Abstract: A processor includes a first die, a second die connected to the first die with a microfluidic volume positioned between the first die and the second die, at least one pin fin positioned in the microfluidic volume, and a boiling enhancement surface feature positioned on a pin surface of the pin fin.

Abstract: A vapor recovery system comprises an inlet located at a first end of a fluid path configured to receive a fluid vapor to the vapor recovery system. The vapor recovery system comprises a condenser located on the fluid path and a scrubber located on the fluid path. The vapor recovery system comprises a composition sensor located on the fluid path between the scrubber and a second end of the fluid path. The composition sensor is configured to measure a composition of the fluid vapor. The vapor recovery system comprises an exhaust located at the second end of the fluid path configured to exhaust at least a portion of the fluid vapor from the fluid path at a composition having an amount of a working fluid below a working fluid threshold.

Abstract: A method for encoding data in a datacenter is provided that includes obtaining data to be encoded, encoding the data to a set of encoded spatiotemporal patterns, and outputting the set of encoded spatiotemporal patterns.

Abstract: A transport refrigeration system including a refrigeration unit for conditioning an area and a power system operably coupled to the refrigeration unit. The power system includes at least one fuel cell and a fuel source. At least a portion of one of the refrigeration unit and the power system is packaged into a replaceable module.

Abstract: A computing device may include a substrate. A computing device may include a processing unit supported by the substrate. A computing device may include an optical transmitter supported by the substrate and in electrical communication with the processing unit.

Abstract: A system may include a datacenter supervisory control system (SCS). A system may include at least one datacenter sensor in data communication with the SCS to communicate a datacenter state variable to the SCS. A system may include at least one environmental sensor in data communication with the SCS to communicate an environmental state variable to the SCS. A system may include a water aware controller in data communication with the SCS, wherein the water aware controller includes a predictor that receives a datacenter state input based on the datacenter state variable, the environmental state input based on the environmental state variable, and at least one user objective function, and the water aware controller transmits a selected action to the SCS to meet a setpoint based on the datacenter state input and the environmental state input.

Abstract: A thermal management system includes a high-pressure (HP) container, a low-pressure (LP) container in fluid communication with the HP container and having a fluid pressure less than the HP container, and a two-phase working fluid partially in the HP container and partially in the LP container. The two-phase working fluid has a vapor phase and a liquid phase. A pump is configured to move the working fluid through the system, and a condenser is configured to condense the vapor phase of the working fluid into the liquid phase.

Abstract: A vapor recovery system comprises an inlet located at a first end of a fluid path configured to receive a fluid vapor to the vapor recovery system. The vapor recovery system comprises a condenser located on the fluid path and a scrubber located on the fluid path. The vapor recovery system comprises a composition sensor located on the fluid path between the scrubber and a second end of the fluid path. The composition sensor is configured to measure a composition of the fluid vapor. The vapor recovery system comprises an exhaust located at the second end of the fluid path configured to exhaust at least a portion of the fluid vapor from the fluid path at a composition having an amount of a working fluid below a working fluid threshold.

Abstract: A thermal management system includes a server computer and a shell defining an immersion chamber. The shell contacts the server computer along a bottom side and lateral walls of the chamber, and the immersion chamber has an opening on a top side. The shell is connected to the server computer and a portion of the server computer defines at least a portion of the immersion chamber.

Abstract: A thermal management system includes a high-pressure (HP) container, a low-pressure (LP) container in fluid communication with the HP container and having a fluid pressure less than the HP container, and a two-phase working fluid partially in the HP container and partially in the LP container. The two-phase working fluid has a vapor phase and a liquid phase. A pump is configured to move the working fluid through the system, and a condenser is configured to condense the vapor phase of the working fluid into the liquid phase.

Abstract: A thermal management system for cooling electronic devices includes an immersion cooling system, a vapor buffer tank, and a liquid buffer tank. The immersion cooling system includes an immersion tank defining an immersion chamber, a working fluid in the immersion chamber, and a condenser. A liquid portion of the working fluid defines an immersion bath in the immersion chamber and a vapor portion defines a headspace above the immersion bath in the immersion chamber. The condenser condenses the vapor portion of the working fluid to the liquid portion of the working fluid. The vapor buffer tank is in fluid communication with the headspace, and a vapor valve selectively allows fluid communication between the vapor buffer tank and the headspace. The liquid buffer tank is in fluid communication with the immersion chamber, and a liquid valve selectively allows fluid communication between the liquid buffer tank and the immersion chamber.

Abstract: A thermal management system includes an air handling unit (AHU) configured to receive outside air (OA) from an OA intake, and water from a water source, where the AHU is configured to direct conditioned air toward a cold aisle and the AHU includes a modular adiabatic layer containing an evaporative media, and the modular adiabatic layer includes a plurality of subregions configured to be wetted by the evaporative media independently of one another.

Abstract: A device may include a body including: an internal volume configured to receive a working fluid, and an inner contact surface configured to transfer heat from a heat-generating component to the internal volume. A device may include a first zone of the internal volume including a first thermal management feature. A device may include a second zone of the internal volume including a second thermal management feature different from the first thermal management feature.

Abstract: A liquid-submersible thermal management system includes a cylindrical outer shell and an inner shell positioned in an interior volume of the outer shell. The cylindrical outer shell has a longitudinal axis oriented vertically relative to a direction of gravity, and the inner shell defines an immersion chamber. The liquid-submersible thermal management system a spine positioned inside the immersion chamber and oriented at least partially in a direction of the longitudinal axis with a heat-generating component located in the immersion chamber. A working fluid is positioned in the immersion chamber and at least partially surrounding the heat-generating component. The working fluid receives heat from the heat-generating component.

Abstract: A method for encoding data in a datacenter is provided that includes obtaining data to be encoded, encoding the data to a set of encoded spatiotemporal patterns, and outputting the set of encoded spatiotemporal patterns.

Abstract: A computing device may include a substrate. A computing device may include a processing unit supported by the substrate. A computing device may include an optical transmitter supported by the substrate and in electrical communication with the processing unit.

Abstract: A processor includes a first die, a second die connected to the first die with a microfluidic volume positioned between the first die and the second die, a wicking heat spreader positioned in the microfluidic volume; and a boiling enhancement surface feature positioned on at least one surface of the wicking heat spreader.

Abstract: A cold plate assembly for cooling a computing device includes a first cooling structure and a second cooling structure. The first cooling structure is configured to provide cooling from a flow of first coolant to a first temperature section of the computing device. The second cooling structure is connected to the first cooling structure and is configured to provide cooling from a flow of second coolant to a second temperature section of the computing device. The second temperature section has a lower temperature threshold than the first temperature section. The cold plate assembly includes a thermal barrier between the first cooling structure and the second cooling structure.

Abstract: A cold plate assembly for cooling a computing device includes a first cooling structure and a second cooling structure. The first cooling structure is configured to provide cooling from a flow of first coolant to a first temperature section of the computing device. The second cooling structure is connected to the first cooling structure and is configured to provide cooling from a flow of second coolant to a second temperature section of the computing device. The second temperature section has a lower temperature threshold than the first temperature section. The cold plate assembly includes a thermal barrier between the first cooling structure and the second cooling structure.

Abstract: A cold plate assembly for cooling a computing device includes a first cooling structure and a second cooling structure. The first cooling structure is configured to provide cooling from a flow of first coolant to a first temperature section of the computing device. The second cooling structure is connected to the first cooling structure and is configured to provide cooling from a flow of second coolant to a second temperature section of the computing device. The second temperature section has a lower temperature threshold than the first temperature section. The cold plate assembly includes a thermal barrier between the first cooling structure and the second cooling structure.