Abstract: A processor includes a first die, a second die connected to the first die with a microfluidic volume positioned between the first die and the second die, a wicking heat spreader positioned in the microfluidic volume; and a boiling enhancement surface feature positioned on at least one surface of the wicking heat spreader.

Abstract: A cold plate assembly for cooling a computing device includes a first cooling structure and a second cooling structure. The first cooling structure is configured to provide cooling from a flow of first coolant to a first temperature section of the computing device. The second cooling structure is connected to the first cooling structure and is configured to provide cooling from a flow of second coolant to a second temperature section of the computing device. The second temperature section has a lower temperature threshold than the first temperature section. The cold plate assembly includes a thermal barrier between the first cooling structure and the second cooling structure.

Abstract: A cold plate assembly for cooling a computing device includes a first cooling structure and a second cooling structure. The first cooling structure is configured to provide cooling from a flow of first coolant to a first temperature section of the computing device. The second cooling structure is connected to the first cooling structure and is configured to provide cooling from a flow of second coolant to a second temperature section of the computing device. The second temperature section has a lower temperature threshold than the first temperature section. The cold plate assembly includes a thermal barrier between the first cooling structure and the second cooling structure.

Abstract: A cold plate assembly for cooling a computing device includes a first cooling structure and a second cooling structure. The first cooling structure is configured to provide cooling from a flow of first coolant to a first temperature section of the computing device. The second cooling structure is connected to the first cooling structure and is configured to provide cooling from a flow of second coolant to a second temperature section of the computing device. The second temperature section has a lower temperature threshold than the first temperature section. The cold plate assembly includes a thermal barrier between the first cooling structure and the second cooling structure.

Abstract: A liquid-submersible thermal management system includes a cylindrical outer shell and an inner shell positioned in an interior volume of the outer shell. The cylindrical outer shell has a longitudinal axis oriented vertically relative to a direction of gravity, and the inner shell defines an immersion chamber. The liquid-submersible thermal management system a spine positioned inside the immersion chamber and oriented at least partially in a direction of the longitudinal axis with a heat-generating component located in the immersion chamber. A working fluid is positioned in the immersion chamber and at least partially surrounding the heat-generating component. The working fluid receives heat from the heat-generating component.

Abstract: A processor includes a first die, a second die connected to the first die with a microfluidic volume positioned between the first die and the second die, a wicking heat spreader positioned in the microfluidic volume; and a boiling enhancement surface feature positioned on at least one surface of the wicking heat spreader.

Abstract: A system may include a datacenter supervisory control system (SCS). A system may include at least one datacenter sensor in data communication with the SCS to communicate a datacenter state variable to the SCS. A system may include at least one environmental sensor in data communication with the SCS to communicate an environmental state variable to the SCS. A system may include a water aware controller in data communication with the SCS, wherein the water aware controller includes a predictor that receives a datacenter state input based on the datacenter state variable, the environmental state input based on the environmental state variable, and at least one user objective function, and the water aware controller transmits a selected action to the SCS to meet a setpoint based on the datacenter state input and the environmental state input.

Abstract: A device for harvesting ambient fluid includes a cool area and a hot area. The device includes an absorption material configured to absorb ambient fluid. The device includes a means for moving the absorption material between the hot area and the cool area based on a weight differential of the absorption material.

Abstract: A thermal management system includes an air handling unit (AHU) configured to receive outside air (OA) from an OA intake, and water from a water source, where the AHU is configured to direct conditioned air toward a cold aisle and the AHU includes a modular adiabatic layer containing an evaporative media, and the modular adiabatic layer includes a plurality of subregions configured to be wetted by the evaporative media independently of one another.

Abstract: A method of thermal management of a computing device includes immersing a first electronic component of the computing device in a first working fluid contained in a first volume, immersing a second electronic component of the computing device in a second working fluid contained in a second volume, and changing a pressure in the first volume to alter a boiling temperature of the first working fluid in the first volume.

Abstract: A thermal management system includes a server computer and a shell defining an immersion chamber. The shell contacts the server computer along a bottom side and lateral walls of the chamber, and the immersion chamber has an opening on a top side. The shell is connected to the server computer and a portion of the server computer defines at least a portion of the immersion chamber.

Abstract: A vapor recovery system comprises an inlet located at a first end of a fluid path configured to receive a fluid vapor to the vapor recovery system. The vapor recovery system comprises a condenser located on the fluid path and a scrubber located on the fluid path. The vapor recovery system comprises a composition sensor located on the fluid path between the scrubber and a second end of the fluid path. The composition sensor is configured to measure a composition of the fluid vapor. The vapor recovery system comprises an exhaust located at the second end of the fluid path configured to exhaust at least a portion of the fluid vapor from the fluid path at a composition having an amount of a working fluid below a working fluid threshold.

Abstract: A thermal management system includes a server computer and a shell defining an immersion chamber. The shell contacts the server computer along a bottom side and lateral walls of the chamber, and the immersion chamber has an opening on a top side. The shell is connected to the server computer and a portion of the server computer defines at least a portion of the immersion chamber.

Abstract: A system and method of managing an elevator system based on a location and status of a mobile device is provided. The method includes determining a current status of a mobile device, receiving a destination request from the mobile device, and dispatching an elevator car based on the destination request and the current status.

Abstract: A method for encoding data in a datacenter is provided that includes obtaining data to be encoded, encoding the data to a set of encoded spatiotemporal patterns, and outputting the set of encoded spatiotemporal patterns.

Abstract: A system may include a first node having a first display device configured to display a first spatiotemporal pattern. A system may include a second node having a second display device configured to display a second spatiotemporal pattern. A system may include a camera. A system may include a means for selectively imaging one of the first spatiotemporal pattern and the second spatiotemporal pattern with the camera.

Abstract: A method for encoding data in a datacenter is provided that includes obtaining data to be encoded, encoding the data to a set of encoded spatiotemporal patterns, and outputting the set of encoded spatiotemporal patterns.

Abstract: A liquid-submersible thermal management system includes a cylindrical outer shell and an inner shell positioned in an interior volume of the outer shell. The cylindrical outer shell has a longitudinal axis oriented vertically relative to a direction of gravity, and the inner shell defines an immersion chamber. The liquid-submersible thermal management system a spine positioned inside the immersion chamber and oriented at least partially in a direction of the longitudinal axis with a heat-generating component located in the immersion chamber. A working fluid is positioned in the immersion chamber and at least partially surrounding the heat-generating component. The working fluid receives heat from the heat-generating component.

Abstract: A thermal management system for cooling electronics includes an immersion tank, a working fluid in the immersion tank, a heat exchanger, a first fluid conduit, and a second fluid conduit. The heat exchanger is configured to transfer thermal energy from the working fluid to ambient air to cool the working fluid. The first fluid conduit provides fluid communication from the immersion tank to the heat exchanger, and the second fluid conduit provides fluid communication from the heat exchanger to a spray nozzle to spray working fluid into the immersion tank.

Abstract: A liquid-submersible thermal management system includes a shell, a heat-generating component, a working fluid, and at least one heat-dispersing element. The shell defines an immersion chamber where the heat-generating component is located in the immersion chamber. The working fluid is positioned in the immersion chamber and at least partially surrounds the heat-generating component so the working fluid receives heat from the heat-generating component. The at least one heat-dispersing element is positioned on exterior surface of the shell to conduct heat from the shell into the heat-dispersing element.