Abstract: A precision alignment unit and techniques are described that include a tray assembly configured to be used in a testing system, where the tray assembly includes at least one pocket formed in the tray assembly, the pocket configured to contain an integrated circuit chip, and at least one pin pass-through, and a device positioning unit including at least one alignment device configured to extend through the at least one pin pass-through. In implementations, a process for using the precision alignment system that employs the techniques of the present disclosure includes mounting a precision alignment unit to a vacuum chuck of a handler; loading at least one alignment tray into the handler; placing the at least one alignment tray on the precision alignment unit; and aligning at least one integrated circuit chip device disposed on the at least one alignment tray.

Abstract: Techniques are described to provide a universal direct docking tester to prober interface between the test head and a prober of semiconductor wafer prober for testing die within semiconductor wafers. In an implementation, a universal direct docking tester to prober interface includes a tray assembly configured to be mounted within an opening of the prober housing and a stiffener assembly configured to be mounted to a test head to support a load board PCB that includes a probe head. The stiffener assembly includes a skirt that is received in the tray assembly when the test head is interfaced with the prober to position the load board PCB within the prober to facilitate engagement of the probe head with the wafer.

Abstract: A precision alignment unit and techniques are described that include a tray assembly configured to be used in a testing system, where the tray assembly includes at least one pocket formed in the tray assembly, the pocket configured to contain an integrated circuit chip, and at least one pin pass-through, and a device positioning unit including at least one alignment device configured to extend through the at least one pin pass-through. In implementations, a process for using the precision alignment system that employs the techniques of the present disclosure includes mounting a precision alignment unit to a vacuum chuck of a handler; loading at least one alignment tray into the handler; placing the at least one alignment tray on the precision alignment unit; and aligning at least one integrated circuit chip device disposed on the at least one alignment tray.