Patents by Inventor Eric Clarence Peterson

Eric Clarence Peterson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • DATACENTER BYPRODUCT MANAGEMENT INTERFACE SYSTEM
    Publication number: 20180006964
    Abstract: Various methods and systems for implementing resource management for an infrastructure are provided. Resource management includes datacenter byproduct management interfaces, datacenter power management, datacenter operations optimization and infrastructure resource management. Resource management facilitates using and distributing physical resources, including incidental physical resources that are generated during operation of an infrastructure, based on a minimum threshold reserve of the physical resource associated with the operating the infrastructure. Resource management can include controlling an amount of the physical resource that is generated and an amount the physical resource that is reserved. The minimum threshold reserve in combination with the control over generating and reserving the physical resource help identify an allocable amount of the physical resource. Physical resources of an infrastructure are quantified to support resource management.
    Type: Application
    Filed: June 30, 2016
    Publication date: January 4, 2018
    Inventors: Lucas Neal Joppa, Ranveer Chandra, Eric Clarence Peterson, Mark B. Freeman, Sunjeev Kumar Pandey, Todd R. Rawlings, Peter Odongo Wangia, Sean Michael James
  • DATACENTER POWER MANAGEMENT SYSTEM
    Publication number: 20180004265
    Abstract: Various methods and systems for implementing resource management for an infrastructure are provided. Resource management includes datacenter byproduct management interfaces, datacenter power management, datacenter operations optimization and infrastructure resource management. Resource management facilitates using and distributing physical resources, including incidental physical resources that are generated during operation of an infrastructure, based on a minimum threshold reserve of the physical resource associated with the operating the infrastructure. Resource management can include controlling an amount of the physical resource that is generated and an amount the physical resource that is reserved. The minimum threshold reserve in combination with the control over generating and reserving the physical resource help identify an allocable amount of the physical resource. Physical resources of an infrastructure are quantified to support resource management.
    Type: Application
    Filed: June 30, 2016
    Publication date: January 4, 2018
    Inventors: Sean Michael James, David Thomas Gauthier, Eric Clarence Peterson, Lucas Neal Joppa, Ranveer Chandra, Teddy L. Bennett, Todd R. Rawlings, Brian A. Janous
  • Attachment of a single heat dissipation device to multiple components with vibration isolation
    Patent number: 6667885
    Abstract: A method and apparatus to attach multiple components to a common heat dissipation device. One embodiment of the invention involves a method to assemble a plurality of components on a substrate to a heat dissipation device. A second embodiment of the invention involves another method to assemble a plurality of components on a substrate to a heat dissipation device containing one or more heat-pipes. A third embodiment of the invention involves an assembled substrate with a plurality of electrical components attached to a common heat dissipation device.
    Type: Grant
    Filed: July 20, 2001
    Date of Patent: December 23, 2003
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Christopher Gregory Malone, Stephen Daniel Cromwell, Christian Laszlo Belady, Eric Clarence Peterson
  • Attachment of a single heat dissipation device to multiple components with vibration isolation
    Publication number: 20030016500
    Abstract: A method and apparatus to attach multiple components to a common heat dissipation device. One embodiment of the invention involves a method to assemble a plurality of components on a substrate to a heat dissipation device. A second embodiment of the invention involves another method to assemble a plurality of components on a substrate to a heat dissipation device containing one or more heat-pipes. A third embodiment of the invention involves an assembled substrate with a plurality of electrical components attached to a common heat dissipation device.
    Type: Application
    Filed: July 20, 2001
    Publication date: January 23, 2003
    Inventors: Christopher Gregory Malone, Stephen Daniel Cromwell, Christian Laszlo Belady, Eric Clarence Peterson