Patents by Inventor Eric Comer

Eric Comer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7778597
    Abstract: A telecommunications chassis, module, and repeater circuit for use with signals having data rates including STM-1 (155.52 megabits per second) are disclosed. The chassis provides structures for establishing shielding and heat dissipation for the circuitry modules it contains including an outer and an inner Faraday box with an integrated ventilation pattern for circulating air. The module provides its own structures for establishing shielding and heat dissipation including a Faraday box and a ventilation pattern. The repeater circuit provides the ability to bridge a data signal between a monitor jack of one device and a higher signal level input jack of another device through multiple amplification stages and circuit board structures. The telecommunications chassis, module, and repeater circuit can be used in conjunction.
    Type: Grant
    Filed: April 24, 2007
    Date of Patent: August 17, 2010
    Assignee: ADC Telecommunications, Inc.
    Inventors: Eric Sit, Robin Berg, Jr., Brian J. McClellan, Steven Skradde, David J. Streitz, John P. Anderson, Gary L. Steinkogler, Eric Comer
  • Publication number: 20070190935
    Abstract: A telecommunications chassis, module, and repeater circuit for use with signals having data rates including STM-1 (155.52 megabits per second) are disclosed. The chassis provides structures for establishing shielding and heat dissipation for the circuitry modules it contains including an outer and an inner Faraday box with an integrated ventilation pattern for circulating air. The module provides its own structures for establishing shielding and heat dissipation including a Faraday box and a ventilation pattern. The repeater circuit provides the ability to bridge a data signal between a monitor jack of one device and a higher signal level input jack of another device through multiple amplification stages and circuit board structures. The telecommunications chassis, module, and repeater circuit can be used in conjunction.
    Type: Application
    Filed: April 24, 2007
    Publication date: August 16, 2007
    Applicant: ADC Telecommunications, Inc.
    Inventors: Eric Sit, Robin Berg, Brian McClellan, Steven Skradde, David Streitz, John Anderson, Gary Steinkogler, Eric Comer
  • Patent number: 7224947
    Abstract: A telecommunications chassis, module, and repeater circuit for use with signals having data rates including STM-1 (155.52 megabits per second) are disclosed. The chassis provides structures for establishing shielding and heat dissipation for the circuitry modules it contains including an outer and an inner Faraday box with an integrated ventilation pattern for circulating air. The module provides its own structures for establishing shielding and heat dissipation including a Faraday box and a ventilation pattern. The repeater circuit provides the ability to bridge a data signal between a monitor jack of one device and a higher signal level input jack of another device through multiple amplification stages and circuit board structures. The telecommunications chassis, module, and repeater circuit can be used in conjunction.
    Type: Grant
    Filed: May 10, 2005
    Date of Patent: May 29, 2007
    Assignee: ADC Telecommunications, Inc.
    Inventors: Eric Sit, Robin Berg, Jr., Brian J. McClellan, Steven N. Skradde, David J. Streitz, John P. Anderson, Gary L. Steinkogler, Eric Comer
  • Publication number: 20050208904
    Abstract: A telecommunications chassis, module, and repeater circuit for use with signals having data rates including STM-1 (155.52 megabits per second) are disclosed. The chassis provides structures for establishing shielding and heat dissipation for the circuitry modules it contains including an outer and an inner Faraday box with an integrated ventilation pattern for circulating air. The module provides its own structures for establishing shielding and heat dissipation including a Faraday box and a ventilation pattern. The repeater circuit provides the ability to bridge a data signal between a monitor jack of one device and a higher signal level input jack of another device through multiple amplification stages and circuit board structures. The telecommunications chassis, module, and repeater circuit can be used in conjunction.
    Type: Application
    Filed: May 10, 2005
    Publication date: September 22, 2005
    Applicant: ADC Telecommunications, Inc.
    Inventors: Eric Sit, Robin Berg, Brian McClellan, Steven Skradde, David Streitz, John Anderson, Gary Steinkogler, Eric Comer
  • Patent number: 6907230
    Abstract: A telecommunications chassis, module, and repeater circuit for use with signals having data rates including STM-1 (155.52 megabits per second) are disclosed. The chassis provides structures for establishing shielding and heat dissipation for the circuitry modules it contains including an outer and an inner Faraday box with an integrated ventilation pattern for circulating air. The module provides its own structures for establishing shielding and heat dissipation including a Faraday box and a ventilation pattern. The repeater circuit provides the ability to bridge a data signal between a monitor jack of one device and a higher signal level input jack of another device through multiple amplification stages and circuit board structures. The telecommunications chassis, module, and repeater circuit can be used in conjunction.
    Type: Grant
    Filed: March 19, 2001
    Date of Patent: June 14, 2005
    Assignee: ADC Telecommunications, Inc.
    Inventors: Eric Sit, Robin Berg, Jr., Brian McClellan, Steven Skradde, David Streitz, John Anderson, Gary L. Steinkogler, Eric Comer
  • Publication number: 20020132576
    Abstract: A telecommunications chassis, module, and repeater circuit for use with signals having data rates including STM-1 (155.52 megabits per second) are disclosed. The chassis provides structures for establishing shielding and heat dissipation for the circuitry modules it contains including an outer and an inner Faraday box with an integrated ventilation pattern for circulating air. The module provides its own structures for establishing shielding and heat dissipation including a Faraday box and a ventilation pattern. The repeater circuit provides the ability to bridge a data signal between a monitor jack of one device and a higher signal level input jack of another device through multiple amplification stages and circuit board structures. The telecommunications chassis, module, and repeater circuit can be used in conjunction.
    Type: Application
    Filed: March 19, 2001
    Publication date: September 19, 2002
    Inventors: Eric Sit, Robin Berg, Brian McClellan, Steven Skradde, David Streitz, John Anderson, Gary L. Steinkogler, Eric Comer