Patents by Inventor Eric Boyd
Eric Boyd has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10708638Abstract: Systems and methods for obtaining and playing video advertisements in conjunction with play of video content make use of partner advertising providers to reduce the time required to identify and obtain the video advertisements. An instantiation of a video player software application receives and analyzes bids from partner advertising providers and selects a winning bid before a user issues a play command. As a result, it is often possible to immediately begin playing a video advertisement the instant the user issues a play command.Type: GrantFiled: December 19, 2018Date of Patent: July 7, 2020Assignee: Longtail Ad Solutions, Inc.Inventors: Eric Boyd, Brian Rifkin, Robert Walch
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Publication number: 20200204837Abstract: Systems and methods for obtaining and playing video advertisements in conjunction with play of video content make use of partner advertising providers to reduce the time required to identify and obtain the video advertisements. An instantiation of a video player software application receives and analyzes bids from partner advertising providers and selects a winning bid before a user issues a play command. As a result, it is often possible to immediately begin playing a video advertisement the instant the user issues a play command.Type: ApplicationFiled: December 19, 2018Publication date: June 25, 2020Inventors: Eric BOYD, Brian RIFKIN, Robert WALCH
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Patent number: 10511866Abstract: Systems and methods for obtaining and playing video advertisements in conjunction with play of video content make use of partner advertising providers to reduce the time required to identify and obtain the video advertisements. An instantiation of a video player software application receives and analyzes bids from partner advertising providers and selects a winning bid before a user issues a play command. As a result, it is often possible to immediately begin playing a video advertisement the instant the user issues a play command.Type: GrantFiled: December 19, 2018Date of Patent: December 17, 2019Assignee: Longtail Ad Solutions, Inc.Inventors: Eric Boyd, Brian Rifkin, Robert Walch
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Patent number: 9741680Abstract: A stackable integrated circuit chip layer and module device that avoids the use of electrically conductive elements on the external surfaces of a layer containing an integrated circuit die by taking advantage of conventional wire bonding equipment to provide an electrically conductive path defined by a wire bond segment that is encapsulated in a potting material so as to define an electrically conductive wire bond “through-via” accessible from at least the lower or second surface of the layer.Type: GrantFiled: August 29, 2016Date of Patent: August 22, 2017Assignee: PFG IP LLCInventors: Randy Bindrup, W. Eric Boyd, John Leon, James Yamaguchi, Angel Pepe
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Patent number: 9728507Abstract: A cap chip or high density reroute layer for use in a stacked microelectronic module. A first set of electrically conductive reroute layers are defined on a sacrificial substrate. One or more stud bump columns are defined on an exposed conducive pad on a conductive reroute layer. One or more active or passive electronic elements, or both may be electrically coupled to one or more exposed conductive pads. The layer is encapsulated in an encapsulant and the stud bump columns exposed by removing a portion of the encapsulant. A second set of electrically conductive reroute layers is defined on the layer and electrically coupled to the stud bumps. The sacrificial substrate is removed to provide a cap chip or reroute layer.Type: GrantFiled: July 16, 2012Date of Patent: August 8, 2017Assignee: PFG IP LLCInventors: Sambo He, W. Eric Boyd
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Patent number: 9431275Abstract: A stackable integrated circuit chip layer and module device that avoids the use of electrically conductive elements on the external surfaces of a layer containing an integrated circuit die by taking advantage of conventional wire bonding equipment to provide an electrically conductive path defined by a wire bond segment that is encapsulated in a potting material so as to define an electrically conductive wire bond “through-via” accessible from at least the lower or second surface of the layer.Type: GrantFiled: August 15, 2011Date of Patent: August 30, 2016Assignee: PFG IP LLCInventors: Randy Bindrup, W. Eric Boyd, John Leon, James Yamaguchi, Angel Pepe
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Patent number: 9046322Abstract: A targeting sight having viewing optics, a focal plane array and an alignment frame having an aperture that defines a target area that is mounted proximal the muzzle of a weapon. Electronic processing means is provided to define a crosshair in the viewing optics. The alignment frame is illuminated with a beam and the reflected portion of the beam is received by the focal plane array and is processed to position the crosshair with respect to the aperture.Type: GrantFiled: November 9, 2011Date of Patent: June 2, 2015Assignee: PFG IP LLCInventors: James Justice, W. Eric Boyd
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Patent number: 8835218Abstract: Layers suitable for stacking in three dimensional, multi-layer modules are formed by interconnecting a ball grid array electronic package to an interposer layer which routes electronic signals to an access plane. The layers are under-filled and may be bonded together to form a stack of layers. The leads on the access plane are interconnected among layers to form a high-density electronic package.Type: GrantFiled: July 12, 2011Date of Patent: September 16, 2014Assignee: Aprolase Development Co., LLCInventors: Keith Gann, W. Eric Boyd
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Patent number: 8637140Abstract: A method for defining an electrically conductive metalized structure, which may comprise an electrode or trace, on the surface of a three-dimensional element. The three-dimensional element may comprise a glass microsphere or shell resonator. A laser direct write grayscale photolithographic process is used in conjunction with electrically conductive metal deposition processes to define one or more electrically conductive metal structures on the surfaces of the three dimensional element.Type: GrantFiled: October 6, 2011Date of Patent: January 28, 2014Assignee: ISCS Inc.Inventors: James Yamaguchi, W. Eric Boyd
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Patent number: 8637985Abstract: A method for electrically coupling an anti-tamper mesh to an electronic module or device using wire bonding equipment and a device made from the method. Stud bumps or free air ball bonds are electrically coupled to conductive mesh pads of an anti-tamper mesh. Respective module pads have a conductive epoxy disposed thereon for the receiving of the stud bumps or free air ball bonds, each of which are aligned and bonded together to electrically couple the anti-tamper mesh to predetermined module pads.Type: GrantFiled: February 10, 2012Date of Patent: January 28, 2014Assignee: ISC8 Inc.Inventors: Randy Bindrup, James Yamaguchi, W. Eric Boyd
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Patent number: 8609473Abstract: A method for fabricating a stackable integrated circuit layer and a device made from the method are disclosed. A stud bump is defined on the contact pad of an integrated circuit die and the stud-bumped die encapsulated in a potting material to define a potted assembly. A predetermined portion of the potting material is removed whereby a portion of the stud bump is exposed. One or more electrically conductive traces are defined on the layer surface and in electrical connection with the stud bump to reroute the integrated circuit contacts to predetermined locations on the layer to provide a stackable neolayer.Type: GrantFiled: October 12, 2011Date of Patent: December 17, 2013Assignee: ISC8 Inc.Inventors: Peter Lieu, James Yamaguchi, Randy Bindrup, W. Eric Boyd
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Patent number: 8602640Abstract: A sensing system is configured to detect physical parameters of a fluid sample. In particular, the sensing system is configured to detect the dew point of the fluid by reducing temperature of a sensing medium and detecting the fluid condensate on a sensing surface by directing light from a light source to the sensing surface and detecting the light reflected off the sensing surface onto a light detector. The light source and the light detector are on the opposite side of the sensing medium from the sensing surface.Type: GrantFiled: May 20, 2009Date of Patent: December 10, 2013Assignee: Entegris—Jetalon Solutions, Inc.Inventors: Ronald P. Chiarello, Christopher Andrew Wacinski, Charles Eric Boyd, Stewart Robin Shearer
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Patent number: 8586407Abstract: A method for providing a known good integrated circuit die having enhanced planarity from a prepackaged integrated circuit die having a surface warpage such as in a ball grid array (BGA) package is provided. A partially-depackaged integrated circuit package is affixed to a substrate with a spacer element there between such that the active surface of the die within the partially depackaged integrated circuit die is “bowed” slightly upwardly to define a convex surface. The exposed encapsulant on the now-convex surface of the mounted, partially-depackaged integrated circuit package is then lapped or ground away to a predetermined depth so that an integrated circuit die is provided having an enhanced planarity and surface uniformity.Type: GrantFiled: September 12, 2011Date of Patent: November 19, 2013Assignee: ISC8 Inc.Inventors: Peter Lieu, W. Eric Boyd
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Publication number: 20130141137Abstract: A physically uncloneable function (PUF) sense and response module fabricated from a stack of integrated circuit chip layers. At least one of the PUF chips in the stack has a unique identifier resulting from random effects of fabrication processes. The PUF chip generates the fingerprint at power-on resulting that in turn is used to generate a private key. The private key generates a public key used to communicate with the outside world. The encrypted data from the outside world is decrypted with the private key. The public key is stored for comparison with pubic keys generated at subsequent power-up operations. If the key changes, tampering is indicated and a predetermined tamper response event is generated such as the erasing of the contents of a memory.Type: ApplicationFiled: June 1, 2012Publication date: June 6, 2013Applicant: ISC8 Inc.Inventors: Christian Krutzik, Stewart Clark, W. Eric Boyd
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Patent number: 8415819Abstract: An energy-harvesting buoy is provided comprising an air-pressure generator, such as a piezo-electric generator, or any other generator that can harvest energy from an air pressure. The energy harvesting buoy consists of a first float and a second float. An air pressure is created when relative vertical motion occurs between the first float and the second float which drives an air pressurization means such as a piston driven air pump using a linkage member pivotably mounted between the respective floats. The generator uses the air pressure from the air pressurization means to drive the generator to generate electrical power.Type: GrantFiled: August 4, 2010Date of Patent: April 9, 2013Assignee: ISC8 Inc.Inventors: Itzhak Sapir, W. Eric Boyd
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Publication number: 20130020572Abstract: A cap chip or high density reroute layer for use in a stacked microelectronic module. A first set of electrically conductive reroute layers are defined on a sacrificial substrate. One or more stud bump columns are defined on an exposed conducive pad on a conductive reroute layer. One or more active or passive electronic elements, or both may be electrically coupled to one or more exposed conductive pads. The layer is encapsulated in an encapsulant and the stud bump columns exposed by removing a portion of the encapsulant. A second set of electrically conductive reroute layers is defined on the layer and electrically coupled to the stud bumps. The sacrificial substrate is removed to provide a cap chip or reroute layer.Type: ApplicationFiled: July 16, 2012Publication date: January 24, 2013Applicant: ISC8 Inc.Inventors: Sambo He, W. Eric Boyd
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Patent number: 8271262Abstract: The invention comprises a lip reading device having a capacitive array for enhanced portable speech recognition. The capacitive array of the invention produces a sequence of signal frames or signal data sets (i.e., digitized output) representative of the proximity and motion of a user's lips at a predetermined sample rate and resolution. The sequence of signal data sets is stored in a first electronic memory and are compared against a reference data set representative of a predetermined acoustic signal stored in a second electronic memory. The attributes of signal data set are compared against the reference data set for likely data matches based on predetermined criteria.Type: GrantFiled: September 22, 2009Date of Patent: September 18, 2012Assignee: ISC8 Inc.Inventors: Ying Hsu, Virgilio Villacorta, W. Eric Boyd
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Publication number: 20120211886Abstract: A method for fabricating an integrated circuit chip-scale package and a device made from the method. One or more IC chips are mounted on a carrier and a stud bump defined on an IC pad. The stud-bumped IC is encapsulated to define a potted assembly layer which is thinned to expose the stud bump. Conductive first traces are defined and coupled to the stud bump to reroute the IC pads. A dielectric layer is provided and vias defined there through to expose the first traces. Electrically conductive second traces are disposed on the dielectric layer surface that are coupled to the first traces to reroute the IC pads to define a chip scale package.Type: ApplicationFiled: February 17, 2012Publication date: August 23, 2012Applicant: ISC8 Inc.Inventors: Peter Lieu, James Yamaguchi, Randy Bindrup, W. Eric Boyd
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Publication number: 20120205801Abstract: A method for electrically coupling an anti-tamper mesh to an electronic module or device using wire bonding equipment and a device made from the method. Stud bumps or free air ball bonds are electrically coupled to conductive mesh pads of an anti-tamper mesh. Respective module pads have a conductive epoxy disposed thereon for the receiving of the stud bumps or free air ball bonds, each of which are aligned and bonded together to electrically couple the anti-tamper mesh to predetermined module pads.Type: ApplicationFiled: February 10, 2012Publication date: August 16, 2012Inventors: Randy Bindrup, James Yamaguchi, W. Eric Boyd
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Patent number: RE43877Abstract: A preprocessed semiconductor substrate such as a wafer is provided with a metal etch mask which defines singulation channels on the substrate surface. An isotropic etch process is used to define a singulation channel with a first depth extending into the semiconductor substrate material. A second anisotropic etch process is used to increase the depth of the singulation channel while providing substantially vertical singulation channel sidewalls. The singulation channel can be extended through the depth of the substrate or, in an alternative embodiment, a predetermined portion of the inactive surface of the substrate removed to expose the singulation channels. In this manner, semiconductor die can be precisely singulated from a wafer while maintaining vertical die sidewalls.Type: GrantFiled: February 25, 2010Date of Patent: December 25, 2012Assignee: Aprolase Development Co., LLCInventors: David Ludwig, James Yamaguchi, Stewart Clark, W. Eric Boyd