Abstract: A method for processing brewery waste that includes receiving spent grain, low strength wastewater and high strength wastewater. The spent grain, low strength wastewater and high strength wastewater is processed with a plug flow anaerobic digester to produce a first output. A portion of the first output is processed with an upflow anaerobic sludge blanket digester to produce a second output. A portion of the second output is processed with a fixed-film anaerobic digester to produce a third output.

Abstract: A method for processing brewery waste that includes receiving spent grain, low strength wastewater and high strength wastewater. The spent grain, low strength wastewater and high strength wastewater is processed with a plug flow anaerobic digester to produce a first output. A portion of the first output is processed with an upflow anaerobic sludge blanket digester to produce a second output. A portion of the second output is processed with a fixed-film anaerobic digester to produce a third output.

Abstract: A detector system for a fiber optic component is insensitive to stray light. Specifically, the invention comprises a detector chip, which converts received light into an electric signal. A baffle substrate is positioned over the detector chip. This baffle substrate has a transmission port through which an optical signal is transmitted to the detector chip. As a result, light that is not directed to be transmitted through the port is blocked by the baffle substrate. In this way, it rejects stray light that may be present in the hermetic package. A detector substrate is provided on which the detector chip is mounted. This detector substrate preferably comprises electrical traces to which the detector chip is electrically connected. The detector substrate can further comprise bond pads for wire bonding to make electrical connections to the electrical traces.

Abstract: A detector system for a fiber optic component is insensitive to stray light. Specifically, the invention comprises a detector chip, which converts received light into an electric signal. A baffle substrate is positioned over the detector chip. This baffle substrate has a transmission port through which an optical signal is transmitted to the detector chip. As a result, light that is not directed to be transmitted through the port is blocked by the baffle substrate. In this way, it rejects stray light that may be present in the hermetic package. A detector substrate is provided on which the detector chip is mounted. This detector substrate preferably comprises electrical traces to which the detector chip is electrically connected. The detector substrate can further comprise bond pads for wire bonding to make electrical connections to the electrical traces.

Abstract: A process for assembling micro-optical systems, such as optoelectronic and/or fiber optic components uses solder self-alignment to achieve a coarse, passive alignment of optical components relative to the optical bench. The fine, final alignment is performed using plastic deformation of the optical components to thereby improve the alignment of the optical components. As a result, the sub-micrometer alignment accuracies are attainable, if required.

Abstract: A process for assembling micro-optical systems, such as optoelectronic and/or fiber optic components uses solder self-alignment to achieve a coarse, passive alignment of optical components relative to the optical bench. The fine, final alignment is performed using plastic deformation of the optical components to thereby improve the alignment of the optical components. As a result, the sub-micrometer alignment accuracies are attainable, if required.

Abstract: An assembly fixture for optical benches comprises a jig base, having at least one blind hole. The jig base is formed with a surface that is a non-wetting to solder material. The blind hole is shaped and sized in response to dimensions of the optical bench. The fixture further comprises a bench jig shroud. This shroud at least partially covers optical benches installed in the blind holes. Preferably, previsions are made in the top of the jig base at the interface with the jig shroud to facilitate its stable placement on the base.

Abstract: A process for assembling micro-optical systems, such as optoelectronic and/or fiber optic components uses solder self-alignment to achieve a coarse, passive alignment of optical components relative to the optical bench. The fine, final alignment is performed using plastic deformation of the optical components to thereby improve the alignment of the optical components. As a result, the sub-micrometer alignment accuracies are attainable, if required.