Abstract: Microbolometer systems and methods are provided herein. For example, an infrared imaging device includes a substrate having contacts and a surface. The surface defines a plane. The infrared imaging device further includes a microbolometer array coupled to the substrate. Each microbolometer of the microbolometer array includes a cross-section having a first section, a second section substantially parallel to the first section, and a third section joining the first section and the second section.

Abstract: Techniques are disclosed for imager health monitoring systems and methods. In one example, a method includes determining a characteristic of an active unit cell of a focal plane array (FPA) and/or a reference unit cell of the FPA. The active unit cell includes a detector selectively shielded from an incident scene. The reference unit cell includes a reference detector shielded from the incident scene. The method further includes determining a state of the FPA based at least in part on the characteristic. The method further includes transmitting an indication of the state of the FPA to selectively cause adjustment of the FPA Related devices and systems are also provided.

Abstract: Microbolometer systems and methods are provided herein. For example, an infrared imaging device includes a substrate having contacts and a surface. The surface defines a plane. The infrared imaging device further includes a microbolometer array coupled to the substrate. Each microbolometer of the microbolometer array includes a second having a first dimension that extends in a first direction substantially parallel to the plane and a second dimension that extends in a second direction away from the plane. The first dimension is less than the second dimension. The segment includes a metal layer and a layer formed on a side of the metal layer.

Abstract: Microbolometer systems and methods are provided herein. For example, an infrared imaging device includes a substrate having contacts and a surface. The surface defines a plane. The infrared imaging device further includes a microbolometer array coupled to the substrate. Each microbolometer of the microbolometer array includes a cross-section having a first section, a second section substantially parallel to the first section, and a third section joining the first section and the second section.

Abstract: Microbolometer systems and methods are provided herein. For example, an infrared imaging device includes a substrate having contacts and a surface. The surface defines a plane. The infrared imaging device further includes a microbolometer array coupled to the substrate. Each microbolometer of the microbolometer array includes a second having a first dimension that extends in a first direction substantially parallel to the plane and a second dimension that extends in a second direction away from the plane. The first dimension is less than the second dimension. The segment includes a metal layer and a layer formed on a side of the metal layer.

Abstract: An IR imaging device includes an optical element receiving infrared radiation from a scene, a filter blocking IR radiation outside of a particular range of wavelengths, an array of sensor pixels to capture an image of the scene based on infrared radiation received through the optical element and filter, the array of sensor pixels comprising a first array of sensor pixels to image gas in within a first spectral bandwidth, and a second array of sensor pixel to sense IR radiation in a second spectral bandwidth where gas is not detected, a read-out integrated circuit (ROIC) and logic circuitry to generate a first image sensed by the first array and a second image sensed by the second array, and gas detection logic to detect the presence of gas in the first image.

Abstract: An IR imaging device includes an optical element receiving infrared radiation from a scene, a filter blocking IR radiation outside of a particular range of wavelengths, an array of sensor pixels to capture an image of the scene based on infrared radiation received through the optical element and filter, the array of sensor pixels comprising a first array of sensor pixels to image gas in within a first spectral bandwidth, and a second array of sensor pixel to sense IR radiation in a second spectral bandwidth where gas is not detected, a read-out integrated circuit (ROIC) and logic circuitry to generate a first image sensed by the first array and a second image sensed by the second array, and gas detection logic to detect the presence of gas in the first image.

Abstract: An imager array may be provided as part of an imaging system. The imager array may include a plurality of infrared imaging modules. Each infrared imaging module may include a plurality of infrared sensors associated with an optical element. The infrared imaging modules may be oriented, for example, substantially in a plane facing the same direction and configured to detect images from the same scene. Such images may be processed in accordance with various techniques to provide images of infrared radiation. The infrared imaging modules may include filters or lens coatings to selectively detect desired ranges of infrared radiation. Such arrangements of infrared imaging modules in an imager array may be used to advantageous effect in a variety of different applications.

Abstract: Techniques are disclosed for imager health monitoring systems and methods. In one example, a method includes determining a characteristic of an active unit cell of a focal plane array (FPA) and/or a reference unit cell of the FPA. The active unit cell includes a detector selectively shielded from an incident scene. The reference unit cell includes a reference detector shielded from the incident scene. The method further includes determining a state of the FPA based at least in part on the characteristic. The method further includes transmitting an indication of the state of the FPA to selectively cause adjustment of the FPA Related devices and systems are also provided.

Abstract: Microbolometer systems and methods are provided herein. For example, an infrared imaging device includes a substrate having contacts and a surface. The surface defines a plane. The infrared imaging device further includes a microbolometer array coupled to the substrate. Each microbolometer of the microbolometer array includes a cross-section having a first section, a second section substantially parallel to the first section, and a third section joining the first section and the second section.

Abstract: Microbolometer systems and methods are provided herein. For example, an infrared imaging device includes a microbolometer array. The microbolometer array includes a plurality of microbolometers. Each microbolometer includes a microbolometer bridge that includes a first portion and a second portion. The first portion includes a resistive layer configured to capture infrared radiation. The second portion includes a second portion having a plurality of perforations defined therein.

Abstract: Microbolometer systems and methods are provided herein. For example, an infrared imaging device includes a substrate having contacts and a surface. The surface defines a plane. The infrared imaging device further includes a microbolometer array coupled to the substrate. Each microbolometer of the microbolometer array includes a second having a first dimension that extends in a first direction substantially parallel to the plane and a second dimension that extends in a second direction away from the plane. The first dimension is less than the second dimension. The segment includes a metal layer and a layer formed on a side of the metal layer.

Abstract: Various techniques are provided for implementing a segmented focal plane array (FPA) of infrared sensors. In one example, a system includes a segmented FPA. The segmented FPA includes a top die having an array of infrared sensors (e.g., bolometers). The top die may also include a portion of a read-out integrated circuit (ROIC). The segmented FPA also includes a bottom die having at least a portion of the ROIC. The top and the bottom dies are electrically coupled via inter-die connections. Advantageously, the segmented FPA may be fabricated with a higher yield and a smaller footprint compared with conventional FPA architectures. Moreover, the segmented FPA may be fabricated using different semiconductor processes for each die.

Abstract: Techniques are disclosed for systems and methods for facilitating pixel readout with partitioned analog-to-digital conversion. A device includes a detector, a capacitor coupled to the detector, a counter circuit coupled to the capacitor, a reset circuit coupled to the capacitor, and a processing circuit. The detector is configured to detect electromagnetic radiation associated with a scene and generate an associated detection signal. The capacitor is configured to, during an integration period, accumulate a voltage based on the detection signal. The counter circuit is configured to, during the integration period, adjust a counter value based on a comparison of the voltage and a reference voltage. The reset circuit is configured to, during the integration period, reset the capacitor based on the comparison. The processing circuit is configured to generate a digital detector output based on the counter value when the integration period has elapsed. Related methods are also provided.

Abstract: Improved techniques for infrared imaging and gas detection are provided. In one example, a system includes a sensor array configured to receive infrared radiation from a scene comprising a background portion and a gas. The sensor array includes a first set of infrared sensors configured with a first spectral response corresponding to a first wavelength range of the infrared radiation associated with the background portion. The sensor array also includes a second set of infrared sensors configured with a second spectral response corresponding to a second wavelength range of the infrared radiation associated with the gas. The system also includes a read out integrated circuit (ROIC) configured to provide pixel values for first and second images captured by the first and second sets of infrared sensors, respectively, in response to the received infrared radiation. Additional systems and methods are also provided.

Abstract: Techniques to set a frame rate and associated device manufacturing are disclosed. In one example, an imaging device includes a detector array configured to detect electromagnetic radiation associated with a scene and provide image data frames according to a first frame rate. The imaging device further includes a readout circuit configured to provide the image data frames according to a frame rate for the readout circuit. The imaging device further includes a fuse configured to set the frame rate for the readout circuit. Related methods and systems are also provided.

Abstract: Systems and methods are directed to vertical legs for an infrared detector. For example, an infrared imaging device may include a microbolometer array in which each microbolometer includes a bridge and a vertical leg structure that couples the bridge to a substrate such as a readout integrated circuit. The vertical leg structure may run along a path that is parallel to a plane defined by the bridge and may be oriented perpendicularly to the plane. The path may be disposed within, below, or above the plane defined by the bridge.

Abstract: Techniques are disclosed for facilitating burst mode calibration sensing and image mode sensing. In one example, a device includes a detector array configured to detect electromagnetic radiation and provide image data frames according to a first frame rate. The device further includes a logic circuit configured to determine whether a threshold delay has elapsed. The device further includes a frame output circuit configured to: provide, based at least on the threshold delay having elapsed, the image data frames according to the first frame rate; and provide, based at least on the threshold delay not having elapsed, the image data frames according to a second frame rate lower than the first frame rate. Related methods and systems are also provided.

Abstract: Various techniques are provided to monitor electrical equipment. In some implementations, a monitoring system for a cabinet may include an infrared camera and a non-thermal camera. The infrared camera may be configured to capture one or more thermal images of at least a portion of electrical equipment positioned in an interior cavity of the cabinet. The non-thermal camera may be configured to capture one or more non-thermal images such as visible light images of the portion of electrical equipment. In some implementations, combined images may be generated that include characteristics of the thermal images and the non-thermal images for viewing by a user. In some implementations, the cameras may receive electrical power through a physical coupling to an electrical connector within the cabinet and/or through electromagnetic energy harvesting techniques. Other implementations are also provided.

Abstract: Improved techniques for infrared imaging and gas detection are provided. In one example, a system includes a sensor array configured to receive infrared radiation from a scene comprising a background portion and a gas. The sensor array includes a first set of infrared sensors configured with a first spectral response corresponding to a first wavelength range of the infrared radiation associated with the background portion. The sensor array also includes a second set of infrared sensors configured with a second spectral response corresponding to a second wavelength range of the infrared radiation associated with the gas. The system also includes a read out integrated circuit (ROIC) configured to provide pixel values for first and second images captured by the first and second sets of infrared sensors, respectively, in response to the received infrared radiation. Additional systems and methods are also provided.