Abstract: A nasal assembly for delivering breathable gas to a patient includes a frame having lateral connector, a cushion with a pair of nozzles, and a clip to secure the cushion to the frame. The frame includes a vent channel and a plurality of vent holes. The frame/cushion includes structure (lugs/cut outs) to prevent the assembly of an unvented frame with an unvented cushion, for safety purposes. The frame includes cored portions that interface with corner lugs provided on the cushion. A patient interface includes a frame, a cushion (nasal mask, nasal-oro mask, nozzles, etc.) and a vent assembly including a pattern of vent holes including at least two rows.

Abstract: A multi-chamber vacuum encapsulation system for encapsulation of semiconductor chip packages. The encapsulation system includes a dispense chamber, an inlet chamber mounted adjacent an inlet end of the dispense chamber, and an outlet chamber mounted adjacent an outlet end of the dispense chamber. The dispense chamber includes a material dispensing head for dispensing encapsulant material about the peripheral edges of chip packages under at least partial vacuum of the dispense chamber. A transport mechanism is provided in the dispense chamber for moving the chip packages between the inlet and outlet ends of the chamber. Methods of vacuum encapsulating semiconductor chip packages are also disclosed.

Abstract: A multi-chamber vacuum encapsulation system for encapsulation of semiconductor chip packages. The encapsulation system includes a dispense chamber, an inlet chamber mounted adjacent an inlet end of the dispense chamber, and an outlet chamber mounted adjacent an outlet end of the dispense chamber. The dispense chamber includes a material dispensing head for dispensing encapsulant material about the peripheral edges of chip packages under at least partial vacuum of the dispense chamber. A transport mechanism is provided in the dispense chamber for moving the chip packages between the inlet and outlet ends of the chamber. During the encapsulation process, the dispense chamber remains evacuated at all times while the smaller inlet and outlet chambers are evacuated and vented in a controlled manner to allow transfer of chip packages to and from the dispense chamber without venting of the dispense chamber to atmosphere.

Abstract: A multi-chamber vacuum encapsulation system for encapsulation of semiconductor chip packages. The encapsulation system includes a dispense chamber, an inlet chamber mounted adjacent an inlet end of the dispense chamber, and an outlet chamber mounted adjacent an outlet end of the dispense chamber. The dispense chamber includes a material dispensing head for dispensing encapsulant material about the peripheral edges of chip packages under at least partial vacuum of the dispense chamber. A transport mechanism is provided in the dispense chamber for moving the chip packages between the inlet and outlet ends of the chamber. During the encapsulation process, the dispense chamber remains evacuated at all times while the smaller inlet and outlet chambers are evacuated and vented in a controlled manner to allow transfer of chip packages to and from the dispense chamber without venting of the dispense chamber to atmosphere.

Abstract: An expanding bush and captive bolt assembly (1), comprising a bolt (2), a generally cylindrical bush (4), and a ring clip (6) that retains the bush on the bolt. The bush (2) has an inner surface with a portion (22) that has a frustoconical taper, a channel (12) that extends circumferentially inside the bush, and an expansion split or slot (7) so that the bush may be expanded radially. The bolt (2) has a threaded portion (10) for engaging with a socket that has a matching thread, a head (8) by which the bolt may be rotated to tighten the bolt (2) to the socket and to squeeze axially the bush (4), a shaft (18,20,23) between the head (8) and the threaded portion (10), said shaft having a portion (20) with a taper that engages with the tapering portion (22) of the bush to expand the bush (4) as it is squeezed axially between the taper (20) and the socket, and a channel (16) that extends circumferentially around the shaft and which opposes the channel (12) of the bush.