Patents by Inventor Eric D. Ditmars

Eric D. Ditmars has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6467152
    Abstract: A microwave microstrip/waveguide transition structure includes a substrate, an elongated microstrip layer residing on a surface of the substrate, and an elongated integral hollow waveguide on the surface of the substrate. The microstrip layer and a side of the hollow waveguide constitute a single continuous piece of metal. The transition structure is fabricated by providing a substrate, depositing a metallic layer on the substrate, and depositing a metallic hollow housing continuous with a portion of a length of the metallic layer. The metallic hollow waveguide bounded by the metallic layer and the metallic hollow housing and having a contained volume therewithin is thereby defined.
    Type: Grant
    Filed: December 11, 1999
    Date of Patent: October 22, 2002
    Assignee: Hughes Electronics Corp.
    Inventors: Hector J. De Los Santos, Yu-Hua Kao Lin, Andrew H. Kwon, Eric D. Ditmars, John R. Dunwoody
  • Patent number: 6040611
    Abstract: A microelectromechanical (MEM) device includes a substrate and a flexible cantilever beam. The substrate has positioned thereon a first interconnection line separated by a first gap and a second interconnection line separated by a second gap parallel to the first interconnection line. The substrate also has positioned thereon a first and second primary control electrode wherein one of the first and second primary control electrodes is positioned on one side of one of the first and second interconnection lines and the other one is positioned on the other side of the other first and second interconnection lines. The flexible cantilever beam has a top surface and a bottom surface and a beam width slightly larger than the gap widths at the gaps. A flexible anchor is secured to the bottom surface of the beam at a center of the beam and attached to a center of the substrate so as to position the beam orthogonally to the first and second interconnection lines.
    Type: Grant
    Filed: September 10, 1998
    Date of Patent: March 21, 2000
    Assignee: Hughes Electonics Corporation
    Inventors: Hector J. De Los Santos, Yu-Hua Kao, Arturo L. Caigoy, Eric D. Ditmars