Patents by Inventor Eric C. Huenger

Eric C. Huenger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7344970
    Abstract: Photoresist compositions and methods suitable for depositing a very thick photoresist layer in a single coating process are provided. Such photoresist layers are particularly suitable for use in chip scale packaging.
    Type: Grant
    Filed: April 7, 2003
    Date of Patent: March 18, 2008
    Assignee: Shipley Company, L.L.C.
    Inventors: Robert S. Forman, Jill E. Steeper, Eric C. Huenger
  • Publication number: 20040018724
    Abstract: Photoresist compositions and methods suitable for depositing a very thick photoresist layer in a single coating process are provided. Such photoresist layers are particularly suitable for use in chip scale packaging.
    Type: Application
    Filed: April 7, 2003
    Publication date: January 29, 2004
    Applicant: Shipley Company, L.L.C
    Inventors: Robert S. Forman, Jill E. Steeper, Eric C. Huenger
  • Patent number: 5256441
    Abstract: An improved method of manufacturing electrolessly deposited copper is described. The copper deposits are useful in the manufacture of fully additive and partly additive plated-through hole, printed wiring boards. The copper is deposited from a bath containing a copper compound, a complexing agent for copper, a reducing agent for copper, a pH-adjusting agent and one or more addition agents. The improvement for producing highly stress resistant, copper deposits comprises controlling one or more plating bath parameters such as pH, complexing agents and sources of iron or chromium, so that the trace iron and/or chromium in the deposited copper is less than 2 mg/mole of copper.
    Type: Grant
    Filed: August 4, 1992
    Date of Patent: October 26, 1993
    Assignee: AMP-AKZO Corporation
    Inventors: Eric C. Huenger, Stanley W. Tarry, Richard A. Mayernik