Patents by Inventor Eric Delaurentis

Eric Delaurentis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process kit for improved power coupling through a workpiece in a semiconductor wafer processing system
    Patent number: 7163607
    Abstract: Apparatus for supporting a substrate such as a semiconductor wafer in a process chamber to improve power coupling through the substrate. The apparatus contains a pedestal assembly and a pedestal cover positioned over the top surface of and circumscribing the pedestal assembly for electrically isolating the pedestal assembly. The pedestal cover reduces conductive film growth in the wafer process region. As such, RF wafer biasing power from the pedestal assembly remains coupled through the substrate during processing.
    Type: Grant
    Filed: March 19, 2004
    Date of Patent: January 16, 2007
    Assignee: Applied Materials, Inc.
    Inventors: Bradley O. Stimson, Mitsuhiro Kaburaki, John C. Forster, Eric Delaurentis, Praburam Gopalraja, Patricia Rodriguez, Anantha Subramani
  • Process kit for improved power coupling through a workpiece in a semiconductor wafer processing system
    Publication number: 20040173156
    Abstract: Apparatus for supporting a substrate such as a semiconductor wafer in a process chamber to improve power coupling through the substrate. The apparatus contains a pedestal assembly and a pedestal cover positioned over the top surface of and circumscribing the pedestal assembly for electrically isolating the pedestal assembly. The pedestal cover reduces conductive film growth in the wafer process region. As such, RF wafer biasing power from the pedestal assembly remains coupled through the substrate during processing.
    Type: Application
    Filed: March 19, 2004
    Publication date: September 9, 2004
    Inventors: Bradley O. Stimson, Mitsuhiro Kaburaki, John C. Forster, Eric Delaurentis, Praburam Gopalraja, Patricia Rodriguez, Anantha Subramani
  • Coil and coil support for generating a plasma
    Publication number: 20040118521
    Abstract: A coil has an integral fastener portion to facilitate fastening the coil to a shield wall to reduce generation of particulates.
    Type: Application
    Filed: December 10, 2003
    Publication date: June 24, 2004
    Applicant: Applied Materials, Inc.
    Inventors: Ian A. Pancham, Michael Rosenstein, Leif Eric DeLaurentis, Allen K. Lau, Praburam Gopalraja, James Van Gogh
  • Apparatus for improved power coupling through a workpiece in a semiconductor wafer processing system
    Patent number: 6723214
    Abstract: Apparatus for supporting a substrate such as a semiconductor wafer in a process chamber to improve power coupling through the substrate. The apparatus contains a pedestal assembly and a pedestal cover positioned over the top surface of and circumscribing the pedestal assembly for electrically isolating the pedestal assembly. The pedestal cover reduces conductive film growth in the wafer process region. As such, RF wafer biasing power from the pedestal assembly remains coupled through the substrate during processing.
    Type: Grant
    Filed: January 2, 2002
    Date of Patent: April 20, 2004
    Assignee: Applied Materials, Inc.
    Inventors: Bradley O. Stimson, Mitsuhiro Kaburaki, John C. Forster, Eric Delaurentis, Praburam Gopalraja, Patricia Rodriguez, Anantha Subramani
  • Apparatus for improved power coupling through a workpiece in a semiconductor waffer processing system
    Publication number: 20020053513
    Abstract: Apparatus for supporting a substrate such as a semiconductor wafer in a process chamber to improve power coupling through the substrate. The apparatus contains a pedestal assembly and a pedestal cover positioned over the top surface of and circumscribing the pedestal assembly for electrically isolating the pedestal assembly. The pedestal cover reduces conductive film growth in the wafer process region. As such, RF wafer biasing power from the pedestal assembly remains coupled through the substrate during processing.
    Type: Application
    Filed: January 2, 2002
    Publication date: May 9, 2002
    Inventors: Bradley O. Stimson, Mitsuhiro Kaburaki, John C. Forster, Eric Delaurentis, Praburam Gopalraja, Patricia Rodriguez, Anantha Subramani
  • Sputter magnetron having two rotation diameters
    Patent number: 6228236
    Abstract: A magnetron for use in a DC magnetron sputtering reactor that can rotate at a smaller diameter during a deposition phase and at a larger diameter during a cleaning phase, whereby sputter material redeposited outside of the deposition sputtering track is removed during the cleaning phase. An embodiment for a two-diameter magnetron includes a swing arm fixed on one end to the magnetron rotation motor shaft and on the other end to a pivot shaft, pivotably coupled to the magnetron. When the magnetron is rotated in different directions, hydrodynamic forces between the magnetron and the chilling water bath cause magnetron to pivot about the pivot shaft. Two mechanical detents fix the limits of the pivoting and hence establish the two diameters of rotation.
    Type: Grant
    Filed: October 22, 1999
    Date of Patent: May 8, 2001
    Assignee: Applied Materials, Inc.
    Inventors: Michael Rosenstein, Jianming Fu, Leif Eric Delaurentis, James van Gogh, Alan Liu