Patents by Inventor Eric C. Johnston

Eric C. Johnston has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multilayer passive circuit topology
    Patent number: 7724117
    Abstract: A multilayer passive circuit topology is disclosed. In one embodiment, a multilayer circuit is provided. The multilayer circuit comprises a multilayer inductor comprising a first set of parallel conductive traces formed on a first layer, a second set of parallel conductive traces formed on a second layer spaced apart from the first layer; and a plurality of vias that connect respective parallel conductive traces from the first and second layer to form inductor windings. The multilayer circuit further comprises a multilayer capacitor connected to an end of the inductor by a coupling via, the capacitor comprising a first conductive plate and a second conductive plate being spaced apart from one another and being formed on different layers.
    Type: Grant
    Filed: January 11, 2008
    Date of Patent: May 25, 2010
    Assignee: Northrop Grumman Systems Corporation
    Inventors: William R. Goyette, Frank B. Winter, Eric C. Johnston, Hardik Patel
  • Multilayer Passive Circuit Topology
    Publication number: 20090179722
    Abstract: A multilayer passive circuit topology is disclosed. In one embodiment, a multilayer circuit is provided. The multilayer circuit comprises a multilayer inductor comprising a first set of parallel conductive traces formed on a first layer, a second set of parallel conductive traces formed on a second layer spaced apart from the first layer; and a plurality of vias that connect respective parallel conductive traces from the first and second layer to form inductor windings. The multilayer circuit further comprises a multilayer capacitor connected to an end of the inductor by a coupling via, the capacitor comprising a first conductive plate and a second conductive plate being spaced apart from one another and being formed on different layers.
    Type: Application
    Filed: January 11, 2008
    Publication date: July 16, 2009
    Inventors: William R. Goyette, Frank B. Winter, Eric C. Johnston, Hardik Patel