Abstract: A backpack having one or more flaps that are configured with a series of magnets is utilized to better secure utensils in place. A flap may be configured with external pouches, positioned on top of a base, inside which utensils are placed. Vertically and linearly aligned with the external pouches are magnets positioned within pockets of a magnet pouch positioned behind the base. The magnet pouch may be entirely sealed, covered, and inaccessible from the base's cover, such that utensils, such as knives, can be attracted to the magnets but the utensils only contacts the base layer. Such an arrangement and utilization of magnets can be utilized internally to the backpack, but also externally for external pockets such as, for example, the side, front, or rear pockets.

Abstract: A three-dimensional preview of content can be generated and presented at an electronic device in a three-dimensional environment. The three-dimensional preview of content can be presented concurrently with a two-dimensional representation of the content in a content generation environment presented in the three-dimensional environment. While the three-dimensional preview of content is presented in the three-dimensional environment, one or more affordances can be provided for interacting with the one or more computer-generated virtual objects of the three-dimensional preview. The one or more affordances may be displayed with the three-dimensional preview of content in the three-dimensional environment. The three-dimensional preview of content may be presented on a three-dimensional tray and the one or more affordances may be presented in a control bar or other grouping of controls outside the perimeter of the tray and/or along the perimeter of the tray.

Abstract: A three-dimensional preview of content can be generated and presented at an electronic device in a three-dimensional environment. The three-dimensional preview of content can be presented concurrently with a two-dimensional representation of the content in a content generation environment presented in the three-dimensional environment. While the three-dimensional preview of content is presented in the three-dimensional environment, one or more affordances can be provided for interacting with the one or more computer-generated virtual objects of the three-dimensional preview. The one or more affordances may be displayed with the three-dimensional preview of content in the three-dimensional environment. The three-dimensional preview of content may be presented on a three-dimensional tray and the one or more affordances may be presented in a control bar or other grouping of controls outside the perimeter of the tray and/or along the perimeter of the tray.

Abstract: A three-dimensional preview of content can be generated and presented at an electronic device in a three-dimensional environment. The three-dimensional preview of content can be presented concurrently with a two-dimensional representation of the content in a content generation environment presented in the three-dimensional environment. While the three-dimensional preview of content is presented in the three-dimensional environment, one or more affordances can be provided for interacting with the one or more computer-generated virtual objects of the three-dimensional preview. The one or more affordances may be displayed with the three-dimensional preview of content in the three-dimensional environment. The three-dimensional preview of content may be presented on a three-dimensional tray and the one or more affordances may be presented in a control bar or other grouping of controls outside the perimeter of the tray and/or along the perimeter of the tray.

Abstract: A method and apparatus for selecting Si wafer WP based on individual or multiple DFM decks for Si-feed-forward and Si-feed-back analysis are provided. Embodiments include generating markers for a wafer from an individual DFM deck; generating UCF Indexes; determining whether a representative marker corresponding to a UCF is a candidate for WP prediction; extracting markers corresponding to that UCF-Index (UEF data) from a candidate; performing a UCF-Index-based sampling on the extracted UEF data set if a number of markers in the extracted UEF data set is larger than an inspection requirement; adding a location of each marker or group of markers in the extracted UEF data set to a sitelist after the UCF-Index-based sampling; sending the sitelist to a foundry for metrology analysis on sitelist locations; and adding the sitelist locations and corresponding UCF Index and metrology parameters to a design analysis database for analyzing other wafers/UCF Indexes.

Abstract: A method and apparatus for selecting Si wafer WP based on individual or multiple DFM decks for Si-feed-forward and Si-feed-back analysis are provided. Embodiments include generating markers for a wafer from an individual DFM deck; generating UCF Indexes; determining whether a representative marker corresponding to a UCF is a candidate for WP prediction; extracting markers corresponding to that UCF-Index (UEF data) from a candidate; performing a UCF-Index-based sampling on the extracted UEF data set if a number of markers in the extracted UEF data set is larger than an inspection requirement; adding a location of each marker or group of markers in the extracted UEF data set to a sitelist after the UCF-Index-based sampling; sending the sitelist to a foundry for metrology analysis on sitelist locations; and adding the sitelist locations and corresponding UCF Index and metrology parameters to a design analysis database for analyzing other wafers/UCF Indexes.