Abstract: A method and apparatus for conditioning a polishing pad used in chemical mechanical planarization of semiconductor wafers is described. The apparatus includes a non-rotatable conditioning member configured to engage the polishing pad. The conditioning member includes a primary edge opposed to a secondary edge. The method includes providing a non-rotatable conditioning member configured to engage the polishing pad. The conditioning member includes a primary edge opposed to a secondary edge, wherein the primary edge and the secondary edge are both in contact with the polishing pad, and wherein the primary edge is generally parallel to the secondary edge. The method also includes moving the polishing pad in a forward direction, and pressing the conditioning member against the polishing pad.

Abstract: A new pneumatic torso armor and helmet for creating a visual display on a wearer for use at sporting events. The inventive device includes an inflatable body portion comprised of a front panel, a back panel, and a pair of shoulder panels. The front panel has a chest portion and an abdominal portion. A side of the front panel has an inflation tube extending outwardly therefrom. The front panel has couplers extending outwardly of lower side edges thereof. The back panel has corresponding couplers extending outwardly of lower side edges thereof for mating with the straps of the front panel. The shoulder panels have opposed lateral edges each having corresponding couplers disposed thereon for engaging the shoulder panels to a wearer.