Patents by Inventor Eric AMEELE

Eric AMEELE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180331045
    Abstract: Implementations of a via for a semiconductor devices may include a first tungsten layer deposited conformally within the via, and may be recessed within the via, and a second tungsten layer deposited into the recess over the first tungsten layer. A plane formed by the second tungsten layer may be substantially parallel with a plane aligned substantially perpendicularly with a longest dimension of the via viewed in cross section.
    Type: Application
    Filed: March 14, 2018
    Publication date: November 15, 2018
    Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Eric AMEELE, E. William COWELL, III