Abstract: Illustrative embodiments of reconfigurable microwave filters, as well as associated systems and methods, are disclosed. In at least one illustrative embodiment, a reconfigurable microwave filter may comprise a plurality of cavity resonators on a common substrate and a plurality of control circuits each configured to control a resonant frequency of one of the plurality of cavity resonators. The reconfigurable microwave filter may also comprise a plurality of feedback circuits each configured to generate a feedback signal that is indicative of the resonant frequency of one of the plurality of cavity resonators and to transmit the feedback signal to one of the plurality of control circuits.

Abstract: Illustrative embodiments of reconfigurable microwave filters, as well as associated systems and methods, are disclosed. In at least one illustrative embodiment, a reconfigurable microwave filter may comprise a plurality of cavity resonators on a common substrate and a plurality of control circuits each configured to control a resonant frequency of one of the plurality of cavity resonators. The reconfigurable microwave filter may also comprise a plurality of feedback circuits each configured to generate a feedback signal that is indicative of the resonant frequency of one of the plurality of cavity resonators and to transmit the feedback signal to one of the plurality of control circuits.

Abstract: An embedded capacitor method and system is provided for printed circuit boards. The capacitor structure is embedded within an insulator substrate, minimizes real-estate usage, provides a high capacitance, enhances capacitance density, and yet forms an advantageous planar surface topography. A cavity is defined within and contained by an insulator substrate layer, and a dielectric material at least partially fills the cavity. The dielectric material is connected to an electrical conductor, and vias are used for interconnections and traces. In an aspect, a plurality of stacked insulator substrate layers define a plurality of cavities filled with the dielectric material, providing even greater capacitance. In another aspect, an array of cavities is formed in the insulator substrate layer.