Abstract: This disclosure relates to methods and systems for inhibiting precursor interactions during radical-enhanced atomic layer deposition. A substrate may be completely exposed to a precursor gas. Meanwhile, a gaseous radical species is directed through a shroud towards the substrate. The gaseous radical species flows through the shroud under sufficient flow and pressure conditions to substantially prevent the precursor gas from flowing into the shroud. The shroud can be alternately positioned over selected regions of the substrate to thereby alternately expose the selected regions of the substrate to the radical species and the precursor gas multiple times. A thin film of reaction product is formed in the selected regions of the substrate and not on undesired surfaces.

Abstract: This disclosure relates to methods for depositing metal-fluoride thin films. In particular, process steps, precursors, and conditions are discussed herein for the formation of ionic metal-fluoride thin films. Barrier films composed of ionic metal-fluoride thin films are also discussed herein.

Abstract: This disclosure relates to methods and systems for selective atomic layer deposition. Cycle-by-cycle post-processing of the thin film occurs during growth of the thin film, instead of conducting post-processing after completion of the thin film. Thin films with improved properties result.

Abstract: This disclosure relates to methods and systems for selective atomic layer deposition. A substrate may be completely exposed to a precursor gas. Meanwhile, a localized energy scans the substrate. Methods and systems are disclosed herein for either directing the precursor gas away from the selected regions or limiting reactivity of the precursor gas outside of the selected regions. A thin film of reaction product is formed in the selected regions of the substrate and not on undesired surfaces.

Abstract: This disclosure relates to methods and systems for inhibiting precursor interactions during radical-enhanced atomic layer deposition. A substrate may be completely exposed to a precursor gas. Meanwhile, a gaseous radical species is directed through a shroud towards the substrate. The gaseous radical species flows through the shroud under sufficient flow and pressure conditions to substantially prevent the precursor gas from flowing into the shroud. The shroud can be alternately positioned over selected regions of the substrate to thereby alternately expose the selected regions of the substrate to the radical species and the precursor gas multiple times. A thin film of reaction product is formed in the selected regions of the substrate and not on undesired surfaces.

Abstract: An iridium encased copper interconnect comprises an iridium liner formed within a trench in a dielectric layer, wherein the iridium liner is formed directly on the dielectric layer, a copper interconnect formed on the iridium liner, and an iridium capping layer formed on the copper interconnect. The iridium encased copper interconnect may be fabricated by providing a semiconductor substrate in a reactor, wherein the semiconductor substrate includes a trench etched into a dielectric layer, pulsing trimethylaluminum into the reactor proximate to the semiconductor substrate, pulsing an iridium precursor into the reactor proximate to the semiconductor substrate, wherein the trimethylaluminum enables an iridium species to deposit directly on the dielectric layer, depositing a copper seed layer on the iridium species layer using an electroless deposition process, and depositing a bulk copper layer on the copper seed layer using an electroplating process.

Abstract: Systems and methods for atomic layer deposition (ALD) on a flexible substrate involve guiding the substrate back and forth between spaced-apart first and second precursor zones, so that the substrate transits through each of the precursor zones multiple times. Systems may include a series of turning guides, such as rollers, spaced apart along the precursor zones for supporting the substrate along an undulating transport path. As the substrate traverses back and forth between precursor zones, it passes through a series of flow-restricting passageways of an isolation zone into which an inert gas is injected to inhibit migration of precursor gases out of the precursor zones. Also disclosed are systems and methods for utilizing more than two precursor chemicals and for recycling precursor gases exhausted from the precursor zones.

Abstract: A panel is provided for construction of a fence and for connection to a similar panel in interlocking relationship. The panel includes a receiver, a mounting portion and a side wall. The side wall is disposed between the receiver and the mounting portion wherein the receiver of a first panel is interlocked with the mounting portion of a second panel. The rounded features of the mounting portion facilitate insertion into the receiver forcing the receiver to expand beyond its original dimension. Once inserted a base leg of the receiver and a flange of the mounting portion remain in biased contact forcing the shoulder of the mounting portion into contact with the contact wall of the receiver and effectively interlocking the two panel members and thereby limiting lateral movement.

Abstract: Methods are provided for production of optical filters that include alternating exposures of a surface of a substrate to two or more precursors that combine to form a sublayer on the surface. A measurement light flux is provided to measure an optical property of the sublayer or an assemblage of sublayers. Based on the measurement, the number of sublayers is selected to produce an optical filter, such as a Fabry-Perot filter, having predetermined properties.

Abstract: An apparatus and method for connecting simulator instruments to a simulator host computer includes a plurality of panel modules, a data bus having a connection to each panel module, and a control computer connected to the data bus and to the host computer. Each panel module further comprises at least one simulated instrument and a local computer. The local computer runs a computer program adapted to the instrument or instruments controlled by that panel module, so that the local computer communicates with the data bus for bi-directional communication between the instrument and the control computer. Each panel module has a unique address on the data bus.

Abstract: An apparatus and method for connecting simulator instruments to a simulator host computer includes a plurality of panel modules, a data bus having a connection to each panel module, and a control computer connected to the data bus and to the host computer. Each panel module further comprises at least one simulated instrument and a local computer. The local computer runs a computer program is adapted to the instrument or instruments controlled by that panel module, so that the local computer communicates with the data bus for bi-directional communication between the instrument and the control computer. Each panel module has a unique address on the data bus.

Abstract: a siding panel is provided for attachment to a structure and connection to a similar overlapping siding panel in interlocking relationship. The panel includes a strip for attachment, such as by nailing, to a supporting structure, a receiver formed by outer and inner bends, at least one stretch extending away from the strip and presenting a gap between the outer bend and the stretch, a base and a projection, all extending the length of the panel. The projection is configured to interfit with a receiver of an adjacent panel, with the projection including a flange, a return bend and a cantilever leg. The projection snap fits into the receiver, with the cantilever leg deflecting as the return bend flexes to permit passage of the projection into the receiver.