amitabh Puri, Michael Robert Rice, Jeffrey C. Hudgens, Steven V. Sansoni, Robert Irwin Decottignies, Dean C. Hruzek, Peter Irwin, Nir Merry
  • Publication number: 20150090341
    Abstract: Transfer chamber gas purge apparatus are disclosed. The transfer chamber gas purge apparatus has a transfer chamber adapted to contain at least a portion of a transfer robot, the transfer chamber including side walls, a chamber lid, and a chamber floor, wherein the chamber lid has a plurality of distributed chamber inlets. The plurality of distributed chamber inlets may include diffusing elements. Laminar purge gas flow may be provided above the substrate. Systems and methods including a plurality of distributed chamber inlets are disclosed, as are numerous other aspects.
    Type: Application
    Filed: September 26, 2014
    Publication date: April 2, 2015
    Inventors: Edward Ng, Eric A. Englhardt, Travis Morey, Ayan Majumdar, Steve S. Hongkham
  • Publication number: 20140366953
    Abstract: Methods and apparatus for particle reduction in throttle gate valves used in substrate process chambers are provided herein. In some embodiments, a gate valve for use in a process chamber includes a body having an opening disposed therethrough from a first surface to an opposing second surface of the body; a pocket extending into the body from a sidewall of the opening; a gate movably disposed within the pocket between a closed position that seals the opening and an open position that reveals the opening and disposes the gate completely within the pocket; and a plurality of gas ports disposed in the gate valve configured to direct a gas flow into a portion of the gate valve fluidly coupled to the opening.
    Type: Application
    Filed: May 13, 2014
    Publication date: December 18, 2014
    Applicant: APPLIED MATERIALS, INC.
    Inventors: JARED AHMAD LEE, DMITRY LUBOMIRSKY, MARTIN JEFF SALINAS, ANDREW NGUYEN, TOM K. CHO, ERIC A. ENGLHARDT, FERNANDO SILVEIRA
  • Publication number: 20140263165
    Abstract: A via pass-through apparatus is disclosed. The via pass-through apparatus includes a pass-through chamber adapted to couple between a first mainframe section and a second mainframe section of a substrate processing system, the pass-through chamber including an entry and an exit each having a slit valve, and a via process chamber located at a different level than the pass-through chamber wherein the via process chamber is adapted to carry out a process on a substrate at the via location. Systems and methods of operating the system are provided, as are numerous other aspects.
    Type: Application
    Filed: March 10, 2014
    Publication date: September 18, 2014
    Inventors: Steve S. Hongkham, Paul B. Reuter, Eric A. Englhardt, Ganesh Balasubramanian, Xinglong Chen, JuanCarlos Rocha-Alvarez
  • Publication number: 20140044503
    Abstract: In some embodiments, a linked processing tool system is provided that includes (1) a first processing tool having at least a first transfer chamber configured to couple to a plurality of processing chambers; (2) a second processing tool having at least a second transfer chamber configured to couple to a plurality of processing chambers; (3) a third transfer chamber coupled between the first and second processing tools and configured to transfer substrates between the first and second processing tools; and (4) a single sequencer that controls substrate transfer operations between the first processing tool, the second processing tool and the third transfer chamber of the linked processing tool system. Numerous other aspects are provided.
    Type: Application
    Filed: August 7, 2013
    Publication date: February 13, 2014
    Inventors: Eric A. Englhardt, Steve Szudarski, Andrew Scott Cornelius, Amitabh Puri, Michael Robert Rice, Jeffrey C. Hudgens, Steven V. Sansoni, Robert Irwin Decottignies, Dean C. Hruzek, Peter Irwin, Nir Merry
  • Publication number: 20130306465
    Abstract: A seal ring for an electrochemical processor does not slip or deflect laterally when pressed against a wafer surface. The seal ring may be on a rotor of the processor, with the seal ring having an outer wall joined to a tip arc through an end. The outer wall may be a straight wall. A relatively rigid support ring may be attached to the seal ring, to provide a more precise sealing dimension. Knife edge seal rings that slip or deflect laterally on the wafer surface may also be used. In these designs, the slipping is substantially uniform and consistent, resulting in improved performance.
    Type: Application
    Filed: May 17, 2012
    Publication date: November 21, 2013
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Nolan L. Zimmerman, George Mattinger, Gregory J. Wilson, Eric A. Englhardt, Balamurugan Ramasamy
  • Patent number: 8379082
    Abstract: Methods and systems are provided for mapping substrates in a substrate carrier. The invention includes a substrate carrier including one or more windows; and an imaging system coupled to a substrate carrier handling robot and adapted to determine or image substrate positions in the substrate carrier via the one or more windows. Numerous other aspects are provided.
    Type: Grant
    Filed: March 4, 2009
    Date of Patent: February 19, 2013
    Assignee: Applied Materials, Inc.
    Inventors: Vinay K. Shah, Sushant S. Koshti, Eric A. Englhardt
  • Publication number: 20130039734
    Abstract: Substrate transport systems, apparatus, and methods are described. In one aspect, the systems are disclosed having vertically stacked transfer chamber bodies. In one embodiment, a common robot apparatus services process chambers or load lock chambers coupled to upper and lower transfer chamber bodies. In another embodiment, separate robot apparatus service the process chambers and/or load lock chambers coupled to upper and lower transfer chamber bodies, and an elevator apparatus transfers the substrates between the various elevations. Degassing apparatus are described, as are numerous other aspects.
    Type: Application
    Filed: August 9, 2012
    Publication date: February 14, 2013
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Eric A. Englhardt, Richard Giljum, Jeffrey C. Hudgens, Igor G. Kogan, Michael Robert Rice, Sushant S. Koshti
  • Patent number: 8225496
    Abstract: The present invention generally relates to a system that can be used to form a photovoltaic device, or solar cell, using processing modules that are adapted to perform one or more steps in the solar cell formation process. The automated solar cell fab is generally an arrangement of automated processing modules and automation equipment that is used to form solar cell devices. The automated solar fab will thus generally comprise a substrate receiving module that is adapted to receive a substrate, one or more absorbing layer deposition cluster tools having at least one processing chamber that is adapted to deposit a silicon-containing layer on a surface of the substrate, one or more back contact deposition chambers, one or more material removal chambers, a solar cell encapsulation device, an autoclave module, an automated junction box attaching module, and one or more quality assurance modules that are adapted to test and qualify the completely formed solar cell device.
    Type: Grant
    Filed: August 29, 2008
    Date of Patent: July 24, 2012
    Assignee: Applied Materials, Inc.
    Inventors: Robert Z. Bachrach, Yong-Kee Chae, Soo Young Choi, Nicholas G. J. De Vries, Yacov Elgar, Eric A. Englhardt, Michel R. Frei, Charles Gay, Parris Hawkins, Choi (Gene) Ho, James Craig Hunter, Penchala N. Kankanala, Liwei Li, Wing Hoo (Hendrick) Lo, Danny Cam Toan Lu, Fang Mei, Stephen P. Murphy, Srujal (Steve) Patel, Matthew J. B. Saunders, Asaf Schlezinger, Shuran Sheng, Tzay-Fa (Jeff) Su, Jeffrey S. Sullivan, David Tanner, Teresa Trowbridge, Brice Walker, John M. White, Tae K. Won