Abstract: A method for densifying porous annular substrates having a central passage by chemical vapor infiltration, the method including providing stacks of porous annular substrates, providing a plurality of individual modules including stacks disposed on a support plate having a perforated injection tube each mounted on a gas inlet opening, forming a stack of individual modules, aligning the individual modules of the stack in a sealed manner by means of an annular seal disposed between the injection tubes of a second individual module and the gas inlet openings of a first individual module with which it cooperates, and injecting into the internal volume of each stack of porous annular substrates a gas phase including a gaseous precursor of a matrix material to be deposited within the porosities of the substrates.

Abstract: The present disclosure generally relates to metallic powders for use in multilayer ceramic capacitors, to multilayer ceramic capacitors containing same and to methods of manufacturing such powders and capacitors. The disclosure addresses the problem of having better controlled smaller particle size distribution, with minimal contaminant contents which can be implemented at an industrial scale.

Abstract: A method for densifying porous annular substrates having a central passage by chemical vapor infiltration, the method including providing stacks of porous annular substrates, providing a plurality of individual modules including stacks disposed on a support plate having a perforated injection tube each mounted on a gas inlet opening, forming a stack of individual modules, aligning the individual modules of the stack in a sealed manner by means of an annular seal disposed between the injection tubes of a second individual module and the gas inlet openings of a first individual module with which it cooperates, and injecting into the internal volume of each stack of porous annular substrates a gas phase including a gaseous precursor of a matrix material to be deposited within the porosities of the substrates.

Abstract: The present disclosure generally relates to metallic powders for use in multilayer ceramic capacitors, to multilayer ceramic capacitors containing same and to methods of manufacturing such powders and capacitors. The disclosure addresses the problem of having better controlled smaller particle size distribution, with minimal contaminant contents which can be implemented at an industrial scale.

Abstract: The present disclosure generally relates to metallic powders for use in multilayer ceramic capacitors, to multilayer ceramic capacitors containing same and to methods of manufacturing such powders and capacitors. The disclosure addresses the problem of having better controlled smaller particle size distribution, with minimal contaminant contents which can be implemented at an industrial scale.

Abstract: The present disclosure generally relates to metallic powders for use in multilayer ceramic capacitors, to multilayer ceramic capacitors containing same and to methods of manufacturing such powders and capacitors. The disclosure addresses the problem of having better controlled smaller particle size distribution, with minimal contaminant contents which can be implemented at an industrial scale.

Abstract: The present disclosure generally relates to metallic powders for use in multilayer ceramic capacitors, to multilayer ceramic capacitors containing same and to methods of manufacturing such powders and capacitors. The disclosure addresses the problem of having better controlled smaller particle size distribution, with minimal contaminant contents which can be implemented at an industrial scale.

Abstract: A system and method for removing an electronic component from a substrate is described. In one embodiment, a system includes a heating device to heat a substrate, wherein an electronic component such as a microchip is attached to the substrate by one or more solder connections. A thermally conductive picker head is placed in physical contact with the electronic component to apply tension to the electronic component and draw heat away from the electronic component through a thermally conductive interface between the electronic component and the thermally conductive picker head. This ideally generates a uniform temperature gradient across the solder connections. This will allow the electronic component along with most or all of the solder to be removed from the substrate.

Abstract: A system and method for removing an electronic component from a substrate is described. In one embodiment, a system includes a heating device to heat a substrate, wherein an electronic component such as a microchip is attached to the substrate by one or more solder connections. A thermally conductive picker head is placed in physical contact with the electronic component to apply tension to the electronic component and draw heat away from the electronic component through a thermally conductive interface between the electronic component and the thermally conductive picker head. This ideally generates a uniform temperature gradient across the solder connections. This will allow the electronic component along with most or all of the solder to be removed from the substrate.

Abstract: A system and method for removing an electronic component from a substrate is described. In one embodiment, a method in accordance with the invention includes initially preheating a substrate, wherein an electronic component (such as a microchip or discrete electronic component) is attached to the substrate by one or more solder connections. A thermally conductive picker head is applied to the electronic component to quench the electronic component and generate a temperature gradient across the solder connections. Tension is applied to the electronic component using the picker head. The substrate is then heated until a melting point is reached at the interface between the substrate and the solder connections. When the melting point is reached, the tension applied by the picker head removes the electronic component from the substrate. Most if not all of the solder associated with the solder connections is removed with the electronic component.

Abstract: A system and method for removing an electronic component from a substrate is described. In one embodiment, a method in accordance with the invention includes initially preheating a substrate, wherein an electronic component (such as a microchip or discrete electronic component) is attached to the substrate by one or more solder connections. A thermally conductive picker head is applied to the electronic component to quench the electronic component and generate a temperature gradient across the solder connections. Tension is applied to the electronic component using the picker head. The substrate is then heated until a melting point is reached at the interface between the substrate and the solder connections. When the melting point is reached, the tension applied by the picker head removes the electronic component from the substrate. Most if not all of the solder associated with the solder connections is removed with the electronic component.

Abstract: A method of fabricating a composite material part having carbon fiber reinforcement densified by a matrix, including making a coherent fiber preform of carbon fibers presenting holes formed from at least a first face of the preform, and densifying the preform by depositing therein a material constituting a matrix by means of a chemical vapor infiltration type process. The holes are formed by causing a plurality of non-rotary elongate tools to penetrate simultaneously, the tools being substantially mutually parallel and presenting on their surfaces roughnesses or portions in relief suitable for breaking and/or transferring fibers they encounter, the tools being caused to penetrate simultaneously by moving a support carrying the tools, and the tools being selected to have a cross-section that makes it possible to obtain in the carbon fiber preform holes that present a cross-section with a mean dimension lying in the range 50 ?m to 500 ?m.

Abstract: An exemplary method for marking molds, the method comprising, configuring a milling machine to operate with a diamond coated bit having an angle of approximately 60 degrees, and engraving a unique identifier on a bottom surface of a borosilicate glass injection molded soldering mold with the milling machine.

Abstract: A coherent fiber preform made of carbon fibers presents holes formed from at least a first face of the preform, and the preform is densified by depositing therein a material constituting a matrix by means of a chemical vapor infiltration type process. The holes are formed by causing a plurality of non-rotary elongate tools to penetrate simultaneously, the tools being substantially mutually parallel and presenting on their surfaces roughnesses or portions in relief suitable for breaking and/or transferring fibers they encounter, the tools being caused to penetrate simultaneously by moving a support carrying the tools, and the tools being selected to have a cross-section that makes it possible to obtain in the carbon fiber preform holes that present a cross-section with a mean dimension lying in the range 50 ?m to 500 ?m.

Abstract: An exemplary method for marking molds, the method comprising, configuring a milling machine to operate with a diamond coated bit having an angle of approximately 60 degrees, and engraving a unique identifier on a bottom surface of a borosilicate glass injection molded soldering mold with the milling machine.

Abstract: A method of using a machining assembly to machine a plurality of different turbine components that include a dovetail having a contoured profile. The method includes removably coupling a first set of retainers into the machining assembly, the first set of retainers include an upper portion having a profile that substantially mirrors a portion of the first dovetail, and a lower portion having a profile that substantially mirrors an opposite side of the first dovetail, coupling a first turbine component between the upper and lower portions such that the first turbine component is secured by the first set of retainers, coupling the machining assembly into a milling machine, and machining at least one seal groove into the dovetail of the first turbine component.

Abstract: A method of using a machining assembly to machine a plurality of different turbine components that include a dovetail having a contoured profile. The method includes removably coupling a first set of retainers into the machining assembly, the first set of retainers include an upper portion having a profile that substantially mirrors a portion of the first dovetail, and a lower portion having a profile that substantially mirrors an opposite side of the first dovetail, coupling a first turbine component between the upper and lower portions such that the first turbine component is secured by the first set of retainers, coupling the machining assembly into a milling machine, and machining at least one seal groove into the dovetail of the first turbine component.