Patents by Inventor Eric Chistison

Eric Chistison has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor packaging unit with sliding cage
    Patent number: 7326968
    Abstract: A semiconductor packaging unit mounts onto a board by solder joints. The unit includes, disposed along one axis, a semiconductor component having on a rear face protruding electrical connection lugs designed to be soldered onto the board and an external cage surrounding the component and having a rear edge designed to be soldered onto the board and a front part through which a front part of the component passes. The component and the cage are designed to axially slide with respect to one another in such a manner as to be brought into their soldering position with respect to the board and having complementary holding parts coming into contact and designed to hold them with respect to one another when they are axially removed from the soldering position and to free them with respect to one another when they are at the soldering position.
    Type: Grant
    Filed: March 19, 2007
    Date of Patent: February 5, 2008
    Assignees: STMicroelectronics S.A., STMicroelectronics R&D Ltd.
    Inventors: Rémi Brechignac, Jean-Luc Diot, Kevin Channon, Eric Chistison
  • Semiconductor packaging unit with sliding cage
    Publication number: 20070228558
    Abstract: A semiconductor packaging unit mounts onto a board by solder joints. The unit includes, disposed along one axis, a semiconductor component having on a rear face protruding electrical connection lugs designed to be soldered onto the board and an external cage surrounding the component and having a rear edge designed to be soldered onto the board and a front part through which a front part of the component passes. The component and the cage are designed to axially slide with respect to one another in such a manner as to be brought into their soldering position with respect to the board and having complementary holding parts coming into contact and designed to hold them with respect to one another when they are axially removed from the soldering position and to free them with respect to one another when they are at the soldering position.
    Type: Application
    Filed: March 19, 2007
    Publication date: October 4, 2007
    Applicants: STMicroelectronics S.A., STMicroelectronics R&D Ltd.
    Inventors: Remi Brechignac, Jean-Luc Diot, Kevin Channon, Eric Chistison