Abstract: Disclosed herein is a touch sensor panel including a substrate, a plurality of conductive layers including a first conductive layer and a second conductive layer, a plurality of vias from the first conductive layer to the second conductive layer, and control circuitry mounted to a printed circuit. The control circuitry can include touch sensing circuitry. The first conductive layer can include a plurality of touch electrodes. The second conductive layer can be separated from the substrate by at least the first conductive layer and can include a bonding region with a plurality of bond pads for interconnection with the plurality of touch electrodes. The printed circuit can be separated from the substrate by at least the plurality of conductive layers and can be bonded to the plurality of bond pads by a conductive bonding material between the second conductive layer and the printed circuit.

Abstract: Disclosed herein is a touch sensor panel including a substrate, a plurality of conductive layers including a first conductive layer and a second conductive layer, a plurality of vias from the first conductive layer to the second conductive layer, and control circuitry mounted to a printed circuit. The control circuitry can include touch sensing circuitry. The first conductive layer can include a plurality of touch electrodes. The second conductive layer can be separated from the substrate by at least the first conductive layer and can include a bonding region with a plurality of bond pads for interconnection with the plurality of touch electrodes. The printed circuit can be separated from the substrate by at least the plurality of conductive layers and can be bonded to the plurality of bond pads by a conductive bonding material between the second conductive layer and the printed circuit.