Patents by Inventor Eric D. Torniainen

Eric D. Torniainen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190111698
    Abstract: A fluid ejection device may include a first channel having a first end and a second end, a first drop ejector along the first channel, a second channel having a first end and a second end, a second drop ejector along the second channel, a third channel extending between and connecting the first end of the first channel and the first end of the second channel, a fourth channel extending between and connecting the second end of the first channel and the second end of the second channel and a fifth channel extending between and connecting the third channel and the fourth channel.
    Type: Application
    Filed: December 11, 2018
    Publication date: April 18, 2019
    Inventors: Alexander Govyadinov, Eric D. Torniainen, David P. Markel
  • Patent number: 9963739
    Abstract: In one embodiment, a polymerase chain reaction (PCR) system includes a mixture chamber, a denature chamber, an annealing chamber, an extension chamber, and a product chamber, that are fluidically coupled to one another through a plurality of microfluidic channels. An inertial pump is associated with each microfluidic channel, and each inertial pump includes a fluid actuator integrated asymmetrically within its associated microfluidic channel. The fluid actuators are capable of selective activation to circulate fluid between the chambers in a controlled cycle.
    Type: Grant
    Filed: March 23, 2011
    Date of Patent: May 8, 2018
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Pavel Kornilovich, Eric D. Torniainen, Alexander Govyadinov, David P. Markel
  • Publication number: 20130286104
    Abstract: A thermal fluid-ejection mechanism includes a substrate having a top surface. A cavity formed within the substrate has one or more sidewalls and a floor. The angle of the sidewalls from the floor is greater than or equal to nominally ninety degrees. The thermal fluid-ejection mechanism includes a patterned conductive layer on one or more of the substrate's top surface and the cavity's sidewalls. The thermal fluid-ejection mechanism includes a patterned resistive layer on the sidewalls of the cavity. The patterned resistive layer is located over the patterned conductive layer where the patterned conductive layer is formed on the sidewalls of the cavity. The patterned resistive layer is formed as a heating resistor of the thermal-fluid ejection mechanism. The conductive layer is formed as a conductor of the thermal-fluid ejection mechanism, to permit electrical activation of the heating resistor to cause fluid to be ejected from the thermal fluid-ejection mechanism.
    Type: Application
    Filed: January 31, 2011
    Publication date: October 31, 2013
    Inventors: Peter Mardilovich, Lawrence H. White, Eric D. Torniainen