Abstract: A stacked array of channeled semiconductor chips defining a power electronic circuit is mounted in a sealed container provided with inlet and outlet passages for liquid coolant. Leadframe terminals supported by the container engage selected terminals of the semiconductor chips and form leads for mounting the container on a circuit board having electrical and fluid interconnects.

Abstract: A leaded semiconductor power module includes a first heatsink, an electrically insulated substrate thermally coupled to the first heatsink, one or more semiconductor chips, a leadframe substrate, and a second heatsink thermally coupled to the leadframe substrate, the assembly being overmolded with an encapsulant to expose the first heatsink, the second heatsink and peripheral terminals of the leadframe substrate. The semiconductor chips are electrically and structurally coupled to both the insulated substrate and the leadframe substrate, and conductive spacers electrically and structurally couple the insulated substrate to the leadframe substrate.

Abstract: A leaded semiconductor power module includes a first heatsink, an electrically insulated substrate thermally coupled to the first heatsink, one or more semiconductor chips, a leadframe substrate, and a second heatsink thermally coupled to the leadframe substrate, the assembly being overmolded with an encapsulant to expose the first heatsink, the second heatsink and peripheral terminals of the leadframe substrate. The semiconductor chips are electrically and structurally coupled to both the insulated substrate and the leadframe substrate, and conductive spacers electrically and structurally couple the insulated substrate to the leadframe substrate.

Abstract: A stacked array of channeled semiconductor chips defining a power electronic circuit is mounted in a sealed container provided with inlet and outlet passages for liquid coolant. Leadframe terminals supported by the container engage selected terminals of the semiconductor chips and form leads for mounting the container on a circuit board having electrical and fluid interconnects.

Abstract: An electronic package is provided having a connector and a solder joint that is less susceptible to thermal fatigue. The package includes a die including a first electrically conductive connecting surface having a first coefficient of thermal expansion and a substrate including electrical circuitry and a second electrically conductive connecting surface having a second coefficient of thermal expansion. The package further includes a solder joint connecting the first connecting surface to the second connecting surface. One of the first and second connecting surfaces includes a plurality of pads spaced from each other. By employing an electrical connection having a plurality of pads spaced from each other, the solder joint is relieved to reduce fatigue caused by thermal cycling.

Abstract: An electronic package is provided having a connector and a solder joint that is less susceptible to thermal fatigue. The package includes a die including a first electrically conductive connecting surface having a first coefficient of thermal expansion and a substrate including electrical circuitry and a second electrically conductive connecting surface having a second coefficient of thermal expansion. The package further includes a solder joint connecting the first connecting surface to the second connecting surface. One of the first and second connecting surfaces includes a plurality of pads spaced from each other. By employing an electrical connection having a plurality of pads spaced from each other, the solder joint is relieved to reduce fatigue caused by thermal cycling.

Abstract: A control module having an integral fastening and locking case assembly whereby a support spacer frame for circuit boards and case members are assembled to create a single unit without the use of conventional fasteners. The structure of the housing and the support spacer frame provides an arrangement whereby the sectional equipment may securely snapped together to form a single unit without the use of conventional fasteners.

Abstract: A heat sink assembly for clamping stand-up power components to a heat sink wherein the components are mounted on a circuit board and enclosed within a housing. A spring clamp lightly clamps an electrical component to a heat sink during a soldering process. Thereafter, the housing assembly sandwiches the electrical component between the spring clamp and a heat sink; thus ensuring optimum heat dissipation from and stability of the electrical component.

Abstract: The printed circuit board (PCB) is provided with a plurality of square connector stakes, which are pressed into the respective holes disposed in the PCB. The connector stake holes are arranged on the PCB such that a conductive pad encircles each of the connector holes. The connector holes have a cross-section that provides the required mechanical interference between the connector stakes and the connector holes to hold the stakes in place prior to soldering. At the same time, the walls of the holes are configured to limit the flux from migrating to the upper portions of the connector stakes during the wave soldering operation.

Abstract: The stylus arm restraint comprises an element disposed substantially perpendicular to the stylus arm, and having a portion that is received in a recess provided in the cartridge housing when the stylus arm is held inside the cartridge. The reception of the stylus arm-mounted element in the cartridge recess limits motion of the stylus arm during transit.

Abstract: The stylus arm carriage is provided with a rotatably-mounted torsional spring element. When the carriage is driven to an off-record home position, a pad mounted in the player above the carriage engages an upstanding portion of the rotatably-mounted element, and turns it around. When turned around, the other end of the rotatably-mounted element engages a carriage-mounted stylus arm support bracket to firmly secure it in place as long as the carriage is at the home position to prevent accidental lowering of the stylus. As the carriage is driven away from its home position, the torsional spring automatically returns to its original position to free the stylus arm.

Abstract: The in-arm stylus cleaner includes a cleaner arm mounted for to-and-fro motion in the stylus arm carriage. To clean the stylus, the cleaner arm is retracted, the reproducing stylus is raised back up into the carriage arm, the cleaner arm is freed to allow a wiping element mounted thereon to sweep the stylus tip, and the stylus is then gently lowered onto a turntable-disposed record to resume playback operations.

Abstract: The in-arm stylus cleaner includes a cleaner arm mounted for to-and-fro motion in the stylus arm carriage. A cleaning element, comprising a piece of compliant sheet, has one edge secured to the cleaner arm such that the cleaning element extends away from the cleaner arm substantially at right angles thereto. To clean the stylus, the cleaner arm is retracted, the reproducing stylus is raised back up into the carriage arm, the cleaner arm is freed to allow a wiping element mounted thereon to sweep the stylus tip, and the stylus is then gently lowered onto a turntable-disposed record to resume playback operations.

Abstract: The stylus arm carriage is provided with a slidably-mounted plunger. When the carriage is driven to an off-record home position, a portion of the front wall of the player engages a protruding end of the plunger to drive it in. The other end of the plunger engages a carriage-mounted stylus cleaner mechanism to lock it in place while the carriage is disposed at the home position to prevent the possibility of accidental contact between a pickup stylus and the cleaner mechanism.