Abstract: A system and method for cooling a plurality of electronics cabinets having horizontally positioned electronics assemblies. The system includes at least one blower configured to direct air horizontally across the electronics assemblies, and at least one intercooler configured to extract heat from the air flow such that the system is room neutral, meaning that the ambient temperature remains constant during operation of the system. A plurality of chassis backplanes and power supplies may also include an intercooler, wherein the intercoolers are electronically controlled such that the system is room neutral.

Abstract: A system and method for cooling a plurality of electronics cabinets having horizontally positioned electronics assemblies. The system includes at least one blower configured to direct air horizontally across the electronics assemblies, and at least one intercooler configured to extract heat from the air flow such that the system is room neutral, meaning that the ambient temperature remains constant during operation of the system. A plurality of chassis backplanes and power supplies may also include an intercooler, wherein the intercoolers are electronically controlled such that the system is room neutral.

Abstract: A system and method for cooling a plurality of connectors interfacing electrical and optical signals to circuit boards in an electronics cabinet, such as backplane connectors routing signals to circuit boards housed in card cage assemblies. Heat pipes coupled to the connectors efficiently remove heat from the connectors and sink the connector heat to a cold junction of a liquid cooling system, which cooling system may also extract heat from air flow cooling the circuit boards such that the system is room neutral, meaning that the ambient temperature remains constant during operation of the system. The heat connector cooling system is effective where connectors are outside of an air flow cooling envelope that may cool the circuit boards.

Abstract: A system and method for cooling a plurality of electronics cabinets having horizontally positioned electronics assemblies. The system includes at least one blower configured to direct air horizontally across the electronics assemblies, and at least one intercooler configured to extract heat from the air flow such that the system is room neutral, meaning that the ambient temperature remains constant during operation of the system. A plurality of chassis backplanes and power supplies may also include an intercooler, wherein the intercoolers are electronically controlled such that the system is room neutral.

Abstract: A system and method for cooling a plurality of connectors interfacing electrical and optical signals to circuit boards in an electronics cabinet, such as backplane connectors routing signals to circuit boards housed in card cage assemblies. Heat pipes coupled to the connectors efficiently remove heat from the connectors and sink the connector heat to a cold junction of a liquid cooling system, which cooling system may also extract heat from air flow cooling the circuit boards such that the system is room neutral, meaning that the ambient temperature remains constant during operation of the system. The heat connector cooling system is effective where connectors are outside of an air flow cooling envelope that may cool the circuit boards.

Abstract: An example electronic assembly includes a substrate that has a first surface and a second surface. The first surface of the substrate includes a grounding ring. The electronic assembly further includes one or more electronic components that are mounted on the first surface of the substrate such that the grounding ring at least partially surrounds the electronic components(s). A heat sink engages the electronic component(s) and the grounding ring in order provide cooling and EMI shielding to the electronic components(s). In some embodiments, the grounding ring surrounds the entire electronic components(s) and the heat sink engages the entire grounding ring, although in other embodiments, the grounding ring may partially surround the electronic components(s) and/or the heat sink may engage just a portion of the grounding ring.

Abstract: The electronic assembly includes a substrate that has a first side and a second side. The electronic assembly further includes first and second electronic components that are mounted on the first side of the substrate. The first electronic component extends a different height above the first side of the substrate as the second electronic component. The electronic assembly further includes a heat sink that includes a base and fins which extend from the base. The base of the heat sink includes a formation which engages the second electronic component in order to maintain the base of the heat sink in substantially parallel relation to the substrate. In some embodiments, the formation in the base of the heat sink is a detent, while in other embodiments the formation in the base of the heat sink is a projection.

Abstract: Prior power converters have utilized discrete components mounted on circuit boards of differing designs. Failure of one or more of the components requires testing each component to determine which is faulty. The faulty component must then be replaced. This results in significant down time for the inverter and can require stocking a large number of specialized boards. In order to overcome these problems, an inverter is assembled using modular circuit boards. Each circuit board includes components mounted on a multilayer substrate and a heat exchanger which cools high power components. When a malfunction of a component occurs, the entire board containing the failed component may be readily replaced so that inverter down time is minimized. The use of modular circuit boards also reduces stocking requirements and inventory costs.

Abstract: Prior power converters have utilized discrete components mounted on circuit boards of different design. Failure of one or more of the components requires the components to be separately tested to determine which is faulty. The faulty component or the board containing same must then be replaced. This results in significant down time for the inverter and can require stocking of a large number of specialized boards. In order to overcome these problems, an inverter is assembled using a series of circuit boards of standardized type. Each circuit board includes separate layers which interconnect components mounted thereon together with a heat exchanger which cools high power components. When a malfunction of a component occurs, the entire board may be replaced so that inverter down time is minimized. Also, the use of standardized boards reduces stocking requirements and inventory costs.

Abstract: A power converter comprises a plurality of modular circuit boards assembled in a stacked relationship. The circuit boards include heat exchangers which are interconnected and cooling fluid is provided thereto to remove heat generated by high power devices.

Abstract: Prior power converters have utilized discrete components mounted on circuit boards of different design. Failure of one or more of the components requires the components to be separately tested to determine which is faulty. The faulty component or the board containing same must then be replaced. This results in significant down time for the inverter and can require stocking of a large number of specialized boards. In order to overcome these problems, an inverter is assembled using a series of circuit boards of standardized type. Each circuit board includes separate layers which interconnect components mounted thereon together with a heat exchanger which cools high power components. When a malfunction of a component occurs, the entire board may be replaced so that inverter down time is minimized. Also, the use of standardized boards reduces stocking requirements and inventory costs.