Abstract: An apparatus for dispensing fluid during semiconductor substrate processing operations comprises an enclosure having a first side and a second side. The enclosure comprises a first processing station and a second processing station. The second processing station is positioned adjacent to the first processing station. In addition, the substrate processing apparatus includes a first dispense arm configured to deliver a fluid to the first processing station wherein the first dispense arm is positioned between the first side and the first processing station and a second dispense arm configured to deliver the fluid to the second processing station wherein the second dispense arm is positioned between the second side and the second processing station. The substrate processing apparatus also comprises a first rinse arm configured to deliver a rinsing fluid to the first processing station and a second rinse arm configured to deliver the rinsing fluid to the second processing station.

Abstract: Embodiments of the invention are directed to dollies for moving photovoltaic modules comprising an elongate base section with a first plurality of rollers and a support section movably coupled with the elongate base section such that the support section can be moved upwardly and downwardly to raise and lower a photovoltaic module. Kits including at least two dollies and methods of using the dollies and kits are also described.

Abstract: An apparatus for dispensing fluid during semiconductor substrate processing operations comprises an enclosure having a first side and a second side. The enclosure comprises a first processing station and a second processing station. The second processing station is positioned adjacent to the first processing station. In addition, the substrate processing apparatus includes a first dispense arm configured to deliver a fluid to the first processing station wherein the first dispense arm is positioned between the first side and the first processing station and a second dispense arm configured to deliver the fluid to the second processing station wherein the second dispense arm is positioned between the second side and the second processing station. The substrate processing apparatus also comprises a first rinse arm configured to deliver a rinsing fluid to the first processing station and a second rinse arm configured to deliver the rinsing fluid to the second processing station.

Abstract: Embodiments of the invention generally provide an electrochemical plating system. The plating system includes a substrate loading station positioned in communication with a mainframe processing platform, at least one substrate plating cell positioned on the mainframe, at least one substrate bevel cleaning cell positioned on the mainframe, and a stacked substrate annealing station positioned in communication with at least one of the mainframe and the loading station, each chamber in the stacked substrate annealing station having a heating plate, a cooling plate, and a substrate transfer robot therein.

Abstract: Embodiments of the invention generally provide an electrochemical processing system configured to provide multiple chemistries for a single plating process. The multiple chemistries are generally delivered to individual plating cells positioned on the processing system. The individual chemistries may generally be used to conduct direct plating on a barrier layer, alloy plating, plating on a thin seed layer, optimized feature fill and bulk fill plating, plating with minimized defects, and/or any other plating process wherein multiple chemistries may be utilized to take advantage of the desirable characteristics of each chemistry.

Abstract: Embodiments of the invention provide a liquid delivery system. The liquid delivery system generally includes a plurality of vessels flexibly coupled to a frame to provide vibration isolation therefrom. In one embodiment, the liquid delivery system includes tubing coupling liquids to/from the plurality of vessels, wherein the tubing is selected to minimize the transmission of mechanical noise to the plurality of vessels. In another embodiment, the liquid delivery system includes a controller adapted to monitor and control the delivery of the liquids throughout the system. In another embodiment, a method is provided to deliver liquids from storage vessels to substrate processing systems.

Abstract: Embodiments of the invention provide a liquid delivery system. The liquid delivery system generally includes a plurality of vessels flexibly coupled to a frame to provide vibration isolation therefrom. In one embodiment, the liquid delivery system includes tubing coupling liquids to/from the plurality of vessels, wherein the tubing is selected to minimize the transmission of mechanical noise to the plurality of vessels. In another embodiment, the liquid delivery system includes a controller adapted to monitor and control the delivery of the liquids throughout the system. In another embodiment, a method is provided to deliver liquids from storage vessels to substrate processing systems.

Abstract: Embodiments of the invention generally provide an electrochemical plating system. The plating system includes a substrate loading station positioned in communication with a mainframe processing platform, at least one substrate plating cell positioned on the mainframe, at least one substrate bevel cleaning cell positioned on the mainframe, and a stacked substrate annealing station positioned in communication with at least one of the mainframe and the loading station, each chamber in the stacked substrate annealing station having a heating plate, a cooling plate, and a substrate transfer robot therein.