Patents by Inventor Eric D. Pefecto

Eric D. Pefecto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8450849
    Abstract: An electrical conductor is connected to a first microcircuit element having a first connector site axis and a second microcircuit having a second connector site axis. The first microcircuit and the second microcircuit are separated by and operatively associated with a first electrical insulator layer. The conductor and the first microcircuit element are separated by and operatively associated with a second electrical insulator layer. At least one of the first electrical insulator layer and the second electrical insulator layer comprise a polymeric material. The microcircuit includes a UBM and solder connection to a FBEOL via opening. Sufficiently separating the first connector site axis and the second connector site axis so they are not concentric, decouples the UBM and solder connection to the FBEOL via opening. This eliminates or minimizes electromigration and the white bump problems. A process comprises manufacturing the microcircuit.
    Type: Grant
    Filed: May 22, 2012
    Date of Patent: May 28, 2013
    Assignee: International Business Machines Corporation
    Inventors: Minhua Lu, Eric D. Pefecto, David L. Questad, Sudipta K. Ray
  • Publication number: 20120286433
    Abstract: An electrical conductor is connected to a first microcircuit element having a first connector site axis and a second microcircuit having a second connector site axis. The first microcircuit and the second microcircuit are separated by and operatively associated with a first electrical insulator layer. The conductor and the first microcircuit element are separated by and operatively associated with a second electrical insulator layer. At least one of the first electrical insulator layer and the second electrical insulator layer comprise a polymeric material. The microcircuit includes a UBM and solder connection to a FBEOL via opening. Sufficiently separating the first connector site axis and the second connector site axis so they are not concentric, decouples the UBM and solder connection to the FBEOL via opening. This eliminates or minimizes electromigration and the white bump problems. A process comprises manufacturing the microcircuit.
    Type: Application
    Filed: May 22, 2012
    Publication date: November 15, 2012
    Applicant: International Business Machines Corporation
    Inventors: Minhua Lu, Eric D. Pefecto, David L. Questad, Sudipta K. Ray
  • Patent number: 8227918
    Abstract: A microcircuit article of manufacture comprises an electrical conductor electrically connected to both a first microcircuit element at a site comprising a first connector site having a first connector site axis and a second microcircuit element at a site comprising a second connector site having a second connector site axis. The first microcircuit element and the second microcircuit element are separated by and operatively associated with a layer comprising a first electrical insulator, whereas the conductor and the first microcircuit element are separated by and operatively associated with a layer comprising a second electrical insulator. At least one of the first electrical insulator layer and the second electrical insulator layer comprise a polymeric electrical insulator. In another embodiment, both electrical insulator layers comprise polymeric insulator layers. The microcircuit includes a UBM and solder connection to a FBEOL via opening.
    Type: Grant
    Filed: September 16, 2009
    Date of Patent: July 24, 2012
    Assignee: International Business Machines Corporation
    Inventors: Minhua Lu, Eric D. Pefecto, David L. Questad, Sudipta K. Ray