Patents by Inventor Eric Daniel Fields

Eric Daniel Fields has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Modular sensor assembly for vehicles
    Patent number: 11550035
    Abstract: In one embodiment, a modular sensor assembly configured for mounting on a vehicle includes a first set of sensors and a second set of sensors. The modular sensor assembly includes a coordinate frame baseplate including a continuous surface, and sensor mounting elements coupled to the continuous surface for mounting the first set of sensors at a first height. The coordinate frame baseplate includes a sensor platform configured for mounting the second set of sensors at a second height. The first set of sensors and the second set of sensors are coupled to the coordinate frame baseplate so as to impart a common coordinate frame for the first set of sensors mounted at the first height and the second set of sensors mounted at the second height. The modular sensor assembly includes a bridging support structure coupled to the coordinate frame baseplate and capable of being mounted on a vehicle.
    Type: Grant
    Filed: March 30, 2020
    Date of Patent: January 10, 2023
    Assignee: Woven Planet North America, Inc.
    Inventors: Eric Daniel Fields, Alexander Charles Granieri, Alfred Charles Jones, II, Marco Antonio Marroquín, Kevin David Page
  • MODULAR SENSOR ASSEMBLY FOR VEHICLES
    Publication number: 20210302541
    Abstract: In one embodiment, a modular sensor assembly configured for mounting on a vehicle includes a first set of sensors and a second set of sensors. The modular sensor assembly includes a coordinate frame baseplate including a continuous surface, and sensor mounting elements coupled to the continuous surface for mounting the first set of sensors at a first height. The coordinate frame baseplate includes a sensor platform configured for mounting the second set of sensors at a second height. The first set of sensors and the second set of sensors are coupled to the coordinate frame baseplate so as to impart a common coordinate frame for the first set of sensors mounted at the first height and the second set of sensors mounted at the second height. The modular sensor assembly includes a bridging support structure coupled to the coordinate frame baseplate and capable of being mounted on a vehicle.
    Type: Application
    Filed: March 30, 2020
    Publication date: September 30, 2021
    Inventors: Eric Daniel Fields, Alexander Charles Granieri, Alfred Charles Jones, II, Marco Antonio Marroquín, Kevin David Page
  • Sensor component cover
    Patent number: D919461
    Type: Grant
    Filed: June 28, 2019
    Date of Patent: May 18, 2021
    Assignee: Lyft, Inc.
    Inventors: Alfred Charles Jones, II, Eric Daniel Fields, Steve Chen, David Bearl DeVore, Steven Son Khau, David Timothy Milton
  • Sensor array enclosure
    Patent number: D931126
    Type: Grant
    Filed: June 28, 2019
    Date of Patent: September 21, 2021
    Assignee: Woven Planet North America, Inc.
    Inventors: Alfred Charles Jones, II, Eric Daniel Fields, Steve Chen, David Bearl DeVore, Steven Son Khau, David Timothy Milton
  • Sensor assembly
    Patent number: D1019432
    Type: Grant
    Filed: February 28, 2020
    Date of Patent: March 26, 2024
    Assignee: Woven by Toyota, U.S., Inc.
    Inventors: Eric Daniel Fields, Alfred Charles Jones, II, Kevin David Page, Alexander Charles Granieri, Johan Ulrich Lewin Jessen, David Timothy Milton