Abstract: A method for dividing a package substrate into a plurality of device packages. The package substrate has a mount surface on the front side where a plurality of division lines are formed and a sealing layer formed on the back side, in which devices are sealed. The method includes a groove forming step of forming a groove along each division line on the mount surface of the package substrate so that the groove has a depth corresponding to a finished thickness of each device package, a burr removing step of removing burrs produced from electrodes in the groove forming step, and a grinding step of grinding the sealing layer of the package substrate so that a thickness of the package substrate is reduced to the finished thickness, after performing the burr removing step, thereby dividing the package substrate into the plural device packages.

Abstract: A method for dividing a package substrate into a plurality of device packages. The package substrate has a mount surface on the front side where a plurality of division lines are formed and a sealing layer formed on the back side, in which devices are sealed. The method includes a groove forming step of forming a groove along each division line on the mount surface of the package substrate so that the groove has a depth corresponding to a finished thickness of each device package, a burr removing step of removing burrs produced from electrodes in the groove forming step, and a grinding step of grinding the sealing layer of the package substrate so that a thickness of the package substrate is reduced to the finished thickness, after performing the burr removing step, thereby dividing the package substrate into the plural device packages.