Abstract: Land grid array (LGA) sockets with low-profile housings and stamped cylindrical pins are disclosed. Each pin includes a top contact portion, a bottom contact portion, and a serpentine spring portion that compresses along the vertical axis. In some embodiments, a bent electrically conductive strip provides a shorter electrical path to support high-speed data transmission. In other embodiments, the pin comprises a stub that contacts a pin hole plating layer to provide a shorter electrical path. The pins may be formed from beryllium copper and plated with palladium-gold. The socket housing, formed from printed circuit board laminate layers, defines cavities that receive and constrain the pins to limit movement and prevent damage. Localized ground and power structures, including plated-through holes and shielding vias, reduce crosstalk. The low-profile socket designs enhance signal and power integrity while enabling cost-effective manufacturability through progressive stamping and laminate-based assembly.

Abstract: Improved semiconductor chip package thermo-mechanical cooling assembly are disclosed. An example An apparatus includes: a bolster plate to be coupled to a back plate, the bolster plate and backplate to sandwich a circuit board therebetween; a loading plate including a first fixture, the first fixture to engage a load stud protruding from the bolster plate; and a heat sink base including a second fixture, the second fixture to engage a pin protruding from the loading plate.

Abstract: Methods, apparatus, systems, and articles of manufacture to increase stacking pressure in battery cells are disclosed. A disclosed battery includes an anode layer and a cathode layer stacked with the anode layer. The disclosed battery further includes a tension bearing structure to extend through at least one of the anode layer or the cathode layer.

Abstract: An apparatus is described. The apparatus includes a back plate. The apparatus includes a bolster plate that is secured to the back plate with a back bolt. The bolster plate has a window. The apparatus includes a circuit board between the back plate and the bolster plate. A semiconductor chip package is electro-mechanically coupled to the circuit board within the window. The apparatus includes a load stud that emanates from a face of the bolster plate. The back bolt emanates from an opposite face of the bolster plate. The load stud and back bolt are oriented along a same axis that is orthogonal to the face and the opposite face. The apparatus includes a heat sink. The apparatus includes a loading plate. The heat sink is mounted to the loading plate. The loading plate has a fixturing element that is secured to the load stud to secure the loading plate to the bolster plate.

Abstract: Embodiments disclosed herein include a liquid metal interposer. In an embodiment, the liquid metal interposer comprises a substrate with a first opening in the substrate and a second opening in the substrate. In an embodiment, a channel is between the first opening and the second opening. In an embodiment, the channel fluidically couples the first opening to the second opening.

Abstract: Embodiments described herein include a liquid metal carrier. In an embodiment, the liquid metal carrier includes a substrate that is a polymer. In an embodiment, a first opening is provided through the substrate with a first shape, and a second opening is provided through the substrate with a second shape. In an embodiment, the first shape is different than the second shape.

Abstract: An electronic device (100, 800, 1000) and associated methods are disclosed. In one example, the electronic device (100, 800, 1000) includes an interconnect socket (102, 302, 402, 802, 1004, 1320, 1402, 1506) that includes a liquid metal. In selected examples, the interconnect socket (102, 302, 402) includes a resilient material spacer (130, 230, 330, 430) located between pins (110, 210, 310, 410) in an array of pins (110, 210, 310, 410). In selected examples, the electronic device (1000) includes configurations to aid in de-socketing.

Abstract: A multi-entry socket power delivery structure is attachable to a printed circuit board to provide improved delivery of one or more power supply signals to a socket. The power delivery structure provides an additional path for power supply signals to be delivered to a socket (in addition to the “power corridor” of the printed circuit board). The power delivery structure comprises one or more portions, with individual portions comprising a printed circuit board connection portion that attaches to the printed circuit board to receive a power supply signal generated by a voltage regulator, and a socket connection portion that attaches to the printed circuit board to deliver the power supply signal to the socket via the printed circuit board. The power delivery structure can be located in the recess of a reinforced backplate that provides structural integrity to a processor stack and associated thermal management solution loading mechanism.

Abstract: Methods, apparatus, systems, and articles of manufacture to increase stacking pressure in battery cells are disclosed. A disclosed battery includes an anode layer and a cathode layer stacked with the anode layer. The disclosed battery further includes a tension bearing structure to extend through at least one of the anode layer or the cathode layer.

Abstract: An apparatus is described. The apparatus includes a back plate. The apparatus includes a bolster plate that is secured to the back plate with a back bolt. The bolster plate has a window. The apparatus includes a circuit board between the back plate and the bolster plate. A semiconductor chip package is electro-mechanically coupled to the circuit board within the window. The apparatus includes a load stud that emanates from a face of the bolster plate. The back bolt emanates from an opposite face of the bolster plate. The load stud and back bolt are oriented along a same axis that is orthogonal to the face and the opposite face. The apparatus includes a heat sink. The apparatus includes a loading plate. The heat sink is mounted to the loading plate. The loading plate has a fixturing element that is secured to the load stud to secure the loading plate to the bolster plate.

Abstract: A method of forming a dual chamber seamless tube (64) includes providing a slug of steel (56) and cold working a first end (70) of the slug (56) to form a first chamber (114) and cold working a second end (72) of the slug (56) to form a second chamber (116). The first and second chambers (114 and 116) are axially aligned and separated by a wall portion (126) of the tube (64).

Abstract: An apparatus includes a low-carbon steel member. The low-carbon steel member yields plastically more than about 5% before fracturing at temperatures down to about ?40° C. when stress is applied to the low-carbon steel member sufficient to cause the low-carbon steel member to so yield.