Patents by Inventor Eric Buddrius

Eric Buddrius has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10455685
    Abstract: An electronic device may include a circuit board, and the circuit board may include a dielectric material. A socket may be coupled to a first side of the circuit board, and the socket may be configured to receive a semiconductor package. A backing plate may be positioned on a second side of the circuit board. A spacer may be positioned between the backing plate and the circuit board. The spacer may alter the profile of the socket to provide a curved profile to the socket. The spacer may displace a portion of the socket in a first direction, for instance when the spacer is coupled between the backing plate and the circuit board.
    Type: Grant
    Filed: October 15, 2018
    Date of Patent: October 22, 2019
    Assignee: Intel Corporation
    Inventors: Steven A. Klein, Kuang Liu, Thomas A. Boyd, Luis Gil Rangel, Muffadal Mukadem, Shelby A. Ferguson, Francis Toth, Jr., Eric Buddrius, Ralph V. Miele, Sriram Srinivasan, Jeffory L. Smalley