Abstract: Practical method for constructing materials composed of layers that are a few nanometers thick is disclosed which comprises of plating a substrate with layers of substantially a first metal and substantially a second metal using an electrolytic plating process and using plating cell(s) to locally plate the layers by alternating multiple cells with different plating solutions or alternating plating solutions in a cell.

Abstract: A fingerprint reader includes a display screen composed of an array of energy emitting pixels covered by a transparent cover, at least one sensor coupled along an edge of the display screen, a display driver directing the array of energy emitting pixels of the display screen to illuminate in a predetermined sequence, and a microprocessor in communication with the display driver and the at least one sensor. The microprocessor knows the location of the energy emitting pixel being illuminated and the specific time at which the illumination occurs. In use, and when at least one finger is placed on the transparent cover and the display driver is activated, energy from each energy emitting pixel sequentially illuminated is reflected off the fingerprint to the at least one sensor. The energy received at the at least one sensor is at different intensity levels depending upon the ridges and valleys of the at least one fingerprint.

Abstract: A fingerprint reader includes a display screen composed of an array of energy emitting pixels covered by a transparent cover, at least one sensor coupled along an edge of the display screen, a display driver directing the array of energy emitting pixels of the display screen to illuminate in a predetermined sequence, and a microprocessor in communication with the display driver and the at least one sensor. The microprocessor knows the location of the energy emitting pixel being illuminated and the specific time at which the illumination occurs. In use, and when at least one finger is placed on the transparent cover and the display driver is activated, energy from each energy emitting pixel sequentially illuminated is reflected off the fingerprint to the at least one sensor. The energy received at the at least one sensor is at different intensity levels depending upon the ridges and valleys of the at least one fingerprint.

Abstract: A fingerprint reader includes a display screen composed of an array of energy emitting pixels covered by a transparent cover, at least one sensor coupled along an edge of the display screen, a display driver directing the array of energy emitting pixels of the display screen to illuminate in a predetermined sequence, and a microprocessor in communication with the display driver and the at least one sensor. The microprocessor knows the location of the energy emitting pixel being illuminated and the specific time at which the illumination occurs. In use, and when at least one finger is placed on the transparent cover and the display driver is activated, energy from each energy emitting pixel sequentially illuminated is reflected off the fingerprint to the at least one sensor. The energy received at the at least one sensor is at different intensity levels depending upon the ridges and valleys of the at least one fingerprint.

Abstract: A fingerprint reader includes a display screen composed of an array of energy emitting pixels covered by a transparent cover, at least one sensor coupled along an edge of the display screen, a display driver directing the array of energy emitting pixels of the display screen to illuminate in a predetermined sequence, and a microprocessor in communication with the display driver and the at least one sensor. The microprocessor knows the location of the energy emitting pixel being illuminated and the specific time at which the illumination occurs. In use, and when at least one finger is placed on the transparent cover and the display driver is activated, energy from each energy emitting pixel sequentially illuminated is reflected off the fingerprint to the at least one sensor. The energy received at the at least one sensor is at different intensity levels depending upon the ridges and valleys of the at least one fingerprint.

Abstract: A fingerprint reader includes a display screen composed of an array of energy emitting pixels covered by a transparent cover, at least one sensor coupled along an edge of the display screen, a display driver directing the array of energy emitting pixels of the display screen to illuminate in a predetermined sequence, and a microprocessor in communication with the display driver and the at least one sensor. The microprocessor knows the location of the energy emitting pixel being illuminated and the specific time at which the illumination occurs. In use, and when at least one finger is placed on the transparent cover and the display driver is activated, energy from each energy emitting pixel sequentially illuminated is reflected off the fingerprint to the at least one sensor. The energy received at the at least one sensor is at different intensity levels depending upon the ridges and valleys of the at least one fingerprint.

Abstract: A fingerprint reader includes a display screen composed of an array of energy emitting pixels covered by a transparent cover, at least one sensor coupled along an edge of the display screen, a display driver directing the array of en erg emitting pixels of the display screen to illuminate in a predetermined sequence, and a microprocessor in communication with the display driver and the at least one sensor. The microprocessor knows the location of the energy emitting pixel being illuminated and the specific time at which the illumination occurs. In use, and when at least one finger is placed on the transparent cover and the display driver is activate energy from each energy emitting pixel sequentially illuminated is reflected off the fingerprint to the at least one sensor. The energy received at the at least one sensor is at different intensity levels depending upon the ridges and valleys of the at least one fingerprint.

Abstract: An improvement to the optical performance of a digital fingerprint scanner is disclosed. The invention evens out the illumination while reducing unwanted artifacts. This results in a “clean” image with an improved S/N ratio, the purity of the captured image offers the ancillary benefit of lowering the overall power requirements of the system while having direct positive impacts on improving accuracy and speed in the fingerprint recognition.

Abstract: A metallic or an electrical trace having a terminus and a stress relief bend formed in the trace adjacent the terminus. The electrical trace may have a portion carried by a flexible substrate to form a flexible circuit. The stress relief bend may be free floating and extend from the flexible substrate or may be encapsulated by the flexible substrate. The electrical circuit and the flexible circuit each have a generally planar portion extending in the X and Y axis, with the stress relief bend projecting into the Z axis. This allows electrical traces to be spaced with a very narrow pitch because the stress relief bend does not consume any valuable real estate on the flexible circuit or the substrate to which the electrical trace is applied.

Abstract: A modular, snap-together clamping system for electrically interconnecting two printed circuit boards using a flexible circuit is provided. The clamping system comprises two inboard clamp members which are configured to cooperate with two generally complimentary outboard clamp members, so as to capture a portion of each of the printed circuit boards along with two end portions of the flexible circuit between the inboard clamp members and the outboard clamp members in a manner which facilitates electrical connection of each of the two printed circuit boards with the flexible circuit. The inboard clamp members are also configured to facilitate attachment of an interchangeable spacer thereto. The spacer is configured to facilitate desired positioning of the two printed circuit boards with respect to one another.

Abstract: A modular, snap-together clamping system for electrically interconnecting two printed circuit boards using a flexible circuit is provided. The clamping system comprises two inboard clamp members which are configured to cooperate with two generally complimentary outboard clamp members, so as to capture a portion of each of the printed circuit boards along with two end portions of the flexible circuit between the inboard clamp members and the outboard clamp members in a manner which facilitates electrical connection of each of the two printed circuit boards with the flexible circuit. The inboard clamp members are also configured to facilitate attachment of an interchangeable spacer thereto. The spacer is configured to facilitate desired positioning of the two printed circuit boards with respect to one another.

Abstract: A nanolaminate structure comprises a plurality of adjacent metal layers with each layer having a thickness of less than about 1000 nanometers. The composition of the adjacent metal layers alternates between a first metal and a second metal, where at least one mechanical property of the nanolaminate is improved over the same mechanical property of the first and second metal.

Abstract: A metallic or an electrical trace having a terminus and a stress relief bend formed in the trace adjacent the terminus. The electrical trace may have a portion carried by a flexible substrate to form a flexible circuit. The stress relief bend may be free floating and extend from the flexible substrate or may be encapsulated by the flexible substrate. The electrical circuit and the flexible circuit each have a generally planar portion extending in the X and Y axis, with the stress relief bend projecting into the Z axis. This allows electrical traces to be spaced with a very narrow pitch because the stress relief bend does not consume any valuable real estate on the flexible circuit or the substrate to which the electrical trace is applied.

Abstract: A Z-axis electrical interconnect includes a flexible printed circuit folded into a U-shape. The Z-axis electrical interconnect also includes a plurality of raised interconnection members arranged on the flexible printed circuit in a predetermined pattern and a circuit trace interconnecting the pair of raised interconnection members. The Z-axis electrical interconnect further includes a spring fixedly positioned on the flexible printed circuit to maintain the U-shape.

Abstract: A Z-axis electrical interconnect includes a flexible printed circuit folded into a U-shape. The Z-axis electrical interconnect also includes a plurality of raised interconnection members arranged on the flexible printed circuit in a predetermined pattern and a circuit trace interconnecting the pair of raised interconnection members. The Z-axis electrical interconnect further includes a spring fixedly positioned on the flexible printed circuit to maintain the U-shape.

Abstract: A metallic or an electrical trace having a terminus and a stress relief bend formed in the trace adjacent the terminus. The electrical trace may have a portion carried by a flexible substrate to form a flexible circuit. The stress relief bend may be free floating and extend from the flexible substrate or may be encapsulated by the flexible substrate. The electrical circuit and the flexible circuit each have a generally planar portion extending in the X and Y axis, with the stress relief bend projecting into the Z axis. This allows electrical traces to be spaced with a very narrow pitch because the stress relief bend does not consume any valuable real estate on the flexible circuit or the substrate to which the electrical trace is applied.

Abstract: A chip scale package includes a mandrel built flexible circuit having a circuit trace on a first surface and an aperture extending therethrough. The chip scale package includes a pad covering the aperture on the first surface of the flexible circuit and a raised interconnection member extending outwardly from the pad. The chip scale package also includes a chip secured to a second surface of the flexible circuit, such that the chip is electrically connected to the pad.

Abstract: The present invention includes stack flexible circuit layers having raised features or bumps for Z-axis interconnection to another circuit layer or electrical component. An intermediate or adhesive layer separates each circuit layer. The multiple layers are stacked with the raised features from one layer aligning with pads of an overlying or underlying layer and are laminated so that the raised features pierce the intermediate or adhesive layer and make electrical contact with the corresponding pad of the adjacent circuit layer. The raised features may have a shape sufficient to penetrate the intermediate and/or the adhesive layer allowing blind vias to be made without pre-drilling the intermediate or adhesive layers. The intermediate layer of film can have a function other than or in addition to that of an adhesive.

Abstract: Disclosed is a flexible substrate having a thermal contact that provides a continuous high thermal conductivity path from a heat generating component to a heat sink. In one embodiment, the thermal contact includes a metallic trace including a raised feature of thermally conductive material. A solder ball or fillet may be used to make a connection between the raised feature and the heat generating component or between the raised feature and the underlying heat sink or both.

Abstract: A variable rate pressure sensitive electrical device or switch. The switch includes a first substrate and a plurality of electrical circuit traces thereon. A first electrical trace is provided having a first set of raised contact features or bumps projecting from a prevalent planar portion of first electrical trace. At least a second electrical trace is provided having a second set of raised contact features or bumps extending above a planar portion of second electrical trace. The first and second electrical traces and associated raised contact features are constructed and arranged so that the height of the first set of raised contact features is greater than the height of the second set of raised contact features. A second substrate is provided with an electrically conductive element.