Abstract: Systems and methods are disclosed in which a playback device transmits a first sound signal including a predetermined waveform. In one example, the playback device receives a second sound signal including at least one reflection of the first sound signal. The second sound signal is processed to determine a location of a person relative to the playback device, and a characteristic of audio reproduction by the playback device is selected, based on the determined location of the person.

Abstract: Systems and methods are disclosed in which a playback device transmits a first sound signal including a predetermined waveform. In one example, the playback device receives a second sound signal including at least one reflection of the first sound signal. The second sound signal is processed to determine a location of a person relative to the playback device, and a characteristic of audio reproduction by the playback device is selected, based on the determined location of the person.

Abstract: Methods and systems for low-force, low-temperature thermocompression bonding. The present application teaches new methods and structures for three-dimensional integrated circuits, in which cold thermocompression bonding is used to provide reliable bonding. To achieve this, reduction and passivation steps are preferably both used to reduce native oxide on the contact metals and to prevent reformation of native oxide, preferably using atmospheric plasma treatments. Preferably the physical compression height of the elements is set to be only enough to reliably achieve at least some compression of each bonding element pair, compensating for any lack of flatness. Preferably the thermocompression bonding is performed well below the melting point. This not only avoids the deformation of lower levels which is induced by reflow techniques, but also provides a steep relation of force versus z-axis travel, so that a drastically-increasing resistance to compression helps to regulate the degree of thermocompression.

Abstract: Methods and systems for low-force, low-temperature thermocompression bonding. The present application teaches new methods and structures for three-dimensional integrated circuits, in which cold thermocompression bonding is used to provide reliable bonding. To achieve this, reduction and passivation steps are preferably both used to reduce native oxide on the contact metals and to prevent reformation of native oxide, preferably using atmospheric plasma treatments. Preferably the physical compression height of the elements is set to be only enough to reliably achieve at least some compression of each bonding element pair, compensating for any lack of flatness. Preferably the thermocompression bonding is performed well below the melting point. This not only avoids the deformation of lower levels which is induced by reflow techniques, but also provides a steep relation of force versus z-axis travel, so that a drastically-increasing resistance to compression helps to regulate the degree of thermocompression.

Abstract: Methods and systems for low-force, low-temperature thermocompression bonding. The present application teaches new methods and structures for three-dimensional integrated circuits, in which cold thermocompression bonding is used to provide reliable bonding. To achieve this, reduction and passivation steps are preferably both used to reduce native oxide on the contact metals and to prevent reformation of native oxide, preferably using atmospheric plasma treatments. Preferably the physical compression height of the elements is set to be only enough to reliably achieve at least some compression of each bonding element pair, compensating for any lack of flatness. Preferably the thermocompression bonding is performed well below the melting point. This not only avoids the deformation of lower levels which is induced by reflow techniques, but also provides a steep relation of force versus z-axis travel, so that a drastically-increasing resistance to compression helps to regulate the degree of thermocompression.

Abstract: Methods and systems for low-force, low-temperature thermocompression bonding. The present application teaches new methods and structures for three-dimensional integrated circuits, in which cold thermocompression bonding is used to provide reliable bonding. To achieve this, reduction and passivation steps are preferably both used to reduce native oxide on the contact metals and to prevent reformation of native oxide, preferably using atmospheric plasma treatments. Preferably the physical compression height of the elements is set to be only enough to reliably achieve at least some compression of each bonding element pair, compensating for any lack of flatness. Preferably the thermocompression bonding is performed well below the melting point. This not only avoids the deformation of lower levels which is induced by reflow techniques, but also provides a steep relation of force versus z-axis travel, so that a drastically-increasing resistance to compression helps to regulate the degree of thermocompression.

Abstract: Methods and systems for low-force, low-temperature thermocompression bonding. The present application teaches new methods and structures for three-dimensional integrated circuits, in which cold thermocompression bonding is used to provide reliable bonding. To achieve this, reduction and passivation steps are preferably both used to reduce native oxide on the contact metals and to prevent reformation of native oxide, preferably using atmospheric plasma treatments. Preferably the physical compression height of the elements is set to be only enough to reliably achieve at least some compression of each bonding element pair, compensating for any lack of flatness. Preferably the thermocompression bonding is performed well below the melting point. This not only avoids the deformation of lower levels which is induced by reflow techniques, but also provides a steep relation of force versus z-axis travel, so that a drastically-increasing resistance to compression helps to regulate the degree of thermocompression.

Abstract: Methods and systems for low-force, low-temperature thermocompression bonding. The present application teaches new methods and structures for three-dimensional integrated circuits, in which cold thermocompression bonding is used to provide reliable bonding. To achieve this, reduction and passivation steps are preferably both used to reduce native oxide on the contact metals and to prevent reformation of native oxide, preferably using atmospheric plasma treatments. Preferably the physical compression height of the elements is set to be only enough to reliably achieve at least some compression of each bonding element pair, compensating for any lack of flatness. Preferably the thermocompression bonding is performed well below the melting point. This not only avoids the deformation of lower levels which is induced by reflow techniques, but also provides a steep relation of force versus z-axis travel, so that a drastically-increasing resistance to compression helps to regulate the degree of thermocompression.

Abstract: Methods and systems for low-force, low-temperature thermocompression bonding. The present application teaches new methods and structures for three-dimensional integrated circuits, in which cold thermocompression bonding is used to provide reliable bonding. To achieve this, reduction and passivation steps are preferably both used to reduce native oxide on the contact metals and to prevent reformation of native oxide, preferably using atmospheric plasma treatments. Preferably the physical compression height of the elements is set to be only enough to reliably achieve at least some compression of each bonding element pair, compensating for any lack of flatness. Preferably the thermocompression bonding is performed well below the melting point. This not only avoids the deformation of lower levels which is induced by reflow techniques, but also provides a steep relation of force versus z-axis travel, so that a drastically-increasing resistance to compression helps to regulate the degree of thermocompression.

Abstract: A collapsible enclosure and an insert, where the collapsible enclosure includes a body formed by a plurality of walls including a front, a back, a first side, a second side, a top, and a bottom wall coupled to one another to form an interior. Each wall includes at least one of a plurality of deformable frame members. A door is defined in one of the front, back, first side, and second side wall, and is further selectively engageable with the respective wall such that the door is disposable between an open and closed position. The insert includes a body formed by a plurality of walls including a front, a back, a first side, and a second side coupled to one another to form an interior. Each wall includes at least one of a plurality of deformable frame members. A door is defined in one of the front, back, first side, and second side wall, and is further selectively engageable with the respective wall such that the door is disposable between an open and closed position.

Abstract: A vehicle includes a transmission having a plurality of friction elements selectively engageable to establish power flow paths within the transmission. A controller of the vehicle is programmed to, during a boost phase of a shift, command a first hydraulic boost pressure for a plurality of control loop cycles to an oncoming one of the friction elements (oncoming friction element) and subsequently command a second hydraulic boost pressure less than the first hydraulic boost pressure for only a single control loop cycle that defines an end of the boost phase to the oncoming friction element.

Abstract: Methods and systems for using the downstream active residuals of a reducing-chemistry atmospheric plasma to provide multiple advantages to pre-plating surface preparation with a simple apparatus. As the downstream active species of the atmospheric plasma impinge the substrate surface, three important surface preparation processes can be performed simultaneously: 1. Organic residue is removed from the surface of the plating base. 2. Oxidation is removed from the surface of the plating base. 3. All surfaces on the substrate are highly activated by the downstream active residuals thus creating a highly wettable surface for subsequent plating operations.

Abstract: A system and method for facilitating dictionary migration or dictionary mapping from a first vocabulary or a first dictionary of terms to a second vocabulary includes one or more computers configured to carry out the steps of mapping a subset of the first set of terms to respective terms in an interface terminology and flagging another subset as not mapped to respective terms in the interface terminology. The system then may provide suggested mappings for the non-mapped terms, relying on user-supplied indications in order to map those terms. The system and method also may map the first dictionary terms to a reference terminology, an administrative terminology, or a clinical terminology or, conversely, may use those external terminologies to assist in mapping to the interface terminology.

Abstract: Disclosed herein are novel personal pop-up pods designed for a single user. The personal pop-up pods can provide a user with privacy and/or protection from the surrounding elements. The personal pop-up pods are designed such that a user can remain mobile, i.e., able to move from one location to another while using a personal pop-up pod. The personal pop-up pods are designed such that a user can selectively gain access to the area surrounding the pop-up pod by opening windows and other points of access.

Abstract: Systems and methods are disclosed in which a playback device transmits a first sound signal including a predetermined waveform. In one example, the playback device receives a second sound signal including at least one reflection of the first sound signal. The second sound signal is processed to determine a location of a person relative to the playback device, and a characteristic of audio reproduction by the playback device is selected, based on the determined location of the person.

Abstract: A vehicle includes a transmission having a plurality of friction elements selectively engageable to establish power flow paths within the transmission. A controller of the vehicle is programmed to, during a boost phase of a shift, command a first hydraulic boost pressure for a plurality of control loop cycles to an oncoming one of the friction elements (oncoming friction element) and subsequently command a second hydraulic boost pressure less than the first hydraulic boost pressure for only a single control loop cycle that defines an end of the boost phase to the oncoming friction element.

Abstract: Systems and methods are disclosed in which a playback device transmits a first sound signal including a predetermined waveform. In one example, the playback device receives a second sound signal including at least one reflection of the first sound signal. The second sound signal is processed to determine a location of a person relative to the playback device, and a characteristic of audio reproduction by the playback device is selected, based on the determined location of the person.

Abstract: Methods and systems for using the downstream active residuals of a reducing-chemistry atmospheric plasma to provide multiple advantages to pre-plating surface preparation with a simple apparatus. As the downstream active species of the atmospheric plasma impinge the substrate surface, three important surface preparation processes can be performed simultaneously: 1. Organic residue is removed from the surface of the plating base. 2. Oxidation is removed from the surface of the plating base. 3. All surfaces on the substrate are highly activated by the downstream active residuals thus creating a highly wettable surface for subsequent plating operations.

Abstract: An atmospheric pressure plasma system includes an atmospheric pressure plasma source that generates a glow discharge-type plasma. The atmospheric pressure plasma source comprises a plasma head, a heating element and an active cooling element and the heating element and active cooling element control the plasma head temperature to a set-point temperature independent of variations in plasma generating power or plasma power ON/OFF status.

Abstract: A collapsible enclosure and an insert, where the collapsible enclosure includes a body formed by a plurality of walls including a front, a back, a first side, a second side, a top, and a bottom wall coupled to one another to form an interior. Each wall includes at least one of a plurality of deformable frame members. A door is defined in one of the front, back, first side, and second side wall, and is further selectively engageable with the respective wall such that the door is disposable between an open and closed position. The insert includes a body formed by a plurality of walls including a front, a back, a first side, and a second side coupled to one another to form an interior. Each wall includes at least one of a plurality of deformable frame members. A door is defined in one of the front, back, first side, and second side wall, and is further selectively engageable with the respective wall such that the door is disposable between an open and closed position.