Patents by Inventor Eric G. Larson

Eric G. Larson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200283619
    Abstract: An electronic device is described comprising an enclosure, wherein the enclosure comprises a cured epoxy resin composition comprising at least 50 volume % of electrically non-conductive thermally conductive inorganic particles, wherein the inorganic particles are selected from alumina, boron nitride, silicon carbide, alumina trihydrate and mixtures thereof. The enclosure may be a housing of a phone, laptop, or mouse. Alternatively, the enclosure maybe a case for an electronic device. Also described are epoxy resin compositions and a method of making an enclosure for an electronic device.
    Type: Application
    Filed: December 21, 2018
    Publication date: September 10, 2020
    Inventors: Brett A. Beiermann, John C. Clark, Eric G. Larson, Jeremy M. Higgins, Audrey S. Forticaux, Jay R. Lomeda, Wayne S. Mahoney, Scott B. Charles, Timothy D. Fletcher, Wendy L. Thompson, Kyle R. Schwartz
  • Publication number: 20200208020
    Abstract: A thermally curable adhesive film, a tape, and a method of making the tape, wherein the film includes: a crosslinked (meth)acrylate matrix; and a thermally curable, one-part epoxy/thiol resin composition incorporated within the crosslinked (meth)acrylate matrix; wherein the thermally curable, one-part epoxy/thiol resin composition comprises: an epoxy resin component comprising an epoxy resin having at least two epoxide groups per molecule; a thiol component comprising a polythiol compound having at least two thiol groups; a nitrogen-containing catalyst for the epoxy resin; and an organic acid.
    Type: Application
    Filed: September 14, 2018
    Publication date: July 2, 2020
    Inventors: Eric G. Larson, Michael A. Kropp, Matthew J. Kryger, Shijing Cheng
  • Patent number: 9773714
    Abstract: A semiconductor package resin composition of the present invention includes an epoxy resin, a curing agent, inorganic particles, nano-particles surface treated with a silane that contains a photopolymerizable functional group, and a photopolymerization initiator.
    Type: Grant
    Filed: July 28, 2015
    Date of Patent: September 26, 2017
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Kohichiro Kawate, Hiroko Akiyama, Naota Sugiyama, Brant U. Kolb, Eric G. Larson
  • Patent number: 9230873
    Abstract: A semiconductor package resin composition of the present invention includes an epoxy resin, a curing agent, inorganic particles, nano-particles surface treated with a silane that contains a photopolymerizable functional group, and a photopolymerization initiator.
    Type: Grant
    Filed: July 9, 2012
    Date of Patent: January 5, 2016
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Kohichiro Kawate, Hiroko Akiyama, Naota Sugiyama, Brant U. Kolb, Eric G. Larson
  • Publication number: 20150329740
    Abstract: A semiconductor package resin composition of the present invention includes an epoxy resin, a curing agent, inorganic particles, nano-particles surface treated with a silane that contains a photopolymerizable functional group, and a photopolymerization initiator.
    Type: Application
    Filed: July 28, 2015
    Publication date: November 19, 2015
    Inventors: Kohichiro Kawate, Hiroko Akiyama, Naota Sugiyama, Brant U. Kolb, Eric G. Larson
  • Patent number: 9056438
    Abstract: A curable composition includes polyepoxide, high-melting metal particles having a melting point above 300° C., low-melting metallic particles having a melting point of less than or equal to 300° C., and a fluxing curing agent comprising a fluxing curing agent comprising: a hydroxyalkyl-substituted tertiary amine, and at least one diacid compound represented by the formula: HO2C—Z1—CH2CH2CH2—Z2—CO2H wherein Z1 and Z2 independently represent a covalent bond or an aliphatic hydrocarbylene group. The at least one diacid compound comprises at least 50 percent of the total weight of carboxylic acids and anhydrides present in the curable composition. Articles comprising the curable composition, and methods of making the same are also disclosed.
    Type: Grant
    Filed: May 2, 2012
    Date of Patent: June 16, 2015
    Assignee: 3M Innovative Properties Company
    Inventor: Eric G. Larson
  • Publication number: 20150034238
    Abstract: A laminate body, method, and materials for temporary substrate support are provided. The laminate body can hold N and protect thin, brittle substrates such as flexible glass or thin semiconductor wafers during further processing such as vapor deposition or thinning by grinding. The provided laminate body, in one embodiment, includes a support, a release layer disposed upon the support, a joining layer disposed upon and in contact with the release layer, and a substrate disposed upon and in contact with the joining layer. The release layer can include an acrylic adhesive and an adhesion modifying agent.
    Type: Application
    Filed: March 6, 2013
    Publication date: February 5, 2015
    Inventors: Blake R. Dronen, Wayne S. Mahoney, Eric G. Larson
  • Publication number: 20150017434
    Abstract: A hybrid laminated body is provided that includes a light-transmitting support, a latent release layer disposed upon the light-transmitting support, a joining layer disposed upon the latent release layer, and a thermoplastic priming layer disposed upon the joining layer. The hybrid laminated body can further include a substrate to be processed such as, for example, a silicon wafer to be ground. Also provided is a method for manufacturing the provided laminated body.
    Type: Application
    Filed: January 24, 2013
    Publication date: January 15, 2015
    Inventors: Blake R. Dronen, Eric G. Larson
  • Publication number: 20140217622
    Abstract: A semiconductor package resin composition of the present invention includes an epoxy resin, a curing agent, inorganic particles, nano-particles surface treated with a silane that contains a photopolymerizable functional group, and a photopolymerization initiator.
    Type: Application
    Filed: July 9, 2012
    Publication date: August 7, 2014
    Inventors: Kohichiro Kawate, Hiroko Akiyama, Naota Sugiyama, Brant U. Kolb, Eric G. Larson
  • Publication number: 20130295311
    Abstract: A curable composition includes polyepoxide, high-melting metal particles having a melting point above 300° C., low-melting metallic particles having a melting point of less than or equal to 300° C., and a fluxing curing agent comprising a fluxing curing agent comprising: a hydroxyalkyl-substituted tertiary amine, and at least one diacid compound represented by the formula: HO2C—Z1—CH2CH2CH2—Z2—CO2H wherein Z1 and Z2 independently represent a covalent bond or an aliphatic hydrocarbylene group. The at least one diacid compound comprises at least 50 percent of the total weight of carboxylic acids and anhydrides present in the curable composition. Articles comprising the curable composition, and methods of making the same are also disclosed.
    Type: Application
    Filed: May 2, 2012
    Publication date: November 7, 2013
    Inventor: Eric G. Larson
  • Publication number: 20130084459
    Abstract: A curable adhesive composition is disclosed comprising: at least one free radically polymerizable oligomer component; optionally at least one diluent monomer; at least one perfluorinated ether monomer; and a photoinitiator. The curable liquid adhesive is easily removable with low force and low adhesive transfer.
    Type: Application
    Filed: September 30, 2011
    Publication date: April 4, 2013
    Inventors: Eric G. Larson, Blake R. Dronen, Miguel A. Guerra, Wayne S. Mahoney, Richard J. Webb
  • Patent number: 8308991
    Abstract: Provided are adhesive compositions comprising a mixture of a maleimide terminated polyimide resin, a thermoplastic resin compatible with the maleimide terminated polyimide resin, a liquid rubber, and a thermally activated free radical curing agent. Various embodiments add one or more of a silane coupling agent, an ethylenically unsaturated compound with acid functionality, electrically conductive particles, and electrically conductive scrim. Methods of using the compositions also are provided.
    Type: Grant
    Filed: September 9, 2008
    Date of Patent: November 13, 2012
    Assignee: 3M Innovative Properties Company
    Inventors: Eric G. Larson, Robert L. D. Zenner, Cameron T. Murray, Ravi K. Sura
  • Publication number: 20120034426
    Abstract: The present invention is an article useful in the field of wafer processing, for example. The article includes a substrate, a leveling layer, a joining layer, a photothermal conversion layer and a temporary carrier. The substrate has a first major surface, a second major surface and at least one three dimensional topographical feature extending from the first major surface and having an initial step height. The leveling layer is positioned adjacent to the first major surface and reduces a topography of the substrate to between about 5% and about 95% of the initial step height. The joining layer is positioned adjacent to the leveling layer and further reduces the topography of the substrate to less than about 20% of the initial step height. The photothermal conversion layer is positioned adjacent to the joining layer and the temporary carrier is positioned adjacent the photothermal conversion layer.
    Type: Application
    Filed: August 5, 2010
    Publication date: February 9, 2012
    Inventors: Richard J. Webb, Wayne S. Mahoney, Eric G. Larson
  • Patent number: 8022145
    Abstract: Provided is a single layer adhesive that provides the appropriate balance of adhesion and clean release required for a wafer dicing function and also provides the necessary bond required in a subsequent die attach step. The adhesive composition comprises an acrylate ester polymer having a functional group, a multi-functional thermosetting resin, wherein the acrylate ester polymer and the thermosetting resin are capable of reacting with each other, a multi-functional acrylate ester, an acrylate ester polymerization catalyst or curing agent, a thermally-latent catalyst suitable for curing the multi-functional thermosetting resin, and an acrylic acid salt.
    Type: Grant
    Filed: March 7, 2008
    Date of Patent: September 20, 2011
    Assignee: 3M Innovative Properties Company
    Inventors: Eric G. Larson, Michael A. Kropp, David J. Plaut, Cheryl L. Moore
  • Patent number: 8008783
    Abstract: Provided are a tape, apparatus, and method that relate generally to a single layer adhesive which functions as a dicing tape and also as a die attach adhesive for dicing thinned wafers and subsequent die attach operations of the diced chips in semiconductor device fabrication. The tape, apparatus, and method include a backing with a surface modification that includes a pattern.
    Type: Grant
    Filed: November 15, 2010
    Date of Patent: August 30, 2011
    Assignee: 3M Innovative Properties Company
    Inventors: David J. Plaut, Eric G. Larson, Joel A. Getschel, Olester Benson, Jr.
  • Publication number: 20110064948
    Abstract: Provided are a tape, apparatus, and method that relate generally to a single layer adhesive which functions as a dicing tape and also as a die attach adhesive for dicing thinned wafers and subsequent die attach operations of the diced chips in semiconductor device fabrication. The tape, apparatus, and method include a backing with a surface modification that includes a pattern.
    Type: Application
    Filed: November 15, 2010
    Publication date: March 17, 2011
    Inventors: David J. PLAUT, Eric G. Larson, Joel A. Getschel, Olester Benson, JR.
  • Patent number: 7858499
    Abstract: Provided are a tape, apparatus, and method that relate generally to a single layer adhesive which functions as a dicing tape and also as a die attach adhesive for dicing thinned wafers and subsequent die attach operations of the diced chips in semiconductor device fabrication. The tape, apparatus, and method include a backing with a surface modification that includes a pattern.
    Type: Grant
    Filed: March 6, 2009
    Date of Patent: December 28, 2010
    Assignee: 3M Innovative Properties Company
    Inventors: David J. Plaut, Eric G. Larson, Joel A. Getschel, Olester Benson, Jr.
  • Patent number: 7691475
    Abstract: Provided are adhesive compositions comprising a mixture of a maleimide terminated polyimide resin, a thermoplastic resin compatible with the maleimide terminated polyimide resin, a thermally activated free radical curing agent, and electrically conductive particles and/or scrim. Various embodiments add a silane coupling agent and/or an ethylenically unsaturated compound with acid functionality. Methods of using the compositions also are provided.
    Type: Grant
    Filed: July 21, 2006
    Date of Patent: April 6, 2010
    Assignee: 3M Innovative Properties Company
    Inventors: Eric G. Larson, Glen Connell
  • Publication number: 20100056725
    Abstract: Provided is a single layer adhesive that provides the appropriate balance of adhesion and clean release required for a wafer dicing function and also provides the necessary bond required in a subsequent die attach step. The adhesive composition comprises an acrylate ester polymer having a functional group, a multi-functional thermosetting resin, wherein the acrylate ester polymer and the thermosetting resin are capable of reacting with each other, a multi-functional acrylate ester, an acrylate ester polymerization catalyst or curing agent, a thermally-latent catalyst suitable for curing the multi-functional thermosetting resin, and an acrylic acid salt.
    Type: Application
    Filed: March 7, 2008
    Publication date: March 4, 2010
    Inventors: Eric G. Larson, Michael A. Kropp, David J. Plaut, Cheryl L. Moore
  • Publication number: 20090227089
    Abstract: Provided are a tape, apparatus, and method that relate generally to a single layer adhesive which functions as a dicing tape and also as a die attach adhesive for dicing thinned wafers and subsequent die attach operations of the diced chips in semiconductor device fabrication. The tape, apparatus, and method include a backing with a surface modification that includes a pattern.
    Type: Application
    Filed: March 6, 2009
    Publication date: September 10, 2009
    Inventors: David J. Plaut, Eric G. Larson, Joel A. Getschel, Olester Benson, JR.