Patents by Inventor Eric C. Wang

Eric C. Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11913597
    Abstract: A product-display system for displaying and securing a retail product. The system may include a retainer having a retainer bracket and a retainer body coupled to the retainer bracket. A retaining cable may be coupled to the retainer body at an opening in the retainer body. A fastener that may be unfastened to release the product from the retainer may only be accessed through the opening of the retainer body such that when the retaining cable is coupled to the opening, no fasteners of the retainer may be visible or accessible. The system may also include a display stem for holding the retainer and product. The display stem may include a recess for receiving at least a portion of the retainer body. The retaining cable may extend through the display stem and may simultaneously transmit power and data to a displayed product. The retainer may be returned to and held on top of the display stem using a retaining cable.
    Type: Grant
    Filed: December 1, 2021
    Date of Patent: February 27, 2024
    Assignee: Apple Inc.
    Inventors: Sheng Yang, Eric W. Wang, Steven C. Michalske, Olivia Ching, Clayton R. Woosley, Samuel Wing Man Yuen, Paul Joseph Hack, Ricardo A Mariano, Chien Tsun Chen, George Tziviskos, Charles A. Schwalbach
  • Patent number: 8759422
    Abstract: An adhesive composition comprising elastomeric polymer, epoxy resin, reactive diluent, and filler, is suitable for use within the electronics industry, and in particular for wafer back side coating adhesives. The elastomeric polymer is a mixture of a vinyl elastomer and an epoxy elastomer; the reactive diluent is a combination of two or more diluents, one of which must have carbon to carbon unsaturation, providing cross-linking within the composition after cure; and the filler is a non-conductive filler.
    Type: Grant
    Filed: March 13, 2013
    Date of Patent: June 24, 2014
    Assignee: Henkel IP & Holding GmbH
    Inventors: Eric C. Wang, Kevin Harris Becker, Qizhuo Zhuo