Patents by Inventor Eric David FORONDA

Eric David FORONDA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package comprising a substrate and a high-density interconnect integrated device coupled to the substrate
    Patent number: 11605594
    Abstract: A package comprising a substrate, an integrated device, and an interconnect integrated device. The substrate includes a first surface and a second surface. The substrate further includes a plurality of interconnects. The integrated device is coupled to the substrate. The interconnect integrated device is coupled to a surface of the substrate. The integrated device, the interconnect integrated device and the substrate are configured to provide an electrical path for an electrical signal of the integrated device, that travels through at least the substrate, then through the interconnect integrated device and back through the substrate.
    Type: Grant
    Filed: September 10, 2020
    Date of Patent: March 14, 2023
    Assignee: QUALCOMM INCORPORATED
    Inventors: Ryan Lane, Li-Sheng Weng, Charles David Paynter, Eric David Foronda
  • PACKAGE COMPRISING A SUBSTRATE AND A HIGH-DENSITY INTERCONNECT INTEGRATED DEVICE COUPLED TO THE SUBSTRATE
    Publication number: 20210296246
    Abstract: A package comprising a substrate, an integrated device, and an interconnect integrated device. The substrate includes a first surface and a second surface. The substrate further includes a plurality of interconnects. The integrated device is coupled to the substrate. The interconnect integrated device is coupled to a surface of the substrate. The integrated device, the interconnect integrated device and the substrate are configured to provide an electrical path for an electrical signal of the integrated device, that travels through at least the substrate, then through the interconnect integrated device and back through the substrate.
    Type: Application
    Filed: September 10, 2020
    Publication date: September 23, 2021
    Inventors: Ryan LANE, Li-Sheng WENG, Charles David PAYNTER, Eric David FORONDA