Patents by Inventor Eric E. Bourchard

Eric E. Bourchard has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8162199
    Abstract: An apparatus for the removal of excess solder or contaminant, which are encountered on the surfaces of injection mold prior to the transfer of a solder on a silicon wafer. More particularly, there is provided an apparatus for the removal of excess solder, which may be present on a mold surface, without removing any solder, which is located in cavities formed in the mold, and wherein the solder is applied through an injection molded soldering process.
    Type: Grant
    Filed: August 12, 2009
    Date of Patent: April 24, 2012
    Assignee: International Business Machines Corporation
    Inventors: Eric E. Bourchard, Guy Brouillette, David H. Danovitch, Peter A. Gruber, Jean-Luc Landreville