Abstract: In accordance with illustrative embodiments, a sensing system includes: a flexible substrate, at least one sensor device, a chip device, and at least one electrical line, the at least one electrical line electrically connecting the chip device and the at least one sensor device. The at least one sensor device, the chip device, and the at least one electrical line are integrated into the flexible substrate.

Abstract: A carrier material for vinyl floor covering, wherein the carrier material includes a nonwoven layer containing at least 50 wt. % of thermoplastic fibers and a scrim for eliminating wrinkles in the vinyl floor covering. The scrim includes weft yarns having a linear density of 28 tex or less. The carrier material prevents the formation of surface irregularities and printing errors in the vinyl floor covering.

Abstract: The present invention provides a sensing system, a smart wearing arrangement and a method of fabricating a sensing system. In accordance with illustrative embodiments, the sensing system comprises: a flexible substrate, at least one sensor device, a chip device, and at least one electrical line, the at least one electrical line electrically connecting the chip device and the at least one sensor device. Herein, the at least one sensor device, the chip device, and the at least one electrical line are integrated into the flexible substrate.

Abstract: A carrier material for vinyl floor covering, wherein the carrier material includes a nonwoven layer containing at least 50 wt. % of thermoplastic fibers and a scrim for eliminating wrinkles in the vinyl floor covering. The scrim includes weft yarns having a linear density of 28 tex or less. The carrier material prevents the formation of surface irregularities and printing errors in the vinyl floor covering.

Abstract: The present invention provides a non-twisted yarn and an extrusion coated reinforcement yarn and their methods of manufacture, by coating non-twisted glass filaments with a sizing composition and combining the filaments together side-by-side to provide a sized non-twisted yarn, wherein the sizing composition becomes ductile in a molten thermoplastic resin to free the non-twisted glass filaments for radially inward movement while in the molten thermoplastic resin to provide the non-twisted yarn with an essentially round cross-section suitable for extrusion coating with the molten thermoplastic resin.

Abstract: A method for producing a smartcard body for receiving a semiconductor chip includes forming at least one lead frame of the smartcard body in a carrier material connected by at least one material strip. Surrounding the at least one lead frame is an electrically insulating casing having a cavity for receiving the semiconductor chip. Either before or during the forming of the casing, the at least one material strip is separated or severed, so that the material strip is separated into a first strip part connected with the carrier material and a second strip part connected with the lead frame forming an interspace there between. When forming the casing at least a portion of the first strip part as well as at least a portion of the second strip part of the at least one material strip is comprised by the casing.

Abstract: A method for producing a smartcard body for receiving a semiconductor chip includes forming at least one lead frame of the smartcard body in a carrier material connected by at least one material strip. Surrounding the at least one lead frame is an electrically insulating casing having a cavity for receiving the semiconductor chip. Either before or during the forming of the casing, the at least one material strip is separated or severed, so that the material strip is separated into a first strip part connected with the carrier material and a second strip part connected with the lead frame forming an interspace there between. When forming the casing at least a portion of the first strip part as well as at least a portion of the second strip part of the at least one material strip is comprised by the casing.

Abstract: The present invention provides a non-twisted yarn and an extrusion coated reinforcement yarn and their methods of manufacture, by coating non-twisted glass filaments with a sizing composition and combining the filaments together side-by-side to provide a sized non-twisted yarn, wherein the sizing composition becomes ductile in a molten thermoplastic resin to free the non-twisted glass filaments for radially inward movement while in the molten thermoplastic resin to provide the non-twisted yarn with an essentially round cross-section suitable for extrusion coating with the molten thermoplastic resin.

Abstract: The invention concerns a process for preparing a complex sheet comprising a layer of drylaid glass fibres and a layer of organic fibres, comprising: mechanical needling or fluid entanglement, e.g. hydroentanglement, of a nonwoven fabric of continuous organic fibres and of a veil of non-preconsolidated continuous glass fibres, the said nonwoven fabric of organic fibres and the said veil of glass fibres being juxtaposed and the said needles respectively the fluid, water jets being sent from the same side as the nonwoven fabric of organic fibres, in order to make a sheet; and then application of a binder to the bilayer. The so obtained complex fibrous structure shows a low tendency to delaminate and can be impregnated with asphalt or bitumen, and used in the field of roofing, sealing covering or membranes.

Abstract: The invention concerns a process for preparing a complex sheet comprising a layer of drylaid glass fibers and a layer of organic fibers, comprising: mechanical needling or fluid entanglement, e.g. hydroentanglement, of a nonwoven fabric of continuous organic fibers and of a veil of non-preconsolidated continuous glass fibers, the said nonwoven fabric of organic fibers and the said veil of glass fibers being juxtaposed and the said needles respectively the fluid, water jets being sent from the same side as the nonwoven fabric of organic fibers, in order to make a sheet; and then application of a binder to the bilayer. The so obtained complex fibrous structure shows a low tendency to delaminate and can be impregnated with asphalt or bitumen, and used in the field of roofing, sealing covering or membranes.

Abstract: An apparatus for protecting an array of pins of an electronic device is provided. The apparatus includes a pin protector defining an array of holes therethrough, wherein each hole is configured to receive one of the pins. The apparatus also comprises a spring element configured to bias the pin protector away from the electronic device toward an end of each of the pins. The spring element is also configured to allow the pin protector to be retracted toward the electronic device to expose the pins for insertion into a socket or similar component.

Abstract: An apparatus for protecting an array of pins of an electronic device is provided. The apparatus includes a pin protector defining an array of holes therethrough, wherein each hole is configured to receive one of the pins. The apparatus also comprises a spring element configured to bias the pin protector away from the electronic device toward an end of each of the pins. The spring element is also configured to allow the pin protector to be retracted toward the electronic device to expose the pins for insertion into a socket or similar component.

Abstract: The invention concerns a process for preparing a complex sheet comprising a layer of drylaid glass fibres and a layer of organic fibres, comprising: mechanical needling or fluid entanglement, e.g. hydroentanglement, of a nonwoven fabric of continuous organic fibres and of a veil of non-preconsolidated continuous glass fibres, the said nonwoven fabric of organic fibres and the said veil of glass fibres being juxtaposed and the said needles respectively the fluid, water jets being sent from the same side as the nonwoven fabric of organic fibres, in order to make a sheet; and then application of a binder to the bilayer. The so obtained complex fibrous structure shows a low tendency to delaminate and can be impregnated with asphalt or bitumen, and used in the field of roofing, sealing covering or membranes.

Abstract: A process for preparing a complex sheet including a layer of drylaid glass fibers and a layer of organic fibers. The process includes mechanical needling or fluid entanglement, e.g. hydroentanglement, of a nonwoven fabric of continuous organic fibers and of a veil of non-preconsolidated continuous glass fibers, the nonwoven fabric of organic fibers and the veil of glass fibers being juxtaposed and needles being sent from the same side as the nonwoven fabric of organic fibers, to make a sheet, and then application of a binder to the bilayer. The so obtained complex fibrous structure shows a low tendency to delaminate and can be impregnated with asphalt or bitumen, and can be used in the field of roofing, sealing covering, or membranes.

Abstract: This invention relates to an integrated circuit device, in particular for manufacturing smart card electronic units for smart cards. It comprises: an active layer (32) including a semiconductor material within which integrated circuits are formed and having a face (34) provided with a plurality of electrical connection terminals (36) and a second face, wherein said face has a thickness smaller than 100 ?m, and a complementary layer (40) having a first face (42) attached to the active face of the active layer, a second face (44) and a side surface (48), wherein said complementary layer includes a plurality of recesses (46), each recess extending through the whole thickness of the complementary layer, and extending from a contact terminal (36) to said side surface (48).

Abstract: A process for preparing a complex sheet including a layer of drylaid glass fibers and a layer of organic fibers. The process includes mechanical needling or fluid entanglement, e.g. hydroentanglement, of a nonwoven fabric of continuous organic fibers and of a veil of non-preconsolidated continuous glass fibers, the nonwoven fabric of organic fibers and the veil of glass fibers being juxtaposed and needles being sent from the same side as the nonwoven fabric of organic fibers, to make a sheet, and then application of a binder to the bilayer. The so obtained complex fibrous structure shows a low tendency to delaminate and can be impregnated with asphalt or bitumen, and can be used in the field of roofing, sealing covering, or membranes.

Abstract: The invention involves a card, including a card body including at least three laminated plastic layers directly superimposed on each other, a second layer being a layer in polyethylene terephthalate glycol placed between a first layer and a third layer, the first layer and third layer being of a chemical nature different from that of said second layer, and an electronic module being incorporated in a cavity of the card body, the module including an integrated circuit, where the thickness of the second layer is of the same order of magnitude as that of the first and third layers, and wherein the cavity extends into the second layer from the first layer.

Abstract: An electronic micropackage for an electronic memory card, particularly applicable to large-sized semiconductor chips. The micropackage includes a semiconductor chip disposed on a first face of an insulating support, and electrical contact zones extending along a plane defined by a second face of the insulating support. The semiconductor chip is connected to the electrical contact zones via connection wires. A metal strip is provided with cut-outs defining the electrical contact zones. A strip of insulating material is disposed on one face of the metal strip, the strip of insulating material constituting said insulating support, and leaving uncovered, at least in part, the electrical contact zones. A housing for the semiconductor chip, surrounding the insulating support and obstructing those cut-outs in the metal strip which are inside the housing and which are not obstructed by the insulating support.