Patents by Inventor Eric Eubank

Eric Eubank has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of creating multi-layered monolithic circuit structure containing integral buried and trimmed components
    Publication number: 20050208706
    Abstract: A method of creating a multi-layered monolithic circuit structure wherein individual layers of standard alumina thick film ceramic substrate and the resistors, inductors, capacitors, and other circuit componentry printed thereon are fired, and the circuit componentry trimmed or otherwise adjusted to achieve a desired degree of precision prior to combining the layers with a thick film glass bonding agent to form the monolithic structure.
    Type: Application
    Filed: March 17, 2004
    Publication date: September 22, 2005
    Inventors: Roy Blazek, Gregory Barner, Sam Bandler, Eric Eubank, Fernando Uribe, Patrick Smith